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• Spectral releases Silicon proven High Speed Low Power SRAM compilers in the 40/45nm CMOS/RFSOI process nodes targeted for a wide range of IOT & 5G Applications (Monday, June 25, 2018)
• Silicon Creations' SerDes Technology Helps Power Leading-Edge 8K TV (Monday, June 25, 2018)
• Optimum Semiconductor Unveils New Image Recognition SoC (Monday, June 25, 2018)
• Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment - SAVE (Monday, June 25, 2018)
• 7nm, 5nm and 3nm Logic, current and projected processes (Sunday, June 24, 2018)
• Taiwan's TSMC to Invest $25 Billion in 5 Nanometer Node Technology (Wednesday, June 20, 2018)
• SoftBank confirms sell-off of ARM China stake (Wednesday, June 20, 2018)
• PLDA Announces Second Annual "PLDA Design Day", in Shanghai, China - a Free Design Workshop, 100% Focused on PCIe Design (Tuesday, June 19, 2018)
• T2M to showcase cutting-edge Cellular and Low Power Wireless IoT technologies at MWC Shanghai 2018 (Tuesday, June 19, 2018)
• GlobalFoundries' UHV 180nm Process Hits 700V (Tuesday, June 19, 2018)
• TSMC's May sales show continued strength (Tuesday, June 19, 2018)
• Arasan Announces SD Card UHS-II PHY IP for 12nm SoC Designs (Monday, June 18, 2018)
• Intrinsic ID Names Kumi Thiruchelvam Vice President, Europe & Asia Sales (Monday, June 18, 2018)
• Samsung to Pay $400 Million for Infringing FinFET Patent (Monday, June 18, 2018)
• North American Semiconductor Equipment Industry Posts May 2018 Billings (Monday, June 18, 2018)
• EDA know-how for safe Power Regulation Networks implementation unveiled at ENIAC's THINGS2DO E.U. project final review. (Sunday, June 17, 2018)
• USB 3.0 – A Cost Effective High Bandwidth Solution for FPGA Host Interface (Wednesday, June 13, 2018)
• Layout Database File Control: The Missing Link (Wednesday, June 13, 2018)
• Spin the Arm Virtual Prize Wheel at DAC 2018 (Wednesday, June 13, 2018)
• Synopsys Fusion Technology Enables Lower Power, Smaller Area, and Higher Performance on Samsung Foundry 7LPP Process with EUV (Wednesday, June 13, 2018)
• Arm Expands IoT Connectivity and Device Management Capabilities with Stream Technologies Acquisition (Tuesday, June 12, 2018)
• Xpeedic's IRIS Certified for EM Simulation in GLOBALFOUNDRIES 22FDX Process (Tuesday, June 12, 2018)
• Globalfoundries Cuts 5% of Workforce (Monday, June 11, 2018)
• Faraday Exhibits AI FPGA-to-ASIC Solution and IoT SoC Platform at DAC 2018 (Monday, June 11, 2018)
• Breker Verification Systems Unveils Next-Generation Trek5 with Fully Compliant Support for Accellera Portable Stimulus Standard (Monday, June 11, 2018)
• Silicon Catalyst Strengthens Leadership Team (Monday, June 11, 2018)
• Synopsys Enables Secure App Development with Coverity Enhancements and Integrated Security Training Platform (Monday, June 11, 2018)
• Cortus Asserts Intellectual Property Claims Against Microsemi, a Wholly Owned Subsidiary of Microchip Technology Inc. (Nasdaq: MCHP) (Wednesday, June 6, 2018)
• Arm Sells Stake in China JV as EU Warns of Unfair Practice (Wednesday, June 6, 2018)
• Intento Design Cooperates with STMicroelectronics to Accelerate Analog Design and Migration of FD-SOI Chips at Functional Level (Wednesday, June 6, 2018)
• Arteris IP Announces CodaCache Standalone Last Level Cache (Wednesday, June 6, 2018)
• PLDA to Demonstrate Industry's First PCIe 4.0 Switch Platform with Multiple Downstream Ports during PCI-SIG DevCon 2018 (Tuesday, June 5, 2018)
• TSMC Shareholders Approve NT$8 Cash Dividend and Elect Board of Directors; Board of Directors Elect Mark Liu as Chairman and C.C. Wei as CEO and Vice Chairman (Tuesday, June 5, 2018)
• Samsung to introduce nanosheet transistors in 3nm node (Tuesday, June 5, 2018)
• Globalfoundries to add another NVM to FDSOI (Tuesday, June 5, 2018)
• TrendForce Reports Top 10 Semiconductor Foundries Worldwide for 1H18, TSMC Ranks First with an Estimated Market Share of 56.1% (Wednesday, May 30, 2018)
• intoPIX to showcase 8K and best-in-class AV-over-IP compression technologies at InfoComm 2018 (Wednesday, May 30, 2018)
• AMD Needs More 7nm Capacity Than GlobalFoundries Can Provide (Tuesday, May 29, 2018)
• Samsung shipping 32GB DDR4 SoDIMMs (Tuesday, May 29, 2018)
• Qualcomm unveils AI-enabled AR platform (Tuesday, May 29, 2018)
• Imec demonstrates compatibility of state-of-the-art 0.8V-transceiver, with industry standard Arm Cordio IP for BLE 5 (Tuesday, May 29, 2018)
• Toshiba Memory Corporation and Synopsys Collaborate to Accelerate 3D Flash Memory Verification (Tuesday, May 29, 2018)
• Technolution to engage in space-proof data processing by taking over Recore Systems' activities (Tuesday, May 29, 2018)
• TSMC and GloFo may compete to produce the most overclockable AMD Zen 2 CPUs (Monday, May 28, 2018)
• EUV in Final Push into Fabs (Monday, May 28, 2018)
• Tencent wants to bolster China's chip and semiconductor industr (Saturday, May 26, 2018)
• ARM's next bet for plastic chips: Neural networks Hot3 (Thursday, May 24, 2018)
• China chips grow 21% (Thursday, May 24, 2018)
• Samsung Plans 3nm Gate-All-Around FETs in 2021 (Wednesday, May 23, 2018)
• IP-Maker to launch new NVMe host IP Family For NVMe host acceleration in data center applications (Wednesday, May 23, 2018)