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• AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions (Monday, December 11, 2023)
• SCALINX and Arteris Partner on Advanced Communications Innovation (Monday, December 11, 2023)
• Bluetooth Channel Sounding: Achieving 10cm Ranging Accuracy (Wednesday, December 6, 2023)
• 3GPP to Officially Begin Development of the 6G Specification (Tuesday, December 5, 2023)
• Cadence Powers Samsung Foundry's Breakthrough Success on 5G Chip Design (Sunday, December 3, 2023)
• SPARK Microsystems Revolutionizes Wireless Headsets with Ultra-Wideband Audio Technology (Wednesday, November 8, 2023)
• Ericsson Antenna Technology Germany starts research project for 6G communication technologies (Wednesday, October 11, 2023)
• AccelerComm, Radisys, RFDSP & TTP unveil LEO Regenerative 5G RAN solution (Tuesday, September 19, 2023)
• Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator (Monday, September 18, 2023)
• CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market (Tuesday, September 5, 2023)
• T2M Unveils Top-Selling Gigabit Ethernet PHY IP Core with Unlimited Usage and Full Modification rights, available for licensing immediately (Sunday, August 27, 2023)
• Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 22nm, 40nm, 55nm is Available for Immediate Licensing for TWS, Audio Chipsets and Automotive Applications (Sunday, August 13, 2023)
• Creonic Unveils CCSDS 131.2 Wideband Modulator IP Core Achieving 1 GSymb/s (Wednesday, July 26, 2023)
• Imec Advances GaN-on-Si and InP-on-Si Technologies for Next-Gen Wireless Communication (Monday, July 3, 2023)
• Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 40nm ULP is Available for Immediate Licensing (Sunday, July 2, 2023)
• AccelerComm Announces 5G PUSCH Channel Equalizer (Sunday, July 2, 2023)
• Achronix Pushes the Boundaries of Networking with 400 GbE and PCIe Gen 5.0 for SmartNICs (Monday, June 12, 2023)
• S2C Accelerates Development Timeline of Bluetooth LE Audio SoC (Tuesday, June 6, 2023)
• VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution (Monday, June 5, 2023)
• NVIDIA Collaborates With SoftBank Corp. to Power SoftBank's Next-Gen Data Centers Using Grace Hopper Superchip for Generative AI and 5G/6G (Wednesday, May 31, 2023)
• Apple Signs Multibillion-Dollar Deal with Broadcom for US-Made 5G RF Components (Wednesday, May 24, 2023)
• Silex Technology Announces High-Performance 802.11ah Wi-Fi HaLow SDIO Module (Tuesday, May 23, 2023)
• AccelerComm secures £21.5m funding to supercharge 5G radio performance (Sunday, May 14, 2023)
• Creonic Introduces 25 Gbit/s LDPC IP Core Solution for ITU G.9804.2 PON Standard (Tuesday, May 9, 2023)
• Developing and verifying 5G designs: A unique challenge (Monday, May 8, 2023)
• AccelerComm's LEOphy Shortlisted at SCF Industry Awards 2023 (Tuesday, May 2, 2023)
• UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications (Tuesday, May 2, 2023)
• £21.5m raised to supercharge 5G radio performance | AccelerComm (Sunday, April 30, 2023)
• LC3plus audio codec for various Audio Application Is Available for Immediate Licensing!! (Sunday, April 30, 2023)
• Creonic Introduces FEC IP Core Solution for SDA Free-Space Optical OCT V3.0 Standard (Wednesday, April 26, 2023)
• Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation (Monday, April 24, 2023)
• 6G is Happening, and Here's What You Need to Know (Monday, April 24, 2023)
• Coherent Logix collaborates with Omni Design, AkiraNET Co. and Socionext to deliver reference design for Wi-Fi 6E/7 (Sunday, April 23, 2023)
• UK wireless strategy aims to boost 5G/6G deployment (Monday, April 10, 2023)
• Synopsys Accelerates First-Pass Silicon Success for Banias Labs' Networking SoC (Wednesday, April 5, 2023)
• SoftBank and EdgeCortix Partner to Jointly Realize Low-latency and Highly Energy-efficient 5G Wireless Accelerators (Tuesday, March 21, 2023)
• CEVA Wi-Fi 6 IP Powers ESWIN ECR6600 Smart Connectivity IC (Sunday, March 12, 2023)
• CEVA to Showcase Latest Wireless Connectivity and Smart Sensing Solutions at embedded world 2023 (Wednesday, March 8, 2023)
• Capgemini expands its 5G innovation program with new '5G Solutions Center's in San Francisco (Monday, February 27, 2023)
• Socionext Introduces New 7nm ADC and DAC for 5G Direct RF Transmitters and Receivers (Tuesday, February 21, 2023)
• Qualinx Raises €8 Million to Bring Game-Changing Digital RF Technology to Market (Monday, February 20, 2023)
• Accurate Positioning Systems and Proximity Solutions with CoreHW Bluetooth® AoA and AoD Antenna Modules (Thursday, February 16, 2023)
• Bluetooth SIG Introduces Wireless Standard for Electronic Shelf Label Market (Sunday, February 12, 2023)
• AccelerComm to deliver cell service from space with 5G NTN LEO (Sunday, February 12, 2023)
• CEA-Leti: innovation to fuel 6G wireless communications (Tuesday, January 24, 2023)
• 6G-IA and ETSI to bridge research, standards and industry (Monday, January 23, 2023)
• New Wave DV Releases Two New SOSA-Aligned 3U VPX ACAP (FPGA) Modules (Sunday, January 22, 2023)
• Comcores TSN technology and 5G communication expertise to be deployed in a significant EU funded project with pan-European partners (Thursday, January 19, 2023)
• Automotive-grade module marries Wi-Fi 6E, Bluetooth LE Audio (Wednesday, January 18, 2023)
• Stadia's Bluetooth controller tool now live so users can connect to other devices (Monday, January 16, 2023)