Search News

Foundry News

• Rapidus CEO Chasing Single-Wafer-Processing Dream (Sunday, July 2, 2023)
• Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023 (Tuesday, June 27, 2023)
• Synopsys and Samsung Foundry Boost Power, Performance and Area for Modern SoCs on Samsung's SF2 Process (Tuesday, June 27, 2023)
• Intel Provides Update on Internal Foundry Model (Wednesday, June 21, 2023)
• Samsung to apply AI, big data tech to entire chipmaking process (Sunday, June 18, 2023)
• Samsung broadens IP portfolio to narrow gap with TSMC (Tuesday, June 13, 2023)
• Samsung Electronics to hoist foundry IP portfolio to narrow gap with TSMC (Tuesday, June 13, 2023)
• Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes (Tuesday, June 13, 2023)
• TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology (Thursday, June 8, 2023)
• It's a go for the GF-ST joint FDSOI fab in Crolles (Monday, June 5, 2023)
• The challenges Intel faces to compete with TSMC, Samsung (Monday, June 5, 2023)
• TSMC studying 2nd fab in Kumamoto, focusing on mature technologies (Monday, June 5, 2023)
• Intel Foundry Services Ushers in a New Era (Tuesday, May 30, 2023)
• Samsung's June 2023 Reveal: Enhanced 3nm & 4nm Chip Fabrication Process (Monday, May 29, 2023)
• TSMC lays out a killer roadmap (Wednesday, May 24, 2023)
• 3nm AI chips and 6nm microcontrollers will be key to TSMC Dresden fab (Tuesday, May 23, 2023)
• Samsung To Officially Unveil Its 3nm, 4nm Technologies In June, With Up To 34 Percent Power Efficiency Improvements (Sunday, May 21, 2023)
• GlobalFoundries, Samsung Electronics, and TSMC Join Imec's "Sustainable Semiconductor Technologies & Systems" (SSTS) Program (Tuesday, May 16, 2023)
• Japanese foundry Rapidus is making cutting edge 2 nm nodes with IBM, plans to compete with TSMC and Samsung by 2027 (Thursday, May 11, 2023)
• TSMC adds two variants to 2nm node; will Intel catch up? (Tuesday, May 9, 2023)
• Samsung to Detail Second-Gen 3nm Node, But Admits It Is Behind TSMC (Sunday, May 7, 2023)
• TSMC upends 3-nm roadmap with three new nodes (Monday, May 1, 2023)
• TSMC on track to roll out advanced 2nm chips by 2025 (Wednesday, April 26, 2023)
• Siemens announces certifications for TSMC's latest processes, celebrates recent achievements for Siemens and TSMC collaboration (Wednesday, April 26, 2023)
• TSMC Showcases New Technology Developments at 2023 Technology Symposium (Wednesday, April 26, 2023)
• Synopsys, Ansys and Keysight Collaborate with TSMC to Boost Performance of Autonomous Systems with New mmWave Reference Flow (Tuesday, April 25, 2023)
• Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC's N4P Process (Monday, April 24, 2023)
• Analog Bits to Demonstrate Working Silicon on TSMC N3E Process at TSMC 2023 North America Technology Symposium (Monday, April 24, 2023)
• Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology (Monday, April 24, 2023)
• Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology (Monday, April 24, 2023)
• Marvell Demonstrates Industry's First 3nm Data Infrastructure Silicon (Saturday, April 22, 2023)
• TSMC could partner with Bosch for 28nm fab in Germany (Sunday, April 16, 2023)
• TSMC could partner with Bosch for 28nm fab in Germany (Thursday, April 13, 2023)
• Rambus Joins the Intel Foundry Services (IFS) Accelerator IP Alliance to Enable State-of-the-Art SoCs (Tuesday, April 11, 2023)
• Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design (Tuesday, April 11, 2023)
• GUC Taped Out 3nm 8.6Gbps HBM3 and 5Tbps/mm GLink-2.5D IP using TSMC Advanced Packaging Technology (Wednesday, April 5, 2023)
• NVIDIA, ASML, TSMC and Synopsys Set Foundation for Next-Generation Chip Manufacturing (Monday, March 20, 2023)
• TSMC's 3-nm progress report: Better than expected (Tuesday, March 7, 2023)
• proteanTecs Joins Intel Foundry Services (IFS) Accelerator IP Alliance Program (Tuesday, March 7, 2023)
• Intel Tapes Out Chips on 1.8nm and 2nm Production Nodes (Updated) (Sunday, March 5, 2023)
• Chevin Technology partners with Intel® (Sunday, March 5, 2023)
• Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe (Sunday, February 19, 2023)
• Oculi Forms strategic partnership with GlobalFoundries to advance edge sensing technology (Wednesday, February 15, 2023)
• The Six Semiconductor of OPENEDGES Technology Collaborates with imec.IC-link US to Tape-out Two 7nm Testchip (Wednesday, February 15, 2023)
• Samsung Electronics Establishes LCA Verification on Product Carbon Footprint of Its Semiconductor Business (Tuesday, February 7, 2023)
• Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers (Monday, February 6, 2023)
• What will TSMC do next? (Sunday, February 5, 2023)
• TSMC opens up 7nm FINFET process to universities (Saturday, February 4, 2023)
• TSMC Joins Hands with Apple and Sony to Keep Samsung in Check (Monday, January 30, 2023)
• U.S. and Japanese Chipmakers Join 2-nm War (Sunday, January 29, 2023)