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• SMIC : Donation of RMB 10 million to support the frontline to fight the novel coronavirus epidemic (Thursday, February 6, 2020)
• UMC Announces 14nm certification on Mentor's Calibre Eco Fill Flow (Sunday, February 2, 2020)
• Intel Moving Select CPU Manufacturing to GlobalFoundries (Monday, January 27, 2020)
• TSMC Announces Winners of First IC Layout Contest (Sunday, January 19, 2020)
• 5G to Drive Doubling of SOI Market by 2024, says Digitimes Research (Sunday, January 19, 2020)
• Global Semiconductor Market Likely to Grow 6% in 2020, reports SIA (Thursday, January 2, 2020)
• Our 2020 tech predictions: Samsung, Surface Duo, 5G and Elon Musk (Monday, December 30, 2019)
• China semiconductor equipment expense to see double-digit growth (Monday, December 30, 2019)
• A View of the Future for GLOBALFOUNDRIES (Sunday, December 29, 2019)
• 5 Innovations That Will Dominate CES 2020 (Sunday, December 29, 2019)
• Teardown Reveals Globalfoundries 22FDX Shipping In End Products Like Google's 2nd Gen Nest Mini (Friday, December 27, 2019)
• What Worked, What Didn't In 2019 (Wednesday, December 18, 2019)
• Japan Symposium '19 Summaries Part 1 – 5G/RF-SOI (Tuesday, December 17, 2019)
• SOI Consortium 2019/20 New Members AMAT, Analog Bits, Antaios, Silicon Catalyst, SmarterMicro, Thalia (Tuesday, December 3, 2019)
• SiFive Welcomes Stuart Ching As Chief Revenue Officer (Wednesday, November 20, 2019)
• SMIC Proposed Issue of US$200 Million Zero Coupon Convertible Bonds (Monday, November 18, 2019)
• Jim Cable (pSemi) & Herb Huang (Ningbo Semi) Honored for Pioneering RF-SOI Work (Sunday, November 17, 2019)
• TSMC Board of Directors Meeting Resolutions (Monday, November 11, 2019)
• TSMC adding 8,000 new jobs as it focuses on 3nm and beyond (Sunday, November 3, 2019)
• Rambus Achieves Industry-Leading GDDR6 Performance at 18 Gbps (Wednesday, October 30, 2019)
• Attopsemi Published Two Papers About Innovative I-fuse™ 0.4V/1uA read and 250°C Bake Reliability Data on 22nm FD-SOI at IEEE S3S Conference, 2019. (Tuesday, October 22, 2019)
• Shanghai FD-SOI Forum 2019 – the Full Recap (Sunday, October 20, 2019)
• Don't Miss SOI Consortium's Japan Event: 30-31 October '19, Yokohama (Sunday, October 13, 2019)
• Silex Insight and Medium Inc. accelerate towards 1 million ECDSA signature verifications per second on a blockchain (Monday, October 7, 2019)
• CCIX Consortium Releases CCIX Base Specification Revision 1.1 Version 1.0 with Support for 32GT/s (Monday, October 7, 2019)
• How China is aiming for a state of technological independence (Sunday, October 6, 2019)
• Synopsys Completes Acquisition of QTronic GmbH (Wednesday, October 2, 2019)
• TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide (Monday, September 30, 2019)
• Globalfoundries to IPO (Sunday, September 29, 2019)
• Adesto Reaches Shipment Milestone of One Billion Non-Volatile Memory Devices (Wednesday, September 25, 2019)
• Evaluation Boards Now Available for Flex Logix EFLX4K eFPGA on GLOBALFOUNDRIES' Most Advanced FinFET Platform (Tuesday, September 24, 2019)
• Synergy between the Arm ecosystem and OCP communities to support the growth of compute infrastructure (Monday, September 23, 2019)
• 5G和电动汽车市场快速发展，SOI晶圆会缺货吗？ (Wednesday, September 18, 2019)
• 5倍产能爬坡，FD-SOI的体量又庞大了一圈 (Tuesday, September 17, 2019)
• Notes from 7th Shanghai FD-SOI Forum held on September 16, 2019 (Monday, September 16, 2019)
• 剪刀手"拍照泄露指纹信息？辟谣来了！ (Sunday, September 15, 2019)
• IP Security Assurance Standard (Tuesday, September 3, 2019)
• How to Design SmartNICs Using FPGAs to Increase Server Compute Capacity (WP017) (Wednesday, August 21, 2019)
• Chinese Foundry SMIC Begins 14nm Production (Sunday, August 18, 2019)
• Western Digital Announces Technology Leadership Transition (Wednesday, August 7, 2019)
• PLDA Announces Major PCIe 5.0 Design Win on Cutting Edge 5nm Process Node (Wednesday, July 31, 2019)
• Silvaco Appoints Babak Taheri as new Chief Executive Officer (Wednesday, July 31, 2019)
• Adesto Appoints Two New Board Members (Monday, July 29, 2019)
• Rambus Reports Second Quarter 2019 Financial Results (Sunday, July 28, 2019)
• Purdue & TSMC Partner to Enhance Chip Security (Wednesday, June 19, 2019)
• China sees Taiwan supply chain as alternative to IDMs for power IC devices (Tuesday, June 18, 2019)
• GLOBALFOUNDRIES Adds Industry Veteran Glenda Dorchak to its Board of Directors to Support Next Phase of Transformative Growth (Monday, June 17, 2019)
• Gartner Identifies Five Challenges to Growth and Adoption for Virtual Customers (Tuesday, June 11, 2019)
• OpenHW Group created and announces CORE-V family of open-source cores for use in high volume production SoCs (Wednesday, June 5, 2019)
• Socionext Adopts the Cadence Full-Flow Digital and Signoff Tools for 7nm Designs (Monday, June 3, 2019)