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• Andes Technology forms a Multinational Alliance with ASIC Design Service Companies to Provide RISC-V Total Solutions (Wednesday, August 8, 2018)
• Arm targets any number of devices and any type of data (Wednesday, August 8, 2018)
• Synopsys Announces Earnings Release Date for Third Quarter Fiscal Year 2018 (Tuesday, August 7, 2018)
• PLDA Announces Integration of their PCIe 3.0 Controller IP into Kazan Networks' NVMe Over Fabric Fuji ASIC, Providing a Dramatic Increase in Scalability and Flexibility for Storage Applications (Tuesday, August 7, 2018)
• CEVA, Inc. Announces Second Quarter 2018 Financial Results (Tuesday, August 7, 2018)
• IDM or foundry: CanSemi builds on analog, MCU strategy (Tuesday, August 7, 2018)
• 200mm wafer demand driving growth in Asia (Tuesday, August 7, 2018)
• Cadence, Nvidia to apply machine learning to EDA (Tuesday, August 7, 2018)
• QuickLogic Reports Fiscal 2018 Second Quarter Results (Tuesday, August 7, 2018)
• eMemory's 2nd Generation NeoMTP Enables a Wide Range of Power Management Applications on DB HiTek's BCD Process (Monday, August 6, 2018)
• FADU Launches Industry Leading SSD Solutions Powered by SiFive RISC-V Core IP (Monday, August 6, 2018)
• Lekha Wireless appoints T2M for global marketing, representation and business development (Monday, August 6, 2018)
• Achronix and Mentor Partner to Provide Link Between High-Level Synthesis and FPGA Technology (Monday, August 6, 2018)
• eSilicon 56Gbps PAM4 SerDes IP Hits the Lab (Sunday, August 5, 2018)
• IP-Maker to showcase NVMe Host demo at Flash Memory Summit (Thursday, August 2, 2018)
• Numem exhibits and presents at MRAM Developer Day (Wednesday, August 1, 2018)
• Arasan to demonstrate its SD Card UHS-II PHY IP and eMMC 5.1 PHY IP for 12nm SoC Designs at the 2018 Flash Memory Summit (Wednesday, August 1, 2018)
• Broadcom to Help Design Wave's 7-nm AI Chip (Tuesday, July 31, 2018)
• Maxim's Secure Microcontroller Delivers Advanced Cryptography, Secure Key Storage and Tamper Detection in a 50 Percent Smaller Package (Tuesday, July 31, 2018)
• New 5G Hurdles (Tuesday, July 31, 2018)
• STMicroelectronics Make Vehicle Sounds Safer (Monday, July 30, 2018)
• eMemory's Reprogrammable eNVM solution available on TowerJazz BCD platform (Monday, July 30, 2018)
• IP Cores, Inc. Announces One-Year Anniversary of the Delivery of XTS4 Cores for the Server Memory Encryption (Monday, July 30, 2018)
• TSMC trims sales forecast, capex (Monday, July 30, 2018)
• Soitec sales climb on 300mm FDSOI wafer demand (Monday, July 30, 2018)
• Applied, ARM to develop CeRAM for neuromorphic applications (Monday, July 30, 2018)
• Innosilicon's Bitcoin ASIC powered by Samsung's Low Power FinFET technology to achieve record breaking performance (Monday, July 30, 2018)
• Arm to Spend $600 Million to Widen IoT Ecosystem Offer (Monday, July 30, 2018)
• Intel selects SiTime for 5G timing MEMS (Monday, July 30, 2018)
• North American PCB Industry Growth Trend Continues (Monday, July 30, 2018)
• Arm and Samsung Foundry 'push the possibilities' of semiconductor manufacturing (Monday, July 30, 2018)
• AMD Will Fab Its 7nm 'Rome' Epyc CPUs at TSMC, Not GlobalFoundries (Sunday, July 29, 2018)
• Second Quarter 2018 Silicon Wafer Shipments Increase Quarter-Over-Quarter – All-Time Quarterly High (Sunday, July 29, 2018)
• Samsung Memory is easy come easy go but for how low? (Saturday, July 28, 2018)
• ARM to Buy Treasure Data (Saturday, July 28, 2018)
• Chinese IoT firm raises $200m (Thursday, July 26, 2018)
• Pros, Cons Of ML-Specific Chips (Thursday, July 26, 2018)
• NXP acquisition by Qualcomm about to collapse (Wednesday, July 25, 2018)
• UltraSoC's Alibaba design win underlines China's significance (Tuesday, July 24, 2018)
• Customizing FPGA-based DisplayPort 1.4a designs (Tuesday, July 24, 2018)
• Silicon Industry Veteran Joins SiFive Executive Team (Tuesday, July 24, 2018)
• Kandou Bus Closes Series B Investment Round (Tuesday, July 24, 2018)
• Cadence Selected for DARPA ERI Machine Learning Contract to Accelerate Electronic Design Innovation (Monday, July 23, 2018)
• Samsung developing new GPU (Monday, July 23, 2018)
• Synopsys Targets 400G Hyperscale Data Centers with High-Performance Ethernet IP (Monday, July 23, 2018)
• SMIC preps the world's largest 200mm wafer fab (Monday, July 23, 2018)
• IMEC, Soitec stack device layers (Monday, July 23, 2018)
• Intel processors: Researchers discover new vulnerabilities (Monday, July 23, 2018)
• SEMICON West - Soitec is becoming a key enabler (Saturday, July 21, 2018)
• ASML to Ship 20 EUV Systems in 2018 (Wednesday, July 18, 2018)