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• ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM (Wednesday, January 17, 2024)
• Intel, Samsung, TSMC 'Getting Serious' About CFET (Tuesday, January 9, 2024)
• TSMC reaffirms path to 1-nm node by 2030 on track (Sunday, December 31, 2023)
• Samsung Seen Stumbling at Silicon's Leading Edge (Thursday, December 28, 2023)
• Samsung, Intel Gear Up for Intense Competition in 2-NM Semiconductor Process, Chasing TSMC (Monday, December 25, 2023)
• Samsung Seen Stumbling at Silicon's Leading Edge (Tuesday, December 19, 2023)
• Samsung Electronics Tense Over TSMC-Apple-Amkor 'Arizona Alliance' (Tuesday, December 5, 2023)
• China's 'Big Fund' is investing $1 billion in another domestic foundry, to advance sub-10nm chip manufacturing (Tuesday, December 5, 2023)
• Samsung Foundry aims to improve production of AI, high performance computing chips (Monday, November 20, 2023)
• Rapidus and Tenstorrent Partner to Accelerate Development of AI Edge Device Domain Based on 2nm Logic (Thursday, November 16, 2023)
• Samsung to unveil 3D AI chip packaging tech SAINT to rival TSMC (Saturday, November 11, 2023)
• Cadence EMX 3D Planar Solver Certified for Samsung Foundry 8nm LPP Process Technology (Wednesday, November 8, 2023)
• Cadence open-source PDK and reference design now available for SkyWater's 130nm process (Tuesday, November 7, 2023)
• Will 1.4-nm help Samsung catch up with TSMC, IFS? (Sunday, November 5, 2023)
• Are We Ready for the 2nm Process Node? (Wednesday, November 1, 2023)
• Details about Samsung Foundry's 1.4nm process node surface (Monday, October 30, 2023)
• Synopsys Honored at TSMC 2023 OIP Ecosystem Forum with Multiple Partner of the Year Awards (Wednesday, October 25, 2023)
• Sofics releases its ESD technology on TSMC 3nm process (Monday, October 23, 2023)
• Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards (Thursday, October 19, 2023)
• Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU (Wednesday, October 18, 2023)
• CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs (Monday, October 16, 2023)
• eMemory Won TSMC OIP Partner of the Year Award for the 14th Consecutive Year (Sunday, October 15, 2023)
• ADTechnology to start 3nm 2.5D ASIC design project for HPC application (Tuesday, October 10, 2023)
• Samsung Electronics and TSMC Grapple with 3-Nano Yield Challenges (Thursday, October 5, 2023)
• Intel Announces Intent to Operate Programmable Solutions Group (PSG) as Standalone Business (Tuesday, October 3, 2023)
• TSMC selects IC'Alps for its Design Center Alliance (DCA) (Tuesday, October 3, 2023)
• Soitec Opens New Plant, Positioning SmartSiC™ as a Future EV Standard (Monday, October 2, 2023)
• TSMC Announces Breakthrough Set to Redefine the Future of 3D IC (Wednesday, September 27, 2023)
• M31 Announces Low-Power IP Solutions for TSMC's N12e Process (Wednesday, September 27, 2023)
• Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process (Wednesday, September 27, 2023)
• Cadence Digital and Custom/Analog Design Flows Achieve the Latest TSMC N2 Certification (Tuesday, September 26, 2023)
• Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum (Tuesday, September 26, 2023)
• GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit (Tuesday, September 26, 2023)
• Siemens and TSMC collaborate to help mutual customers optimize designs using foundry's newest advancements (Tuesday, September 26, 2023)
• Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows (Tuesday, September 26, 2023)
• Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs (Monday, September 25, 2023)
• proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem (Sunday, September 24, 2023)
• Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes (Sunday, September 24, 2023)
• Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows (Sunday, September 24, 2023)
• Synopsys tools tape out 2nm chips at TSMC (Sunday, September 24, 2023)
• Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings (Thursday, September 21, 2023)
• Report: TSMC Could Push 2nm Node Back to 2026 (Wednesday, September 20, 2023)
• Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP (Wednesday, September 20, 2023)
• TSMC in talks about chiplet packaging in Arizona (Monday, September 18, 2023)
• Driving EuropeÂ’s Chip Renaissance: TSMCÂ’s Vision with ESMC (Thursday, September 14, 2023)
• X-Fab adds new passive integration technology for RF (Wednesday, September 13, 2023)
• TSMC's semiconductor foundry in the United States will begin trial production in Q1 2024 (Tuesday, September 12, 2023)
• GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs (Monday, September 11, 2023)
• Getting to grips with RF design (Sunday, September 10, 2023)
• Samsung Says It Will Beat TSMC's 4nm Production Capacity (Thursday, September 7, 2023)