Search News

Other News

• Reconfigurable AI Building Blocks For SoCs And MCUs (Monday, July 9, 2018)
• Maxim Works With Qualcomm Automotive Solutions on Infotainment Applications for the Smart, Connected Car (Monday, July 9, 2018)
• TSMC's June sales disappoint (Monday, July 9, 2018)
• Stratix 10 SoC: REFLEX CES is releasing to market its new version of the COM Express module based on Stratix 10 SoC technology from Intel PSG (Monday, July 9, 2018)
• TSMC June 2018 Revenue Report (Monday, July 9, 2018)
• GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX Technology (Monday, July 9, 2018)
• GUC Monthly Sales Report - June 2018 (Wednesday, July 4, 2018)
• SMIC vice chairman Tzu-Yin Chiu resigns (Wednesday, July 4, 2018)
• Topco Scientific expects silicon wafer supply to stay tight till 2025 (Wednesday, July 4, 2018)
• Samsung Foundry and Arm Expand Collaboration to Drive High-Performance Computing Solutions (Wednesday, July 4, 2018)
• Cadence teams with Google, Microsoft, Amazon, on cloud-based EDA (Tuesday, July 3, 2018)
• Tower, Soitec, Maxscend ramp RFSOI (Tuesday, July 3, 2018)
• Chip Industry Posts Another Monthly Sales Record (Monday, July 2, 2018)
• ZTE given temporary reprieve from U.S.; removes more executives (Monday, July 2, 2018)
• Synopsys and Siemens Team Up to Expand and Extend Electronic Design Automation Collaboration (Monday, July 2, 2018)
• Chinese Court Said to Block Sale of Some Micron Chips (Monday, July 2, 2018)
• Taiwan Semiconductor Manufacturing Company - It's Not About Crypto, It's About Blockchain (Monday, July 2, 2018)
• Silex Inside releases a secure connection engine (Monday, July 2, 2018)
• Cadence Full-Flow Digital and Signoff Tools Certified on Samsung Foundry's 7LPP Process Technology (Monday, July 2, 2018)
• A Path to Broad AI: 5 Challenges (Wednesday, June 27, 2018)
• Siemens buys expert for Functional Safety IP (Tuesday, June 26, 2018)
• Eta Compute, Rohm team on IoT sensor nodes (Tuesday, June 26, 2018)
• Apple iPhone 2018's chips hit production lines, to be built on 7 nm process by TSMC (Tuesday, June 26, 2018)
• Cadence Perspec System Verifier Supports New Accellera Portable Test and Stimulus Specification 1.0 (Tuesday, June 26, 2018)
• Mentor extends support of tools and solutions for Samsung Foundry's 8LPP and 7LPP process technologies (Tuesday, June 26, 2018)
• Rambus Renews License With IBM (Tuesday, June 26, 2018)
• Learn how Arm and partners can help you get a custom chip from concept to production (Tuesday, June 26, 2018)
• Silicon Creations' SerDes Technology Helps Power Leading-Edge 8K TV (Monday, June 25, 2018)
• Spectral releases Silicon proven High Speed Low Power SRAM compilers in the 40/45nm CMOS/RFSOI process nodes targeted for a wide range of IOT & 5G Applications (Monday, June 25, 2018)
• Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment - SAVE (Monday, June 25, 2018)
• Optimum Semiconductor Unveils New Image Recognition SoC (Monday, June 25, 2018)
• 7nm, 5nm and 3nm Logic, current and projected processes (Sunday, June 24, 2018)
• SoftBank confirms sell-off of ARM China stake (Wednesday, June 20, 2018)
• Taiwan's TSMC to Invest $25 Billion in 5 Nanometer Node Technology (Wednesday, June 20, 2018)
• TSMC's May sales show continued strength (Tuesday, June 19, 2018)
• GlobalFoundries' UHV 180nm Process Hits 700V (Tuesday, June 19, 2018)
• T2M to showcase cutting-edge Cellular and Low Power Wireless IoT technologies at MWC Shanghai 2018 (Tuesday, June 19, 2018)
• PLDA Announces Second Annual "PLDA Design Day", in Shanghai, China - a Free Design Workshop, 100% Focused on PCIe Design (Tuesday, June 19, 2018)
• North American Semiconductor Equipment Industry Posts May 2018 Billings (Monday, June 18, 2018)
• Samsung to Pay $400 Million for Infringing FinFET Patent (Monday, June 18, 2018)
• Intrinsic ID Names Kumi Thiruchelvam Vice President, Europe & Asia Sales (Monday, June 18, 2018)
• Arasan Announces SD Card UHS-II PHY IP for 12nm SoC Designs (Monday, June 18, 2018)
• EDA know-how for safe Power Regulation Networks implementation unveiled at ENIAC's THINGS2DO E.U. project final review. (Sunday, June 17, 2018)
• USB 3.0 – A Cost Effective High Bandwidth Solution for FPGA Host Interface (Wednesday, June 13, 2018)
• Synopsys Fusion Technology Enables Lower Power, Smaller Area, and Higher Performance on Samsung Foundry 7LPP Process with EUV (Wednesday, June 13, 2018)
• Spin the Arm Virtual Prize Wheel at DAC 2018 (Wednesday, June 13, 2018)
• Layout Database File Control: The Missing Link (Wednesday, June 13, 2018)
• Xpeedic's IRIS Certified for EM Simulation in GLOBALFOUNDRIES 22FDX Process (Tuesday, June 12, 2018)
• Arm Expands IoT Connectivity and Device Management Capabilities with Stream Technologies Acquisition (Tuesday, June 12, 2018)
• Synopsys Enables Secure App Development with Coverity Enhancements and Integrated Security Training Platform (Monday, June 11, 2018)