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• Chipus grows its battery charger IP family (Tuesday, May 22, 2018)
• Arasan and Test Evolution announce Industry's first C-PHY / D-PHY Combo Compliance Analyzer with Arasan's Total MIPI IP Solution (Tuesday, May 22, 2018)
• ST's New CEO Not Ruling Out Acquisitions in Quest for Growth (Tuesday, May 22, 2018)
• SmartDV Announces OpenCAPI Verification IP (VIP) (Tuesday, May 22, 2018)
• GLOBALFOUNDRIES Announces Industry's Most Advanced Automotive-Qualified Production FD-SOI Process Technology (Tuesday, May 22, 2018)
• Synopsys Design Platform Certified for Samsung 8LPP Process Technology (Tuesday, May 22, 2018)
• IP Cores, Inc. Announces Shipment of a 32-bit Version of its Ultra Low Power FFT IP Core (Tuesday, May 22, 2018)
• Cadence Full-Flow Digital and Signoff Tools Certified on Samsung's 8LPP Process Technology (Tuesday, May 22, 2018)
• Foundries encouraging fabless chipmakers to switch to 12-inch wafers (Tuesday, May 22, 2018)
• Apple partner TSMC begins mass production of 7-nanometer 'A12' processors for this year's iPhones (Monday, May 21, 2018)
• Rising 8-inch foundry quotes putting pressure on IC designers (Monday, May 21, 2018)
• Microsemi's New 30 kW Three-Phase Vienna PFC Reference Design Leveraging its Leading SiC Diodes and MOSFETs Offers High Ruggedness and Performance (Monday, May 21, 2018)
• Sony buys EMI as part of transition strategy (Monday, May 21, 2018)
• Microsoft acquires conversational AI startup (Monday, May 21, 2018)
• Samsung reportedly started an R&D division for its foundry business (Sunday, May 20, 2018)
• Open-Silicon to Demonstrate its HBM2 IP Subsystem Solution for High Performance Computing Applications, and Showcase its Comprehensive IP Subsystem Solution for High-End Networking Applications at TSMC Technology Symposium 2018 (Friday, May 18, 2018)
• RF SOI Wars Begin (Wednesday, May 16, 2018)
• Arm TechCon 2018 (Wednesday, May 16, 2018)
• Samsung Lengthens Chip Sales Lead Over Intel (Tuesday, May 15, 2018)
• Presto Engineering Joins GLOBALFOUNDRIES Ecosystem as ASIC Partner (Monday, May 14, 2018)
• GlobalFoundries says it needs to build a new fab to compete (Sunday, May 13, 2018)
• TSMC April 2018 Revenue Report (Thursday, May 10, 2018)
• So is GlobalFoundries profitable? Yes and no... (Thursday, May 10, 2018)
• Express Logic's X-Ware IoT Platform Brings Industrial-Grade IoT Device Connectivity to the AndesCore N25 and NX25 RISC-V Processors (Wednesday, May 9, 2018)
• Silvaco Announces Relocation of Headquarters within Santa Clara (Wednesday, May 9, 2018)
• Adesto Announces Acquisition of S3 Semiconductors (Wednesday, May 9, 2018)
• Sankalp Semiconductor Strengthens Management Team (Wednesday, May 9, 2018)
• UMC Reports Sales for April 2018 (Tuesday, May 8, 2018)
• Arasan Announces Industries First MIPI I3C Master IP Core compliant to the I3C HCI Specifications v1.0 (Tuesday, May 8, 2018)
• MIPI Alliance Introduces Set of Touch Specifications to Standardize Touch Integration in Mobile Designs (Tuesday, May 8, 2018)
• Movellus Closes Funding from Intel Capital for Digital Tool Expansion Technology (Tuesday, May 8, 2018)
• videantis moves into new office to support growth (Tuesday, May 8, 2018)
• ARM loses IP market share to fast-growing followers (Tuesday, May 8, 2018)
• CEVA, Inc. Announces First Quarter 2018 Financial Results (Tuesday, May 8, 2018)
• SMIC Reports 2018 First Quarter Results (Tuesday, May 8, 2018)
• IntelliProp Announces NVMe-to-SATA Bridge IP Core (Tuesday, May 8, 2018)
• Taiwan shares end higher, led by TSMC (Tuesday, May 8, 2018)
• Comcores Announce Availability of flexible eCPRI IP solution (Monday, May 7, 2018)
• SiFive Announces Investment from Intel Capital (Monday, May 7, 2018)
• TSMC Details 5 nm Process Tech: Aggressive Scaling, But Thin Power and Performance Gains (Monday, May 7, 2018)
• Chinese chip manufacturers to tap TSMC's 7nm process for next-gen AI chips (Monday, May 7, 2018)
• Mentor enhances tool portfolio for TSMC 5nm FinFET and 7nm FinFET Plus processes and Wafer-on-Wafer stacking technology (Tuesday, May 1, 2018)
• Credo Demonstrates 112G PAM4 and 56G PAM4 SerDes IP Solutions at TSMC 2018 Technology Symposium (Tuesday, May 1, 2018)
• New MIPI I3C Host Controller Interface Speeds Sensor Integration (Tuesday, May 1, 2018)
• TSMC's Roadmap Full, But Thin (Tuesday, May 1, 2018)
• DFI Group Releases Initial Version of the DFI 5.0 Specification for High-Speed Memory Controller and PHY Interface (Tuesday, May 1, 2018)
• Cadence Supports New TSMC WoW Advanced Packaging Technology (Monday, April 30, 2018)
• Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation (Monday, April 30, 2018)
• Sankalp Semiconductor to Participate in Panel Discussion at The Annual SOI Silicon Valley Symposium (Wednesday, April 25, 2018)
• Achronix's Increased Revenue, Expanding Workforce Drives Move to Larger Corporate Headquarters (Wednesday, April 25, 2018)