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• Creonic DVB-GSE Encapsulator and Decapsulator IP Cores Are Now Available with Data Rates of up to 4Gbit/s (Wednesday, January 11, 2023)
• Sino Wealth License and Deploy CEVA Bluetooth® Low Energy IP for its Connectivity MCUs (Thursday, January 5, 2023)
• CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution (Wednesday, January 4, 2023)
• 6G project aims to connect cars and drones (Tuesday, December 27, 2022)
• UK government to invest £110m in 5G and 6G research (Sunday, December 18, 2022)
• IEEE802.11n/ac/ax Wi-Fi LDPC Encoder and Decoder FEC IP Core Available For Licensing and Implementation from Global IP Core (Monday, December 5, 2022)
• A 6G Tree Grows in Brooklyn? (Tuesday, November 29, 2022)
• Cadence and UMC Certified mmWave Reference Flow Delivers First-Pass Silicon Success (Tuesday, November 29, 2022)
• China stretches its 6G lead with successful tests; U.S. turns to Nokia and Ericsson (Saturday, November 26, 2022)
• IPrium releases CCSDS TM Telemetry AR4JA LDPC Encoder and Decoder (Wednesday, November 23, 2022)
• Ericsson to set up 6G research centre in UK (Monday, November 21, 2022)
• EASii IC announces first silicon for its DVB-S2X satellite Modem ASIC (Monday, November 14, 2022)
• CEVA Introduces Voice User Interface Solution for TI SimpleLink™ Wi-Fi® Wireless MCUs (Monday, November 14, 2022)
• Guerrilla RF Starts Sampling its Second Series of Digital Step Attenuators Based on Rapid Fire™ Technology (Thursday, November 10, 2022)
• Creonic Participates in 6G Research Project Led by Deutsche Telekom (Thursday, November 3, 2022)
• Surecore's Low Power Memory Delivers Improved Power Efficiency For BLE-Enabled Devices (Tuesday, November 1, 2022)
• Synopsys, Ansys and Keysight Accelerate 5G/6G SoC Designs with New mmWave Reference Flow for TSMC Process Technology (Wednesday, October 26, 2022)
• TCP/IP Hardware Stack IP Core now Available from CAST (Wednesday, October 12, 2022)
• Creonic Releases DVB-RCS2 Multi-carrier Satellite Receiver IP Core (Thursday, October 6, 2022)
• Credo Introduces Screaming Eagle 112G Retimer DSP with Industry Leading 1.6 Terabit Capacity (Tuesday, October 4, 2022)
• Cadence and Samsung Foundry Collaborate to Certify RFIC Design Reference Flow on 8nm Process Technology (Monday, October 3, 2022)
• IPrium releases IEEE 802.11n/ac/ax LDPC Encoder and Decoder (Wednesday, September 21, 2022)
• Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks (Wednesday, September 21, 2022)
• CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs (Tuesday, September 20, 2022)
• Expect to Find Some Thorns in 5G's Bed of Roses (Sunday, September 18, 2022)
• Ubilite Introduces a Wi-Fi Chip With Less-Than-Bluetooth Power Consumption (Wednesday, September 14, 2022)
• Credo Targets Hyperscale Data Centers and 5G Networks with New Optical DSPs (Tuesday, September 13, 2022)
• Global IP Core Announces the Availability of The WiMAX IEEE802.16e Modem and FEC IP Core For Licensing and Integration (Monday, September 12, 2022)
• How 5G Has Changed Engineering Design (Monday, September 12, 2022)
• 1G Ethernet PHY IP Cores solution for all your Gigabit network applications is available of immediate licensing!! (Sunday, September 11, 2022)
• Sequans Communications Closes Multi-Year Strategic 5G Partnership Agreement (Monday, August 29, 2022)
• Arm Chips Gaining in Data Centers, But Still in Single Digits (Sunday, August 28, 2022)
• DSP for 800G data centre networking (Sunday, August 28, 2022)
• Autotalks Enhances 5G C-V2X Chipsets with proteanTecs Deep Data Analytics (Tuesday, August 16, 2022)
• Nordic Semiconductor announces its first Wi-Fi chip, the dual-band Wi-Fi 6 nRF7002 (Monday, August 15, 2022)
• Renesas looks to simplify industrial ethernet implementations (Monday, August 8, 2022)
• Avery Announces 800G Ethernet VIP virtual network co-simulation platform, enabling SoC pre-silicon validation in real networked application environments (Monday, August 1, 2022)
• Silicon Labs Selects CoreHW Advanced Bluetooth AoA Switch for Dual Polarized Antenna Array Pro Kit (Sunday, July 24, 2022)
• Accelercomm Launches LEOphy for Low-Earth Orbit 5G Satellites (Monday, July 18, 2022)
• Synopsys Delivers Higher Productivity and Quality for Advanced-Node 5G/6G SoCs on Samsung Foundry's Low-Power Process (Sunday, July 10, 2022)
• Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions (Tuesday, June 28, 2022)
• GbE (10/100/1000 Base-T) PHY IP licensed by 3 different customers in Q2 alone for Worldwide Use (Sunday, June 26, 2022)
• Ansys and TSMC Collaborate to Deliver Multiphysics Design Methodology for Wireless Chips (Sunday, June 26, 2022)
• Synopsys Boosts 5G SoC Development Productivity with New RF Design Flow for TSMC N6RF Process (Thursday, June 16, 2022)
• Cadence RFIC Solutions Support TSMC N6RF Design Reference Flow (Thursday, June 16, 2022)
• Wi-Fi 6 (AX)/BLE/15.4 22nm Combo RF IP Core, Licensed to a leading Chinese Semiconductor Company for IoT Chipset (Sunday, June 12, 2022)
• Spectronite introduces a high-performance 5G wireless solution for mobile operators (Tuesday, June 7, 2022)
• CEVA Bluetooth® 5.3 Platform IP Supports New Auracast™ Broadcast Audio, Transforming the Shared Audio Experience (Tuesday, June 7, 2022)
• Credo Introduces Industry Leading 40Gbps PAM3 SerDes Technology To Address New Markets Requiring High-speed, Low-Power Connectivity (Wednesday, June 1, 2022)
• X-FAB Adopts Cadence EMX Solver's Electromagnetic Simulation Technology to Support Innovative RF Designs Targeted at Communication and Automotive Markets (Monday, May 23, 2022)