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Foundry News

• ESMC Breaks Ground on Dresden Fab (Wednesday, August 21, 2024)
• Global Foundry Industry's Revenue Rises on AI Demand (Tuesday, August 20, 2024)
• Intel 18A Advanced Packaging is Key to Tech Leadership (Tuesday, August 13, 2024)
• TSMC's Expansion beyond 2nm Taking Shape? Angstrom-Class Fabs Possibly in Southern Taiwan (Monday, August 12, 2024)
• Rapidus to Fully Automate 2nm Fab, Claiming Chip Delivery Times at One-Third of Its Competitors (Monday, August 12, 2024)
• Intel Foundry Achieves Major Milestones (Tuesday, August 6, 2024)
• Intel once again confirms future Intel 10A node, Intel 14A process progresses smoothly (Friday, August 2, 2024)
• It is reported that TSMC's A14 process will be put into risk trial production in the first half of 2026 (Monday, July 29, 2024)
• Samsung Slows Opening of Texas Fab Despite CHIPS Stimulus (Monday, July 22, 2024)
• Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks (Wednesday, July 10, 2024)
• Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA Process and 2.5D Package to Preferred Networks (Monday, July 8, 2024)
• Siemens advances integrated circuit test and analysis at 5nm and below (Monday, July 8, 2024)
• Tiny titans: Unveiling the power of 2nm and 1nm chips (Monday, July 8, 2024)
• TSMC Reportedly Secures 3nm Order After Tapeout for Google's Tensor G5 (Wednesday, July 3, 2024)
• eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips (Tuesday, July 2, 2024)
• Building Intel's Foundry Ecosystem for the AI Era (Sunday, June 30, 2024)
• Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications (Wednesday, June 26, 2024)
• Intel's Latest FinFET Is Key to Its Foundry Plans (Tuesday, June 25, 2024)
• Europe invests 830 million euros to build FAMES FD-SOI pilot line to achieve 7nm with planar CMOS (Tuesday, June 25, 2024)
• Intel 3 '3nm-class' process technology is in high-volume production (Tuesday, June 18, 2024)
• QuickLogic Joins Intel Foundry Accelerator IP and USMAG Alliance Programs (Monday, June 17, 2024)
• Intel 3 Represents an Intel Foundry Milestone (Monday, June 17, 2024)
• Samsung Foundry Struggles with Yield and Power Efficiency Issues (Monday, June 17, 2024)
• Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process (Wednesday, June 12, 2024)
• ADTechnology announces next-generation platform "ADP600" at Samsung Foundry Forum 2024 (Wednesday, June 12, 2024)
• Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry's newest processes (Wednesday, June 12, 2024)
• Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology (Wednesday, June 12, 2024)
• Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024 (Wednesday, June 12, 2024)
• Alphawave Semi Expands Partnership with Samsung Foundry to Further Drive Innovation at Advanced Semiconductor Nodes (Monday, June 10, 2024)
• OPENEDGES Announces Silicon-Proven Success of its LPDDR5X Combo PHY IP on Samsung Foundry's SF5A Technology (Sunday, June 9, 2024)
• Samsung Foundry Expands 'Packaging Coalition' with Ten Additional Members (Wednesday, June 5, 2024)
• ElevATE Semiconductor and GlobalFoundries Partner on High-Voltage Chips for Commercial and National Security Applications (Tuesday, June 4, 2024)
• Qualcomm is considering a "dual-sourcing" strategy with Samsung and TSMC for Snapdragon 8 Gen 5 (Tuesday, June 4, 2024)
• Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors (Sunday, June 2, 2024)
• Samsung Electronics Opens Path to Chase TSMC with 3nm Foundry Collaboration with AMD (Tuesday, May 28, 2024)
• Samsung Expected to Unveil its 1nm Plan in June, Advancing it to 2026 (Tuesday, May 28, 2024)
• TSMC's 3nm Production Capacity Will Triple This Year! Nanjing Plant Receives "Indefinite Exemption"! (Thursday, May 23, 2024)
• China's largest chipmaker SMIC is now the No. 3 foundry in the world, Counterpoint says (Thursday, May 23, 2024)
• X-FAB and Soitec team up on SiC wafers (Wednesday, May 22, 2024)
• IMEC Spearheads the Construction of Sub-2nm Pilot Line Project with a Fund of EUR 2.5 Billion (Wednesday, May 22, 2024)
• Soitec and Tokai Carbon enter into SiC partnership (Tuesday, May 21, 2024)
• Fraunhofer IPMS supports the 300 mm process development of smart power technologies for the semiconductor manufacturer Infineon at the Dresden site (Monday, May 20, 2024)
• TSMC Reportedly Prepares Next-generation HBM4 Manufacturing, Utilizing 12nm and 5nm Process Nodes (Thursday, May 16, 2024)
• Samsung tapes out 3nm mobile processor, closing gap with TSMC (Tuesday, May 7, 2024)
• Rapidus and Fraunhofer IZM join Forces for High-End Performance Packaging (Tuesday, May 7, 2024)
• Synopsys collaborates with TSMC on 2nm IP portfolio and photonics ICs (Monday, May 6, 2024)
• Apple M4 moves to TSMC N3E (Monday, May 6, 2024)
• A Conversation with GlobalFoundries Europe's Manfred Horstmann (Sunday, May 5, 2024)
• Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process (Thursday, May 2, 2024)
• TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips (Monday, April 29, 2024)