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Chiplet / Multi-Die News

• Lightelligence Revolutionizes Big Data Interconnect with World's First Optical Network-on-Chip Processor (Wednesday, June 28, 2023)
• Synopsys and Samsung Foundry Deepen Collaboration to Accelerate Multi-Die System Design for Advanced Samsung Processes (Tuesday, June 27, 2023)
• YorChip and Siloxit Collaborate on Industry's First Secure Data Acquisition Chiplet for Mass Markets (Monday, June 26, 2023)
• Creonic Releases Ultrafast BCH Decoder IP Core, Processing One Codeword per Clock Cycle (Thursday, June 15, 2023)
• Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security (Monday, June 12, 2023)
• Are Chiplets Enough to Save Moore's Law? (Sunday, June 4, 2023)
• Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future (Tuesday, May 30, 2023)
• Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era (Tuesday, May 30, 2023)
• Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets (Tuesday, May 23, 2023)
• Chiplet interconnect handles 40 Gbps/bump (Monday, May 22, 2023)
• proteanTecs' Die-to Die Interconnect Monitoring IP Passes TSMC9000 Pre-Silicon Assessment (Wednesday, May 17, 2023)
• Tenstorrent Selects Arteris IP for AI High-Performance Computing and Datacenter RISC-V Chiplets (Monday, May 1, 2023)
• Signature IP Corporation Demonstrates Configurable NoC Products at Design & Reuse IP SoC Day (Wednesday, April 26, 2023)
• Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications (Tuesday, April 25, 2023)
• Synopsys, TSMC and Ansys Strengthen Ecosystem Collaboration to Advance Multi-Die Systems (Sunday, April 23, 2023)
• The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi (Sunday, April 2, 2023)
• Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon's High-Performance Processors (Wednesday, March 29, 2023)
• Tachyum To Use UCIe Interconnect Standards In Prodigy 2 (Tuesday, March 28, 2023)
• Arteris Unveils Next-Generation FlexNoC 5 Physically Aware Network-on-Chip IP (Tuesday, February 21, 2023)
• Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs (Wednesday, February 8, 2023)
• Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance (Wednesday, February 1, 2023)
• UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow (Tuesday, January 31, 2023)
• Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution (Monday, January 30, 2023)
• All the PCIe 5.0 SSDs Coming Out in the Next Year or So (Sunday, January 8, 2023)
• SNIA Spec Gets Data Moving in CXL Environment (Wednesday, January 4, 2023)
• PEZY Computing Selects proteanTecs to Monitor Die-to-Die Interconnects in Next-Generation Supercomputer Processors (Tuesday, December 20, 2022)
• Are You Ready for PCIe 6.0? (Wednesday, November 16, 2022)
• Alphawave IP Receives 2022 TSMC OIP Partner of the Year Award for High-Speed SerDes IP Innovations (Tuesday, November 8, 2022)
• Arteris FlexNoC Interconnect Licensed by Microchip Technology for Microcontroller Development (Tuesday, November 1, 2022)
• GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring (Wednesday, October 26, 2022)
• Synopsys Collaborates with TSMC to Unleash System Innovation with Most Comprehensive Multi-Die Design Solutions for TSMC's Advanced Technologies (Wednesday, October 26, 2022)
• GUC Unveils GLink 2.3LL, The World's Most Powerful D2D Interconnect IP Using 2.5D Technology (Tuesday, October 25, 2022)
• Siemens Tessent Multi Die Automates 2.5D and 3D Chip DFT (Tuesday, October 25, 2022)
• Intel plans 3nm chiplet for satellite terminal (Monday, October 10, 2022)
• Intel's Road to a Universal Quantum Computer Is Via Chiplets (Monday, October 10, 2022)
• CEO interview: Alphawave IP's Pialis on chiplets and custom silicon (Tuesday, September 20, 2022)
• €16m project to secure the chiplet supply chain in Europe (Monday, September 19, 2022)
• CEO interview: Alphawave IPs Pialis on chiplets and custom silicon (Monday, September 19, 2022)
• proteanTecs Joins UCIe™ (Universal Chiplet Interconnect Express™) Consortium to Advance 2.5D/3D Interconnect Monitoring (Sunday, September 18, 2022)
• Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs (Monday, August 22, 2022)
• Rambus Expands Portfolio of DDR5 Memory Interface Chips for Data Centers and PCs (Monday, July 18, 2022)
• GUC Demonstrate World's First HBM3 PHY, Controller, and CoWoS Platform at 7.2 Gbps (Wednesday, July 6, 2022)
• Innolink - The advanced Chiplet solution complies with the Universal Chiplet Interconnect Express (UCIe) standard (Wednesday, July 6, 2022)
• Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity (Monday, June 20, 2022)
• SmartDV Charts Course Toward Chiplets, Joins Universal Chiplet Interconnect Express (UCIe) (Wednesday, June 15, 2022)
• OpenFive Joins Universal Chiplet Interconnect Express (UCIe) Consortium (Wednesday, June 15, 2022)
• Avery Design Systems Announces Verification Support for New UCIe standard, Accelerating Adoption of Chiplet Interconnect Protocol (Wednesday, June 15, 2022)
• Alphawave IP Announces Availability of Two New Interconnect IP Products in TSMC Advanced Processes (Sunday, June 12, 2022)
• CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput (Wednesday, June 1, 2022)
• MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity (Sunday, May 22, 2022)