Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
IP-SoC 2021
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Register
Login
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Register
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
IP-SoC 2021
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
Other News
Microsemi's New 30 kW Three-Phase Vienna PFC Reference Design Leveraging its Leading SiC Diodes and MOSFETs Offers High Ruggedness and Performance
(Monday, May 21, 2018)
Rising 8-inch foundry quotes putting pressure on IC designers
(Monday, May 21, 2018)
Apple partner TSMC begins mass production of 7-nanometer 'A12' processors for this year's iPhones
(Monday, May 21, 2018)
Samsung reportedly started an R&D division for its foundry business
(Sunday, May 20, 2018)
Open-Silicon to Demonstrate its HBM2 IP Subsystem Solution for High Performance Computing Applications, and Showcase its Comprehensive IP Subsystem Solution for High-End Networking Applications at TSMC Technology Symposium 2018
(Friday, May 18, 2018)
Arm TechCon 2018
(Wednesday, May 16, 2018)
RF SOI Wars Begin
(Wednesday, May 16, 2018)
Samsung Lengthens Chip Sales Lead Over Intel
(Tuesday, May 15, 2018)
Presto Engineering Joins GLOBALFOUNDRIES Ecosystem as ASIC Partner
(Monday, May 14, 2018)
GlobalFoundries says it needs to build a new fab to compete
(Sunday, May 13, 2018)
So is GlobalFoundries profitable? Yes and no...
(Thursday, May 10, 2018)
TSMC April 2018 Revenue Report
(Thursday, May 10, 2018)
Sankalp Semiconductor Strengthens Management Team
(Wednesday, May 9, 2018)
Adesto Announces Acquisition of S3 Semiconductors
(Wednesday, May 9, 2018)
Silvaco Announces Relocation of Headquarters within Santa Clara
(Wednesday, May 9, 2018)
Express Logic's X-Ware IoT Platform Brings Industrial-Grade IoT Device Connectivity to the AndesCore N25 and NX25 RISC-V Processors
(Wednesday, May 9, 2018)
Taiwan shares end higher, led by TSMC
(Tuesday, May 8, 2018)
IntelliProp Announces NVMe-to-SATA Bridge IP Core
(Tuesday, May 8, 2018)
SMIC Reports 2018 First Quarter Results
(Tuesday, May 8, 2018)
CEVA, Inc. Announces First Quarter 2018 Financial Results
(Tuesday, May 8, 2018)
ARM loses IP market share to fast-growing followers
(Tuesday, May 8, 2018)
videantis moves into new office to support growth
(Tuesday, May 8, 2018)
Movellus Closes Funding from Intel Capital for Digital Tool Expansion Technology
(Tuesday, May 8, 2018)
MIPI Alliance Introduces Set of Touch Specifications to Standardize Touch Integration in Mobile Designs
(Tuesday, May 8, 2018)
Arasan Announces Industries First MIPI I3C Master IP Core compliant to the I3C HCI Specifications v1.0
(Tuesday, May 8, 2018)
UMC Reports Sales for April 2018
(Tuesday, May 8, 2018)
Chinese chip manufacturers to tap TSMC's 7nm process for next-gen AI chips
(Monday, May 7, 2018)
TSMC Details 5 nm Process Tech: Aggressive Scaling, But Thin Power and Performance Gains
(Monday, May 7, 2018)
SiFive Announces Investment from Intel Capital
(Monday, May 7, 2018)
Comcores Announce Availability of flexible eCPRI IP solution
(Monday, May 7, 2018)
DFI Group Releases Initial Version of the DFI 5.0 Specification for High-Speed Memory Controller and PHY Interface
(Tuesday, May 1, 2018)
TSMC's Roadmap Full, But Thin
(Tuesday, May 1, 2018)
New MIPI I3C Host Controller Interface Speeds Sensor Integration
(Tuesday, May 1, 2018)
Credo Demonstrates 112G PAM4 and 56G PAM4 SerDes IP Solutions at TSMC 2018 Technology Symposium
(Tuesday, May 1, 2018)
Mentor enhances tool portfolio for TSMC 5nm FinFET and 7nm FinFET Plus processes and Wafer-on-Wafer stacking technology
(Tuesday, May 1, 2018)
Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation
(Monday, April 30, 2018)
Cadence Supports New TSMC WoW Advanced Packaging Technology
(Monday, April 30, 2018)
Xilinx Reports Record Annual And Quarterly Revenues
(Wednesday, April 25, 2018)
Silicon Creations Showcases Latest IP Portfolio at TSMC Technology Symposium
(Wednesday, April 25, 2018)
Achronix's Increased Revenue, Expanding Workforce Drives Move to Larger Corporate Headquarters
(Wednesday, April 25, 2018)
Sankalp Semiconductor to Participate in Panel Discussion at The Annual SOI Silicon Valley Symposium
(Wednesday, April 25, 2018)
Samsung's Chip Sales Leadership May be Fleeting
(Tuesday, April 24, 2018)
North American Semiconductor Equipment Industry Posts March 2018 Billings
(Tuesday, April 24, 2018)
Partner in Imagination's owner convicted of insider trading
(Tuesday, April 24, 2018)
TSMC Continues to Dominate the Worldwide Foundry Market
(Tuesday, April 24, 2018)
China's upstart chip companies aim to topple Samsung, Intel and TSMC
(Tuesday, April 24, 2018)
M31 Technology Deploys the Full Range of IP for TSMC 22nm ULP/ULL Process
(Tuesday, April 24, 2018)
Cadence Reports First Quarter 2018 Financial Results
(Monday, April 23, 2018)
3 Things That TSMC Wants You to Know About Its 7-Nano Tech
(Sunday, April 22, 2018)
Chipmakers' Rout Widens After TSMC Ignites Smartphone Fears
(Friday, April 20, 2018)
|
Previous
|
12
|
13
|
14
|
...
|
Next
|
Did you miss last D&R News Alerts ?