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Foundry News

• TSMC Showcases New Technology Developments at 2023 Technology Symposium (Wednesday, April 26, 2023)
• Synopsys, Ansys and Keysight Collaborate with TSMC to Boost Performance of Autonomous Systems with New mmWave Reference Flow (Tuesday, April 25, 2023)
• Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC's N4P Process (Monday, April 24, 2023)
• Analog Bits to Demonstrate Working Silicon on TSMC N3E Process at TSMC 2023 North America Technology Symposium (Monday, April 24, 2023)
• Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology (Monday, April 24, 2023)
• Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology (Monday, April 24, 2023)
• Marvell Demonstrates Industry's First 3nm Data Infrastructure Silicon (Saturday, April 22, 2023)
• TSMC could partner with Bosch for 28nm fab in Germany (Sunday, April 16, 2023)
• TSMC could partner with Bosch for 28nm fab in Germany (Thursday, April 13, 2023)
• Rambus Joins the Intel Foundry Services (IFS) Accelerator IP Alliance to Enable State-of-the-Art SoCs (Tuesday, April 11, 2023)
• Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design (Tuesday, April 11, 2023)
• GUC Taped Out 3nm 8.6Gbps HBM3 and 5Tbps/mm GLink-2.5D IP using TSMC Advanced Packaging Technology (Wednesday, April 5, 2023)
• NVIDIA, ASML, TSMC and Synopsys Set Foundation for Next-Generation Chip Manufacturing (Monday, March 20, 2023)
• TSMC's 3-nm progress report: Better than expected (Tuesday, March 7, 2023)
• proteanTecs Joins Intel Foundry Services (IFS) Accelerator IP Alliance Program (Tuesday, March 7, 2023)
• Intel Tapes Out Chips on 1.8nm and 2nm Production Nodes (Updated) (Sunday, March 5, 2023)
• Chevin Technology partners with Intel® (Sunday, March 5, 2023)
• Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe (Sunday, February 19, 2023)
• Oculi Forms strategic partnership with GlobalFoundries to advance edge sensing technology (Wednesday, February 15, 2023)
• The Six Semiconductor of OPENEDGES Technology Collaborates with imec.IC-link US to Tape-out Two 7nm Testchip (Wednesday, February 15, 2023)
• Samsung Electronics Establishes LCA Verification on Product Carbon Footprint of Its Semiconductor Business (Tuesday, February 7, 2023)
• Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers (Monday, February 6, 2023)
• What will TSMC do next? (Sunday, February 5, 2023)
• TSMC opens up 7nm FINFET process to universities (Saturday, February 4, 2023)
• TSMC Joins Hands with Apple and Sony to Keep Samsung in Check (Monday, January 30, 2023)
• U.S. and Japanese Chipmakers Join 2-nm War (Sunday, January 29, 2023)
• Samsung 3nm process yield is 'perfect' (Sunday, January 15, 2023)
• TSMC weighs new plants in Japan and Europe (Sunday, January 15, 2023)
• Samsung and SK Hynix planing to procure fewer silicon wafers (Tuesday, January 10, 2023)
• IntelÂ’s Process Progress (Monday, January 9, 2023)
• Samsung Foundry Achieves "Perfect Level" 3nm Yield Rates, Levelling up to TSMC (Monday, January 9, 2023)
• Analysts Estimate TSMC's 3nm Yields Between 60% and 80% (Friday, December 30, 2022)
• Prelude to the War of 3-nano Semiconductor... TSMC "Starting mass production" (Thursday, December 29, 2022)
• TSMC holds 3nm ceremony (Tuesday, December 27, 2022)
• TSMC will start the mass production of its next-gen cutting-edge chips this week (Sunday, December 25, 2022)
• TSMC in talks to build fab in Dresden (Sunday, December 25, 2022)
• Japan collaborates with IBM to produce 2nm chips (Tuesday, December 20, 2022)
• TSMC fab in Japan at center of Sony's image sensor kingdom (Friday, December 16, 2022)
• Japan's New Semiconductor Foundry Rapidus Taps IBM For 2nm Process (Sunday, December 11, 2022)
• Samsung fails to narrow gap with TSMC in foundry market (Sunday, December 11, 2022)
• Japan's Rapidus signs up IMEC to support 2nm push (Tuesday, December 6, 2022)
• TSMC Announces Updates for TSMC Arizona (Tuesday, December 6, 2022)
• STMicroelectronics and Soitec Partner on SiC Substrate Manufacturing Technology (Monday, December 5, 2022)
• Intel says it will squeeze 1 trillion transistors onto a chip package by 2030 (Saturday, December 3, 2022)
• Samsung and TSMC Competing to Secure Foundry Customers (Wednesday, November 30, 2022)
• TSMC to Make 3 nm Semiconductors at Arizona Fab, Looking to 1 nm (Monday, November 28, 2022)
• Leti, Intel look to quadruple hybrid bonding speeds (Thursday, November 24, 2022)
• SkyWater CEO Expands "Technology Foundry" Model (Tuesday, November 22, 2022)
• Samsung Has Reportedly Secured 3nm Orders from NVIDIA, Qualcomm & More (Monday, November 21, 2022)
• Tesla becomes TSMC's first EV client for 4nm chips with 3x faster self-driving calculations (Sunday, November 20, 2022)