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• Silicon Creations Joins Intel Foundry Services Accelerator - IP Alliance Program Aiming to Reducing Design Barriers, Accelerating Time-to-Market (Monday, February 7, 2022)
• Intel Foundry Services Launches Ecosystem Alliance to Accelerate Customer Innovation (Monday, February 7, 2022)
• Vidatronic Partners with Intel Foundry Services as an IP Alliance Member (Monday, February 7, 2022)
• Andes Technology Corp. Announces Joining the Intel Foundry Service Accelerator - IP Alliance Program (Sunday, February 6, 2022)
• Analog Bits Partners with Intel Foundry Services as IP Alliance Partner (Sunday, February 6, 2022)
• Synopsys Joins New Intel Foundry Services Ecosystem Alliance to Propel Development of Next-Generation Semiconductor Designs (Sunday, February 6, 2022)
• Siemens joins Intel Foundry Services' EDA Alliance program (Sunday, February 6, 2022)
• Can anything stop TSMC? (Monday, January 31, 2022)
• TSMC's biggest threat isn't a resurgent Intel (Wednesday, January 26, 2022)
• TSMC price hike expected to impact CPUs and graphics cards this year (Tuesday, January 18, 2022)
• Samsung Reportedly Aims to Overtake TSMC's Foundry Business by 2030 (Tuesday, January 18, 2022)
• Why Qualcomm won't built its own foundry (Tuesday, January 11, 2022)
• A*STAR's Institute of Microelectronics and Soitec to develop next-generation silicon carbide semiconductors (Sunday, January 9, 2022)
• Intel's technology trends (Sunday, January 2, 2022)
• Samsung and SK to Make Massive Investments in System Semiconductors (Sunday, January 2, 2022)
• Siemens mPower Solution Now Certified for TSMC's N7 and N5 Nodes (Tuesday, December 28, 2021)
• TSMC reportedly getting everything lined up for 2nm production in 2025 (Tuesday, December 28, 2021)
• Intel CEO Says Chip Shortage To Last Until 2023 (Sunday, December 19, 2021)
• Taiwan approves TSMC fab investment plan in Japan (Sunday, December 19, 2021)
• TSMC Introduces N4X Process (Thursday, December 16, 2021)
• Samsung and IBM reveal plans to make next-generation CPU with 5 nm process (Wednesday, December 15, 2021)
• TSMC Presents 2021 Excellent Performance Award to Outstanding Suppliers (Wednesday, December 15, 2021)
• Synopsys SiliconSmart Library Characterization Solution Achieves Certification for TSMC N5, N4 and N3 Advanced Processes (Wednesday, December 15, 2021)
• TSMC Newest N4X Process Targets HPC Products (Wednesday, December 15, 2021)
• IBM, Samsung Unveil VTFET to Extend Moore's Law (Tuesday, December 14, 2021)
• Imec demonstrates successful monolithic integration of Schottky diodes and depletion-mode HEMTs with 200 V GaN-IC (Sunday, December 12, 2021)
• TSMC November 2021 Revenue Report (Thursday, December 9, 2021)
• TSMC in spat with Intel (Wednesday, December 8, 2021)
• AMD may use Samsung's 4nm node for Chromebook processors (Tuesday, December 7, 2021)
• Intel Looking to Deepen Ties with TSMC in Hopes of Securing 3nm Supply (Thursday, December 2, 2021)
• Siemens Bags Three TSMC OIP Partner of the Year Awards for Next-gen Design Enablement (Monday, November 29, 2021)
• Nvidia reportedly using TSMC N5 node for GeForce RTX 4000 Series (Monday, November 29, 2021)
• Micron and UMC Announce Global Settlement (Monday, November 29, 2021)
• Siemens receives three 2021 TSMC OIP Partner of the Year awards for next-generation design enablement (Wednesday, November 24, 2021)
• Samsung set to compete against TSMC with new foundry in US (Tuesday, November 23, 2021)
• Samsung choses Austin for $17bn 3nm fab (Tuesday, November 23, 2021)
• Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library (Wednesday, November 17, 2021)
• Samsung and Its Foundry Partners Reveal Solutions for a Strong Design Infrastructure at 3rd SAFE Forum 2021 (Wednesday, November 17, 2021)
• Synopsys Full EDA Flow First to Achieve Samsung Foundry 4LPP Process Certification (Tuesday, November 16, 2021)
• SMIC Vows to Triple 300-mm Production Capacity Despite U.S. Sanctions (Monday, November 15, 2021)
• Faraday Announces Proven MIPI D-PHY for Samsung Foundry 14LPC Process (Monday, November 15, 2021)
• Soitec's quality focus on RF-SOI wafers wins UMC's "Outstanding Supplier Award" (Sunday, November 14, 2021)
• SMIC Management Shakeup Continues (Sunday, November 14, 2021)
• Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications (Wednesday, November 10, 2021)
• TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder (Monday, November 8, 2021)
• Samsung and Alphawave IP Announce Acceleration of Deep Partnership with Flagship Global Hyperscaler Design Win at 4nm (Wednesday, November 3, 2021)
• TSMC Recognizes Long-Standing Collaboration with Synopsys on Semiconductor Innovation with Multiple OIP Partner of the Year Awards (Tuesday, November 2, 2021)
• GlobalFoundries Announces Closing of Initial Public Offering (Monday, November 1, 2021)
• Alphawave IP Receives Prestigious 2021 TSMC OIP Partner of the Year Award for High-Speed SERDES IP (Sunday, October 31, 2021)
• M31 Technology Receives 2021 TSMC OIP Partner of the Year Award (Sunday, October 31, 2021)