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Chiplet / Multi-Die News

• Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead (Thursday, October 28, 2021)
• Rambus Advances Server Memory Performance with the Industry's First 5600 MT/s DDR5 Registering Clock Driver (Tuesday, October 12, 2021)
• Alphawave IP announces production availability of new PCIe-CXL solution on TSMC N5 process for storage and broader chiplet market (Tuesday, October 12, 2021)
• Synopsys Accelerates Multi-Die Designs with Industry's First Complete HBM3 IP and Verification Solutions (Wednesday, October 6, 2021)
• Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform (Wednesday, October 6, 2021)
• Interlaken IP Core for high-speed chip-to-chip applications is now available (Wednesday, October 6, 2021)
• Rambus Delivers CXL 2.0 Controller with Industry-leading Zero-Latency IDE (Tuesday, October 5, 2021)
• Chiplet Strategy is Key to Addressing Compute Density Challenges (Tuesday, September 28, 2021)
• Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions (Tuesday, September 14, 2021)
• Arteris IP FlexNoC Interconnect Licensed for Use in SK Telecom SAPEON AI Chips (Monday, September 6, 2021)
• GUC Announces Industry Highest Bandwidth and Power Efficient Die-to-Die (GLink 2.0) Total Solution (Monday, August 30, 2021)
• Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications (Tuesday, August 17, 2021)