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• Agile Analog's Christelle Faucon: "Diversity and Equality Are Critical" (Sunday, March 3, 2024)
• ADTechnology and CoSignOn/CoreLink Sign MOU to Further Collaborate on High-Bandwidth Memory for Next-Generation HPC (Thursday, February 29, 2024)
• Sondrel announces two new design contract wins plus two existing Design Consultancy contracts extended (Thursday, February 29, 2024)
• Synopsys Launches Industry's First Complete 1.6T Ethernet IP Solution to Meet High Bandwidth Needs of AI and Hyperscale Data Center Chips (Wednesday, February 28, 2024)
• Bright minds wanted for chip design in Europe (Monday, February 26, 2024)
• LX Semicon Enters Mass Production with OPENEDGES' 22nm LPDDR4 PHY IP (Monday, February 26, 2024)
• Quantum Computing Insights: Exploring the Latest Breakthroughs (Sunday, February 25, 2024)
• Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs (Sunday, February 25, 2024)
• M31 Powers Intel's IFS Alliance to Promote Advanced SoC Development and Innovation (Sunday, February 25, 2024)
• Arm Updates CSS Designs for Hyperscalers' Custom Chips (Wednesday, February 21, 2024)
• M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event (Wednesday, February 21, 2024)
• Weebit Nano demonstrates performance of its ReRAM under extended automotive conditions (Wednesday, February 21, 2024)
• Vervesemi launches Made-in-India semiconductor ASIC (Tuesday, February 20, 2024)
• Taiwan's 5-Bit Superconducting Quantum Computer Goes Online (Tuesday, February 20, 2024)
• Siemens' breakthrough Veloce CS transforms emulation and prototyping with three novel products (Tuesday, February 20, 2024)
• Analog Bits Expands Engineering Presence by Opening a Design Center in Europe (Tuesday, February 20, 2024)
• T2M-IP Unveils the 12-bit 4Gsps ADC Silicon-Proven IP Core with Cutting-Edge Features, Silicon Proven and Ready to License (Monday, February 19, 2024)
• M31 Launches PCI-SIG Certified PCIe 5.0 PHY IP, Partnering with SSD Storage Chipmaker InnoGrit to Advance the Next-Generation PCIe 5.0 (Monday, February 19, 2024)
• IAR unveils Functional Safety version of IAR Embedded Workbench for Arm equipped with certified static analysis capabilities (Monday, February 19, 2024)
• Imec launches the first design pathfinding process design kit for N2 node (Sunday, February 18, 2024)
• Quantum Experts discuss next Digital Revolution (Thursday, February 15, 2024)
• Arm CSA and AMBA release provide boost for chiplet ecosystem (Thursday, February 15, 2024)
• Thalia releases AMALIA 24.1 with support for 12nm FinFET, porting simulation comparisons and streamlined technology analysis reporting (Wednesday, February 14, 2024)
• AccelerComm® Joins Open Compute Project Foundation Focusing on Evenstar Modular Open RAN Radio Unit Reference Design (Wednesday, February 14, 2024)
• ARM bids for chiplet dominance (Tuesday, February 13, 2024)
• zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform (Tuesday, February 13, 2024)
• OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability (Tuesday, February 13, 2024)
• What Role Will Open-Source Development Play in Quantum Computing? (Monday, February 12, 2024)
• Cadence and Dassault Systemes Unveil the First Cloud-Enabled, Collaborative Experience to Transform the Development of Electromechanical Systems (Sunday, February 11, 2024)
• The next frontier in semiconductor innovation: Chiplets and the rise of 3D-ICs (Sunday, February 11, 2024)
• T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer (Sunday, February 11, 2024)
• Siemens brings the power of multi-discipline simulation to axial flux motor development for next-generation EVs (Monday, February 5, 2024)
• Why China is betting big on chiplets (Monday, February 5, 2024)
• Movellus Recognized by Frost & Sullivan for Improving System Performance and Optimizing Power with Its Aeonic™ IP Portfolio (Monday, February 5, 2024)
• Eliyan Breaks Chiplet Memory Wall With Standard Packaging (Sunday, February 4, 2024)
• NoC configuration tool takes makes complex SoC design easier (Sunday, February 4, 2024)
• AccelerComm Launches PUSCH Channel Simulator for 5G L1 Performance Evaluation (Sunday, February 4, 2024)
• Nordic Semiconductor and Arm reaffirm partnership with licensing agreement for latest low power processor designs, software platforms, and security IP (Sunday, February 4, 2024)
• Cadence Unveils Millennium Platform - Industry's First Accelerated Digital Twin Delivering Unprecedented Performance and Energy Efficiency (Thursday, February 1, 2024)
• Europe's home-grown processor (Tuesday, January 30, 2024)
• Satisfy Your Chiplet Craving at the Chiplet Summit (Tuesday, January 30, 2024)
• Alphawave Semi and Teledyne LeCroy Unveil PCIe 7.0 Signal Generation and Measurement (Tuesday, January 30, 2024)
• Nubis Communications and Alphawave Semi Showcase First Demonstration of Optical PCI Express 6.0 Technology (Tuesday, January 30, 2024)
• Alphawave Semi and proteanTecs Collaborate to Provide System Insights and Analytics for Custom Silicon and Chiplets (Monday, January 29, 2024)
• Silvaco Joins GaN Valley™, a Wide Bandgap Semiconductor Innovation Ecosystem in Europe (Sunday, January 28, 2024)
• INTERCHIP achieves 3x faster verification for next-gen clocking oscillator with Siemens' advanced analog and mixed-signal EDA technology (Sunday, January 28, 2024)
• T2M-IP Unveils Best-Selling DVB-T2/T Demodulator IP Core with Cutting-Edge Features, Silicon Proven and Ready to License (Sunday, January 28, 2024)
• SoC design: When a network-on-chip meets cache coherency (Tuesday, January 23, 2024)
• Keysight Introduces Chiplet PHY Designer for Simulating D2D to D2D PHY IP Supporting the UCIe™ Standard (Tuesday, January 23, 2024)
• Siemens brings thermal digital twin technology to the electronics supply chain (Monday, January 22, 2024)