Search News

FDSOI News

• Video Interview: Progress on FAMES Pilot Line for 10-nm and 7-nm FD-SOI (Monday, December 30, 2024)
• CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node (Tuesday, December 10, 2024)
• Quobly announces key milestone for fault-tolerant quantum computing (Tuesday, December 10, 2024)
• All systems go for 7nm FDSOI (Wednesday, June 26, 2024)
• CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines (Thursday, December 14, 2023)
• Weebit Nano receives wafers manufactured in GlobalFoundries' 22FDX® process (Monday, November 20, 2023)
• Scale FD-SOI to 7nm? Yes, We Can (Wednesday, November 15, 2023)
• CEA-Leti unveils breakthroughs in 3D, RF, power, and quantum computing (Sunday, November 12, 2023)
• Quantum tunneling avoids thermal noise in analog circuits (Monday, October 30, 2023)
• China's FD-SOI ecosystem needs more engagement to work as a leapfrogging strategy (Tuesday, October 24, 2023)
• QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries 22FDX® Platform (Monday, September 25, 2023)
• BorgWarner To Integrate STMicroelectronics Silicon-Carbide Technology (Wednesday, August 30, 2023)
• TOSHIBA RELEASES 3RD GENERATION SILICON CARBIDE MOSFETS WITH REDUCED SWITCHING LOSSES (Wednesday, August 30, 2023)
• BOSCH STARTS PRODUCTION OF 800-VOLT SIC TECHNOLOGY FOR ELECTRIC VEHICLES (Tuesday, August 29, 2023)
• REALIZING TIGHT-BINDING HAMILTONIANS USING SITE-CONTROLLED COUPLED CAVITY ARRAYS (Monday, August 28, 2023)
• Leti details move to 10nm, 7nm FD-SOI process in Europe (Tuesday, June 27, 2023)
• Nordic Reveals "Revolution" of Wireless SoC Line: The nRF54 Series (Monday, April 17, 2023)
• Nordic Semi introduces fourth generation of multiprotocol SoCs (Tuesday, April 11, 2023)
• GF to commercialize AR glasses MicroLED solution with FD-SOI technology (Wednesday, March 8, 2023)
• Understanding conditions for the single electron regime in 28 nm FD-SOI quantum dots: Interpretation of experimental data with 3D quantum TCAD simulations (Monday, March 6, 2023)
• Vitruvius+: An Area-Efficient RISC-V Decoupled Vector Coprocessor for High Performance Computing Applications (Tuesday, February 28, 2023)
• Investigation of Anomalous Degradation Tendency of Low-Frequency Noise in Irradiated SOI-NMOSFETs (Tuesday, February 28, 2023)
• Area-efficient radiation-hardened 6 T SOI SRAM cell design using TDBC Transistors (Tuesday, February 28, 2023)
• Infineon begins construction of new plant in Dresden (Thursday, February 16, 2023)
• Single-Event Transient Study of 28 nm UTBB-FDSOI Technology Using Pulsed Laser Mapping (Wednesday, February 1, 2023)
• CEA & Partners Present 'Powerful Step Towards Industrialization' Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium (Sunday, September 11, 2022)
• STMicroelectronics Supports the World Transitions to Digitalization and Decarbonization with its Pioneered FD-SOI Technology (Wednesday, August 3, 2022)
• Open source chip programme expands to 90nm FDSOI (Sunday, July 31, 2022)
• STMicroelectronics and GlobalFoundries agreed to build a steel factory in France for production of chips on 300-mm FDSOI substrates (Friday, July 22, 2022)
• From FinFETs to CFETs: imec's Plan for Continued Transistor Scaling (Friday, July 15, 2022)
• Soitec boosts customer yield of Silicon Carbide semiconductor manufacturing with KLA inspection technology (Tuesday, July 12, 2022)
• Is It Finally Time for Silicon Photonics to Shine? (Tuesday, July 12, 2022)
• US Government funding enables SkyWater to further develop IP for its 90 nm rad-hard FDSOI platform to be used in strategic defense and space applications (Monday, July 11, 2022)
• ST looks at joint European wafer fab with GlobalFoundries (Tuesday, June 14, 2022)
• SkyWater adds FDSOI SRAM IP (Thursday, June 9, 2022)
• Soitec reports full year results of fiscal year 2022 (Wednesday, June 8, 2022)
• MediaTek Enters 5G mmWave Market (Sunday, May 22, 2022)
• CoreHW Announces mmWave GF 22FDX PLL IP (Tuesday, May 3, 2022)
• Mobile Semiconductor's 22FDX Register File Memory Compiler Receives Globalfoundries Platinum Status (Wednesday, April 20, 2022)
• QuickLogic Adds GlobalFoundries 22FDX Process to its Growing List of Australis IP Generator-Based eFPGA IP (Wednesday, April 13, 2022)
• Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications (Thursday, April 7, 2022)
• Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services (Wednesday, March 23, 2022)
• MICLEDI Microdisplays Announces Agreement with GlobalFoundries to Collaborate on MicroLED Displays for AR Glasses (Monday, March 21, 2022)
• Weebit scaling down its ReRAM technology to 22nm (Monday, March 14, 2022)
• Grenoble INP - Phelma, UGA and Soitec sign their first partnership agreement (Sunday, March 13, 2022)
• Soitec Board Announces CEO Succession Plan - Pierre Barnabe To Succeed Ceo Paul Boudre At The Close Of The July 2022 Shareholders Meeting (Tuesday, January 18, 2022)
• Phase-change memory comes to 18nm FDSOI (Tuesday, December 14, 2021)
• 10/100/1000M Ethernet PHY IP Core in ST 28FDSOI technology licensed to a leading Chinese Semiconductor company for Broadband Access Networks Application (Sunday, December 12, 2021)
• Weebit demonstrates successful scaling of its ReRAM technology to 28nm (Sunday, October 3, 2021)
• Weebit scale ReRAM to 28nm (Sunday, October 3, 2021)