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• Arteris IP FlexNoC Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems (Monday, March 18, 2019)
• Facebook Buys Interconnect IP Vendor Sonics (Tuesday, March 12, 2019)
• Arteris IP FlexNoC Interconnect Licensed by Lynxi Technologies for Artificial Intelligence (AI) Chips (Monday, March 4, 2019)
• Nurlink Launches NB-IoT and GNSS SoC Powered by CEVA-Dragonfly NB2 IP (Tuesday, February 19, 2019)
• AccelerComm Lands Funding for 5G New Radio and 4G LTE Networks IP (Monday, February 11, 2019)
• SoC-e networking IP porfolio extends with SpaceWire: The standard for Spacecraft communication networks (Thursday, February 7, 2019)
• The Race To Multi-Domain SoCs (Wednesday, February 6, 2019)
• Arteris IP FlexNoC Interconnect Used by NationalChip for Set Top Box (STB) Chips (Monday, February 4, 2019)
• CEVA Locates More Success with Bluetooth 5.1 IP (Monday, January 28, 2019)
• Arteris IP FlexNoC Interconnect Licensed by NETINT Technologies for PCIe 4.0 Enterprise SSD Controllers (Monday, January 21, 2019)
• Arteris IP FlexNoC Interconnect Licensed by Baidu for Kunlun AI Cloud Chips for Data Center (Monday, January 14, 2019)
• Advanced ATSC 3.0 Chip Launched for Mobile and Broadcast Applications (Monday, January 7, 2019)
• Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC (Monday, January 7, 2019)
• 5G: The most powerful letter and number this year (Sunday, January 6, 2019)
• Bestechnic Licenses CEVA Bluetooth 5 Dual Mode IP for its Audio Platforms (Wednesday, January 2, 2019)
• Wi-Fi Startups Polish HaLow for IoT (Wednesday, January 2, 2019)
• Taiwanese startup to fuel 5G era with 2228ppi AMOLED displays (Tuesday, January 1, 2019)
• Optek Licenses and Deploys CEVA Bluetooth IP in its latest Multimedia Platform (Tuesday, January 1, 2019)
• CEVA Reaches New Milestone with 10th Design Win for its SIG Qualified Bluetooth Mesh IP (Wednesday, December 26, 2018)
• 5G Networks Under Construction (Tuesday, December 18, 2018)
• CEVA's Bluetooth 5 Low Energy Software and Link Layer IP Integrate with Atmosic Technologies Solutions for Battery-Free IOT Devices (Wednesday, December 5, 2018)
• Sonova License and Deploy CEVA Bluetooth IP in SWORD 3.0 Wireless Chip for Hearing Aids (Monday, November 26, 2018)
• TSN IP Core making devices fit for real-time Ethernet (Tuesday, November 20, 2018)
• Blu Wireless Technology announces the HYDRA 2.X family of System IP for 802.11ay mmWave applications (Monday, November 19, 2018)
• Corigine and New H3C Enable Mass Deployment of High-Performance Network Routers (Monday, November 5, 2018)
• Arteris FlexNoC Interconnect IP Licensed by Enflame (Suiyuan) Technology for Multiple Artificial Intelligence (AI) Chips (Monday, October 8, 2018)
• TSN Ethernet Subsystem Available from CAST Proven at IIC and LNI Plugfests (Tuesday, September 4, 2018)
• BlueX License CEVA Bluetooth Low Energy IP for BX2400 Wearable SoC (Wednesday, June 27, 2018)
• 7nm networking platform delivers unprecedented performance and configurability for data center ASICs (Monday, June 25, 2018)
• Microsemi Collaborates with China Telecom to Deliver Optimized OTN Solution for 5G (Tuesday, June 12, 2018)
• HunterSun Corporation Licenses AndesCore N1068A-S for Its HS6601 Single-Chip Bluetooth SoC Targeting Wireless Audio Applications (Monday, June 11, 2018)
• National Instruments Adopts AccelerComm's 5G NR Polar IP (Monday, June 11, 2018)
• T2M and Mindtree to showcase cutting-edge BQB-qualified Mesh SW and Bluetooth 5 IP at Bluetooth Asia, Shenzhen (Tuesday, May 15, 2018)
• Meet T2M at Bluetooth Asia (Thursday, May 10, 2018)
• What does it mean to be an always on, always connected mobile PC? (Sunday, May 6, 2018)
• Aldec and Tamba Networks Release Ultra Low Latency Ethernet Solution for UltraScale+ FPGA at The Trading Show 2018 (Wednesday, May 2, 2018)
• New MIPS I7200 Processor Core Delivers Unmatched Performance and Efficiency For Advanced LTE/5G Communications And Networking IC Designs (Monday, April 30, 2018)
• Mindtree announces BQB qualification of its Bluetooth Mesh v1.0 Software Stack and EtherMind Bluetooth v5.0 Software Stack & Profiles (Tuesday, March 27, 2018)
• Arteris FlexNoC Interconnect IP Powers DJI Drones (Monday, March 26, 2018)
• Credo Demonstrates Robust, Low-Power 112G PAM4 Solutions at OFC 2018 (Monday, March 12, 2018)
• Arteris IP FlexNoC Interconnect Licensed by VeriSilicon for Multiple Chip Designs (Monday, March 12, 2018)
• Lattice launches 12Gbps wireless connector (Monday, March 5, 2018)
• EU puts 20 year span on 5G spectrum licences (Sunday, March 4, 2018)
• Ceva adds power DSP to Nokia 5G network (Thursday, March 1, 2018)
• CEVA and Nokia Collaborate for 4.9G and 5G Technologies (Wednesday, February 28, 2018)
• CEVA Introduces PentaG™ - A Comprehensive 5G New Radio Enhanced Mobile Broadband IP Platform for Smartphones, Fixed Wireless Access and Embedded Devices (Wednesday, February 21, 2018)
• Vidatronic, Inc. Awarded National Science Foundation Grant for the Development of High Performance CMOS Transmitters for Wireless Applications (Tuesday, February 20, 2018)
• SoC-e's MTSN Switch IP Core solution now supports 802.1AB (LLDP) (Tuesday, February 20, 2018)
• Unexpected Help for Simulation from Machine Learning (Monday, February 12, 2018)
• Aldec Launches Novel FPGA-based Networking Solution (Tuesday, February 6, 2018)