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• GlobalFoundries partners with Capital Region BOCES (Saturday, January 20, 2018)
• Soitec revenues up 25% (Wednesday, January 17, 2018)
• TSMC Reports Fourth Quarter EPS of NT$3.83 (Wednesday, January 17, 2018)
• EUV, 7nm Road Maps Detailed (Wednesday, January 17, 2018)
• Global chip market is steady as she booms (Tuesday, January 16, 2018)
• Broadcom Versus Qualcomm Update (Sunday, January 14, 2018)
• Mentor Investigates Using Neural Networks for CMP Modeling (Thursday, January 11, 2018)
• MIPS Returns to Silicon Valley To Drive Next Generation of Intelligent Applications (Tuesday, January 9, 2018)
• Global SoC Design Service Provider, Incise announces the appointment of T2M for global marketing, representation & business development (Tuesday, January 9, 2018)
• Apple supplier TSMC posts 3% annual sales increase (Tuesday, January 9, 2018)
• Synopsys Expands DesignWare IP Portfolio with Acquisition of Kilopass Technology (Tuesday, January 9, 2018)
• STMicroelectronics Selects GLOBALFOUNDRIES 22FDX to Extend Its FD-SOI Platform and Technology Leadership (Monday, January 8, 2018)
• Arteris IP FlexNoC Interconnect Licensed by Nationz Technologies for Ultra-Low Power Security IoT Chips (Monday, January 8, 2018)
• eSilicon announces 7nm FinFET ASIC design win (Monday, January 8, 2018)
• videantis introduces new processor and tools for deep learning (Monday, January 8, 2018)
• China, Samsung Rise in U.S. Patents (Monday, January 8, 2018)
• Solar wafer production to see over-capacity by year-end 2018 (Monday, January 8, 2018)
• IFI CLAIMS Announces 2017 Top U.S. Patent Recipients (Monday, January 8, 2018)
• Chip Sales Grew 22% in 2017, Gartner Says (Thursday, January 4, 2018)
• TSMC to outpace Samsung in 7nm volume production in 2018 (Wednesday, January 3, 2018)
• Smartphone Production Projected to Increase 5% (Wednesday, January 3, 2018)
• Samsung Optimizes Premium Exynos 9 Series 9810 for AI Applications and Richer Multimedia Content (Wednesday, January 3, 2018)
• MIPI Alliance Enhances its MIPI NIDnT Debug and Test Specification to Enable Debugging over the Latest USB Type-C Connectors (Wednesday, January 3, 2018)
• Global Semiconductor Sales Increase 21.5 Percent Year-to-Year in November (Tuesday, January 2, 2018)
• CEVA's Bluetooth 5 Low Energy IP certified with Ellisys Bluetooth Compliance Tester (Tuesday, January 2, 2018)
• OmniVision's First 0.9 Micron Pixel Image Sensor Family Enables Best-in-Class Performance and Features for High-End Smartphones (Tuesday, January 2, 2018)
• Qualcomm's New Spectra ISP and Camera Modules Enable Nextgen AR (Tuesday, January 2, 2018)
• Hardent IP Portfolio Supports New Features of HDMI 2.1 Specification (Tuesday, January 2, 2018)
• Himax Technologies, Inc. to Attend CES on January 8th - 10th , 2018 (Tuesday, January 2, 2018)
• China major AI chipmakers maintain partnerships with TSMC (Monday, January 1, 2018)
• Baidu Selects ON Semiconductor Image Sensors for its Apollo Autonomous Driving Platform (Monday, January 1, 2018)
• Samsung, Micron, and NVIDIA Are 2017's Biggest Winners (Monday, January 1, 2018)
• Silicon Valley AI Chip Startup Gyrfalcon Technology Competes with Intel with its Newly Launched USB Stick (Sunday, December 31, 2017)
• Globalfoundries gearing up to tap lucrative automotive chip market (Wednesday, December 27, 2017)
• Intel fails to match TI's 25 year record as No.1 (Tuesday, December 26, 2017)
• Chipus Microelectronics receives ISO 9001 certification (Thursday, December 21, 2017)
• Qualcomm's Snapdragon 855 Will Be Manufactured Using TSMC's 7nm Node; Chip Giant Will Return To Samsung In 2019 (Thursday, December 21, 2017)
• UMC Announces Availability of 40nm SST Embedded Flash Process (Wednesday, December 20, 2017)
• 2017 Top Ten Foundries: TSMC, GLOBALFOUNDARIES, UMC, SAMSUNG and SMIC are ranked the top 5 (Wednesday, December 20, 2017)
• Moortec: The Implementation of Embedded PVT Monitoring Subsystems in Today's Cutting Edge Technologies. (Wednesday, December 20, 2017)
• Microchip releases COTS-based rad-tolerant solution (Wednesday, December 20, 2017)
• M31 Technology launches the world's first 28nm certified USB 3.1 Gen 2 IP solution with Corigine (Wednesday, December 20, 2017)
• Engineer Spotlight: Shafy Eltoukhy, Head of SiFive's DesignShare Program (Wednesday, December 20, 2017)
• Samsung in Production of Second-gen 10nm DRAM (Tuesday, December 19, 2017)
• Samsung to Unveil Wall-Mountable Lifestyle Soundbar at CES 2018 (Tuesday, December 19, 2017)
• Semiconductor Equipment Sales Back on the Rise (Tuesday, December 19, 2017)
• Aggressive Push into New Growth Markets the "New Normal" at Intel (Tuesday, December 19, 2017)
• Broadcom Ships Tomahawk 3, Industry's Highest Bandwidth Ethernet Switch Chip at 12.8 Terabits per Second (Monday, December 18, 2017)
• Implementation of an Architectural Formal Verification Methodology by ArterisIP (Monday, December 18, 2017)
• STMicro Buys IDE Supplier Atollic (Monday, December 18, 2017)