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• TSMC to produce 3-nanometer chips at its Arizona factory (Sunday, November 20, 2022)
• Synopsys Wins Six Partner of the Year Awards at TSMC 2022 OIP Ecosystem Forum (Thursday, November 17, 2022)
• TSMC Expansion in Arizona to Target 3-nm Node (Monday, November 14, 2022)
• Report says Apple, TSMC talk about moving 3nm chip production to U.S. (Thursday, November 10, 2022)
• TSMC Grants a Sweep of EDA Certifications for New Process Nodes (Saturday, November 5, 2022)
• SMIC: The Chinese company at the centre of US-China chip war (Thursday, November 3, 2022)
• Intel: Our Goal Is to Become Second Largest Foundry by 2030 (Thursday, November 3, 2022)
• Weebit qualifies ReRAM for production on 130nm process (Sunday, October 30, 2022)
• TSMC says no commitment made on 1nm foundry location (Sunday, October 30, 2022)
• TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations (Wednesday, October 26, 2022)
• Siemens partners with TSMC for 3nm product certifications and other technology milestones (Wednesday, October 26, 2022)
• Intel Foundry Services roadmap unveiled one deal at a time (Monday, October 24, 2022)
• Alphawave IP Achieves Its First Testchip Tapeout for TSMC N3E Process (Monday, October 24, 2022)
• Analog Bits to Demonstrate Pinless PLL and Sensor IP in TSMC N4 and N5 Processes at TSMC 2022 North America Open Innovation Platform® Ecosystem Forum (Monday, October 24, 2022)
• Samsung Electronics to Beef up Older Foundry Processes (Sunday, October 23, 2022)
• Intel Foundry Services Forms Alliance to Enable National Security, Government Applications (Sunday, October 23, 2022)
• Faraday Unveils Design Implementation Services for FinFET Technology Targeting all Foundries (Sunday, October 23, 2022)
• TSMC suspends production of powerful GPU chip for Chinese tech firm (Saturday, October 22, 2022)
• TSMC heads below 1nm with 2D transistors at IEDM (Monday, October 17, 2022)
• Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design (Monday, October 17, 2022)
• TSMC delays production of 3nm chips as Samsung Foundry takes process leadership (Saturday, October 15, 2022)
• Faraday Delivers SAFE™ IP Portfolio for Samsung Foundry 14LPP Process (Wednesday, October 12, 2022)
• 8nm RFIC Flow Supports All Stages of RFIC Design Process (Monday, October 10, 2022)
• Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022 (Wednesday, October 5, 2022)
• Samsung unveils advanced-chipmaking roadmap, intensifying rivalry with TSMC (Wednesday, October 5, 2022)
• Siemens' Aprisa digital implementation solution certified for Samsung Foundry's advanced 4nm processes (Monday, October 3, 2022)
• Wafer Makers Continue to Aggressively Expand Facilities (Thursday, September 29, 2022)
• Foundry data shows the cracks in the semiconductor market (Wednesday, September 28, 2022)
• Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA (Wednesday, September 28, 2022)
• Moving from SoCs to Chiplets Could Help Extend Moore's Law (Tuesday, September 27, 2022)
• Samsung, Intel, TSMC confirm alliance in next-gen "chiplet" technology (Tuesday, September 27, 2022)
• Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October (Wednesday, September 21, 2022)
• Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow (Wednesday, September 21, 2022)
• SkyWater to Provide Foundry Service for new NIST and Google Partnership to Create Supply of Chips for Researchers and Tech Startups (Thursday, September 15, 2022)
• Apple to use updated TSMC technology (Wednesday, September 14, 2022)
• TSMC says its next-gen 2nm mass production begins in 2025 (Monday, September 12, 2022)
• TSMC to mass produce chips on upgraded version of 3nm process in 2023 (Sunday, September 11, 2022)
• Taiwan's TSMC 2nm chip fab ready for construction, to be operational by 2025 (Sunday, September 11, 2022)
• Archer Materials partners with GlobalFoundries to advance 12CQ chip fabrication - Quantum Computing (Monday, September 5, 2022)
• UMC Reports Sales for August 2022 (Monday, September 5, 2022)
• SiMa.ai Develops the Industry's First Purpose-Built Machine Learning System-on-Chip with TSMC's Power Efficient Technology (Monday, September 5, 2022)
• TSMC plans to mass produce 2nm chips in 2025 and adopts US EDA software: report (Sunday, September 4, 2022)
• Samsung Electronics to Produce Google's 3-nm Mobile Chips (Tuesday, August 30, 2022)
• There is TSMC and there's everybody else, can Samsung or Intel catch up? (Saturday, August 27, 2022)
• Intel unveils semiconductor co-investment program (Tuesday, August 23, 2022)
• A closer look at TSMC's 3-nm node and FinFlex technology (Sunday, August 21, 2022)
• Apple will be first to receive 3nm chips from TSMC, but not for the device you're thinking of (Saturday, August 20, 2022)
• Cadence and GlobalFoundries Collaborate on RF and mmWave Design Flow to Accelerate Mobile and 5G Innovation (Thursday, August 18, 2022)
• Credo Launches Comprehensive Family of 112G PAM4 SerDes IP for TSMC N5 and N4 Process Technologies (Tuesday, August 16, 2022)
• GlobalFoundries CEO: Earnings benefited from balanced supply chain, diverse end markets (Monday, August 8, 2022)