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• Tower Semiconductor : TowerJazz, Cadence and Lumerical Deliver Silicon-Photonics and SiGe- Integrated PDK with a Complete Optical Transceiver Design Environment (Tuesday, July 9, 2019)
• Cadence Announces First-to-Market DisplayPort 2.0 Verification IP (Tuesday, June 25, 2019)
• Mentor's new Calibre Recon functionality methodically analyzes "early draft" IC designs for faster verification (Tuesday, May 28, 2019)
• Cadence Launches Protium X1, the First Scalable, Data Center-Optimized Enterprise Prototyping System for Early Software Development (Monday, May 27, 2019)
• Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores (Monday, May 13, 2019)
• eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip (Wednesday, May 8, 2019)
• SmartDV Heads to ChipEx2019 in Israel with Extensive Design and Verification IP Portfolio (Monday, May 6, 2019)
• Moortec Provide Embedded Monitoring Solutions for Arm's Neoverse N1 System Development Platform on TSMC 7nm Process Technology (Tuesday, April 30, 2019)
• Synopsys Announces Industry's First DDR5 NVDIMM-P Verification IP for Next-generation Storage-class Memory Designs (Tuesday, April 30, 2019)
• Moortec To Showcase Its PVT Monitoring IP At TSMC 2019 Boston Technology Workshop (Monday, April 29, 2019)
• Moortec to Showcase its PVT Monitoring IP at TSMC 2019 Technology Symposium (Tuesday, April 16, 2019)
• SmartDV's DVCon China Exhibit to Showcase Extensive Verification IP Portfolio (Tuesday, April 9, 2019)
• Cadence Eyes System Analysis Market (Monday, April 1, 2019)
• UltraSoC demonstrates advanced multicore debug at Embedded World 2019 (Monday, February 25, 2019)
• SmartDV Unveils SimXL Portfolio of Synthesizable Transactors for Hardware Emulation, FPGA Prototyping Platforms (Wednesday, February 13, 2019)
• Sankalp Semiconductor to Exhibit & Participate at IESA Vision Summit 2019 (Monday, February 11, 2019)
• SmartDV Supports RISC-V Movement with TileLink Verification IP for RISC-V Based Systems (Tuesday, February 5, 2019)
• Silvacos FastSPICE Simulator Selected by Kodenshi for Sensor Device Design (Monday, December 3, 2018)
• MicroBT employs Moortec's 16nm Embedded Temperature Sensor in their HPC ASIC (Wednesday, November 28, 2018)
• New Mentor Symphony platform addresses nanometer-scale SoC mixed-signal verification challenges (Tuesday, November 6, 2018)
• Cadence Custom/AMS Flow Certified on Samsung 7LPP Process Technology (Tuesday, October 23, 2018)
• Synopsys FineSim SPICE Cuts Analog Simulation Time by 3X (Monday, October 22, 2018)
• ISG Positions L&T Technology Services as Global Leader in the First Ever Service Provider Ranking on Product, Process and Platform Engineering (Thursday, October 18, 2018)
• Agnisys at DVCON Europe 2018: Presenting End-to-End Solution for Specification to Design and Verification of the Hardware/Software Interface (Monday, October 15, 2018)
• Everest Group Positions L&T Technology Services as a global 'Leader' in Embedded System Engineering Services (Monday, October 8, 2018)
• sureCore Opens Low-Power SRAM IP Customization Service (Monday, September 24, 2018)
• Faraday ASIC Service Leverages Samsung FinFET Platform to Target Next-generation Applications (Monday, August 27, 2018)
• Cadence Palladium Z1 Enterprise Emulation Platform Enables GUC to Accelerate SoC Design (Monday, August 13, 2018)
• EASii IC (France) becomes Arm Approved Design Partner (Thursday, July 19, 2018)
• HDL Design House Greece Joins HETIA (Monday, July 16, 2018)
• Inomize joins Arm Approved Design Partner program (Sunday, July 1, 2018)
• Decipher the Meaning of Silicon-as-a-Service (Tuesday, June 19, 2018)
• Baum Launches New Version of Power Modeling, Analysis Solutions for Hardware Design (Monday, June 11, 2018)
• Mobiveil and Avery Design Systems Partner to Provide SoC Designers a Fully Verified and Compliant PCIe 5.0 IP Solution (Tuesday, June 5, 2018)
• Sonics Partners With Synkom To Incorporate NoC and EPU IP Into Its Leading Semiconductor Design Services For Japan Customers (Tuesday, June 5, 2018)
• Flexera Provides Seamless Monetization Support for Arm Ecosystem (Tuesday, May 8, 2018)
• Silvaco Joins Arm Approved Design Partner Program (Monday, May 7, 2018)
• Cadence Innovus Implementation System Speeds Development of New Realtek DTV SoC Solution (Wednesday, May 2, 2018)
• Samsung Electronics Partners with Avnet ASIC Israel to Strengthen Customer Support at the Forefront of ASIC Design Services (Tuesday, May 1, 2018)
• Sondrel and NetSpeed Team Up to Deliver the Fastest, Lowest-risk Route to SoC Solutions (Monday, April 30, 2018)
• New Flexible SoC Solution from Arm to Enable Rapid Development of Secure IoT Devices (Monday, April 16, 2018)
• Synopsys Extends HAPS Prototyping Family with New Desktop Prototyping Solution (Monday, April 16, 2018)
• Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support down to 5nm, and Simulation-Driven Layout (Tuesday, April 10, 2018)
• CoreHW partners with GLOBALFOUNDRIES in RF Ecosystem Program (Wednesday, March 28, 2018)
• Microsemi Switchtec PCIe Gen 4 available (Thursday, March 22, 2018)
• Design tools for safety-relevant receive ISO26262 certification (Tuesday, March 20, 2018)
• Synopsys Enables Robust Design Optimization for Next-generation High-performance Computing, Mobile and Automotive Products with IC Compiler II and RedHawk Analysis Fusion (Monday, March 19, 2018)
• Synopsys Introduces Breakthrough Fusion Technology to Transform the RTL-to-GDSII Flow (Monday, March 19, 2018)
• Semiconductor Design Firms are Embracing the Public Cloud. Here are 5 Reasons Why. (Sunday, March 18, 2018)
• Matlab, Simulink get functions for autonomous driving and deep learning (Wednesday, March 14, 2018)