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Chiplet / Multi-Die News

• CXL Fulfills AI's Need for Open Industry Standard Interconnect (Thursday, July 18, 2024)
• YorChip predicts 2026 will be the year of the chiplet (Tuesday, July 2, 2024)
• Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation (Monday, June 24, 2024)
• Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry (Monday, June 24, 2024)
• Siemens delivers a major leap toward mainstream 3D-IC adoption with new Calibre 3DThermal (Monday, June 24, 2024)
• EDA vendors put Intel EMIB interconnect in design flows for 3D ICs (Monday, June 24, 2024)
• Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions (Sunday, June 23, 2024)
• Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications (Thursday, June 20, 2024)
• Alphawave Semi Unlocks 1.2 TBps Connectivity for High-Performance Compute and AI Infrastructure with 9.2 Gbps HBM3E Subsystem (Wednesday, June 19, 2024)
• System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging (Wednesday, June 19, 2024)
• Alphawave Reveals Multiprotocol I/O Chiplet Tapeout, Collabs with Arm, Samsung (Tuesday, June 18, 2024)
• Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure (Wednesday, June 12, 2024)
• SEMIFIVE Collaborates with OPENEDGES on Chiplet Development (Tuesday, June 11, 2024)
• Introducing USB 3.0, PCIe 2.0 and SATA 3.0 Combo PHY IP Cores to empower Next Gen Connectivity Chipsets (Sunday, June 9, 2024)
• Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet (Wednesday, June 5, 2024)
• GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers (Thursday, April 18, 2024)
• Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs (Tuesday, March 12, 2024)
• Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure (Sunday, March 10, 2024)
• Siemens qualifies industry-leading IC design solutions for Intel Foundry processes (Tuesday, February 20, 2024)
• EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure (Monday, February 12, 2024)
• SignatureIP launches its new iNoCulator NoC configuration tool with a free trial offer (Thursday, February 1, 2024)
• Ansys Semiconductor Simulation Solutions Certified for UMC's 3D Chip Technology (Wednesday, October 18, 2023)
• Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development (Tuesday, October 17, 2023)
• Rambus Completes Sale of PHY IP Assets to Cadence (Wednesday, September 6, 2023)
• GUC Announced 5nm HBM3 PHY and Controller Silicon Proven at 8.4 Gbps (Tuesday, September 5, 2023)
• Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era (Sunday, August 27, 2023)
• QuickLogic and YorChip Partner to Develop Low-Power, Low-Cost UCIe FPGA Chiplets (Sunday, August 27, 2023)
• Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0 (Tuesday, August 15, 2023)
• Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year (Monday, August 14, 2023)
• YorChip launches UniPHY™️ - the first dual-use PHY for Chiplets (Monday, July 24, 2023)
• Alphawave Semi Spearheads Chiplet-Based Custom Silicon for Generative AI and Data Center Workloads with Successful 3nm Tapeouts of HBM3 and UCIe IP (Sunday, July 9, 2023)
• Lightelligence Revolutionizes Big Data Interconnect with World's First Optical Network-on-Chip Processor (Wednesday, June 28, 2023)
• Synopsys and Samsung Foundry Deepen Collaboration to Accelerate Multi-Die System Design for Advanced Samsung Processes (Tuesday, June 27, 2023)
• YorChip and Siloxit Collaborate on Industry's First Secure Data Acquisition Chiplet for Mass Markets (Monday, June 26, 2023)
• Creonic Releases Ultrafast BCH Decoder IP Core, Processing One Codeword per Clock Cycle (Thursday, June 15, 2023)
• Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security (Monday, June 12, 2023)
• Are Chiplets Enough to Save Moore's Law? (Sunday, June 4, 2023)
• Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era (Tuesday, May 30, 2023)
• Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future (Tuesday, May 30, 2023)
• Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets (Tuesday, May 23, 2023)
• Chiplet interconnect handles 40 Gbps/bump (Monday, May 22, 2023)
• proteanTecs' Die-to Die Interconnect Monitoring IP Passes TSMC9000 Pre-Silicon Assessment (Wednesday, May 17, 2023)
• Tenstorrent Selects Arteris IP for AI High-Performance Computing and Datacenter RISC-V Chiplets (Monday, May 1, 2023)
• Signature IP Corporation Demonstrates Configurable NoC Products at Design & Reuse IP SoC Day (Wednesday, April 26, 2023)
• Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications (Tuesday, April 25, 2023)
• Synopsys, TSMC and Ansys Strengthen Ecosystem Collaboration to Advance Multi-Die Systems (Sunday, April 23, 2023)
• The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi (Sunday, April 2, 2023)
• Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon's High-Performance Processors (Wednesday, March 29, 2023)
• Tachyum To Use UCIe Interconnect Standards In Prodigy 2 (Tuesday, March 28, 2023)
• Arteris Unveils Next-Generation FlexNoC 5 Physically Aware Network-on-Chip IP (Tuesday, February 21, 2023)