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Thursday, April 16, 2026

• Sofics and Alcyon Photonics Partner to Support Next-Generation Photonic Systems
• Three Misconceptions About the $402B Semiconductor Foundry Industry
• Japanese Government Provides Additional 5.9 Trillion Won to Rapidus
• Credo Agrees to Acquire DustPhotonics, Accelerating Expansion into Silicon Photonics and Next Generation Optical Connectivity
• European Commission greenlights €211 million funding for Cambridge graphene photonics spinout
• For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 3
• 8 Wi-Fi security guidelines issued by Wireless Broadband Alliance
• Synopsys Solutions Support NASA's Artemis Program with Spacesuit Analysis and Communication System Development
• DeepX to produce next AI chip using Samsung Foundry’s 2-nanometer process
• How to Plan Agentic AI Deployment for Chip Design
• Cadence and NVIDIA Expand Partnership to Reinvent Engineering for the Age of AI and Accelerated Computing
• AimFuture, a Leader in Home Appliance NPUs, to Integrate Mesacure Company’s AI Algorithms
• Faraday Delivers IP Solutions to Enable Endpoint AI Based on UMC’s 28nm SST eFlash
• Rapidus Opens Analysis Center and Rapidus Chiplet Solutions
• Three Foundry Companies and the "Everyone’s Challenge Fabless" Initiative… Full-Scale Support for Startups

Wednesday, April 15, 2026

• Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums

Monday, April 13, 2026

• Intel, Google Deepen Collaboration to Advance AI Infrastructure
• TSMC March 2026 Revenue Report
• NEDO Approves Rapidus’ FY2026 Plan and Budget for 2nm Semiconductor Projects
• Codasip Shifts Focus to Cyber-Resilient SoCs, Divests Low-End RISC-V Business
• IntoPIX Unleashes Zero‑Latency IP Video Streaming With JPEG XS, IPMX & SMPTE 2110 At NAB Show 2026
• OmniTrust and Synopsys collaboration enables earlier security validation of embedded systems
• RISC-V SoC supports voice-enabled IoT devices
• Socionext Collaborates with Arm to Advance AI Data Center Infrastructure with Arm Total Design
• BrainChip Unveils Radar Reference Platform to Bridge the ‘Identification Gap’ in Edge AI
• SiFive Raises $400 Million to Accelerate High-Performance RISC-V Data Center Solutions; Company Valuation Now Stands at $3.65 Billion
• Siemens accelerates AI chip verification to trillion‑cycle scale with NVIDIA technology
• Intel Foundry Achieves Breakthrough with World's Thinnest GaN Chiplet Technology
• Rapidus Opens Analysis Center and Rapidus Chiplet Solutions
• Power Your Chiplets with 32Gbps Open AIB PHY IP Core — White-Box Licensed with Unlimited Usage and Full Modification Rights

Thursday, April 9, 2026

• Cadence Announces First Quarter 2026 Financial Results Webcast
• Rambus to Announce First Quarter Fiscal Year 2026 Results
• BOS Semiconductors to Showcase AI Innovations at Auto China 2026
• 5G Adoption Tops 30%, but Revenue Growth Still Lags
• Keysight and Sateliot Win European Space Agency and GSMA Foundry Challenge for 6G Innovation
• Ultra Accelerator Link™ (UALink™) Consortium Publishes Four Specifications Defining In-Network Compute, Chiplets, Manageability and 200G Performance
• Silicon Choices Grow in Importance as Industrial AI Moves Closer to the Factory Floor
• AD Technology targets North American AI-RAN and DRAN markets
• Samsung Takes First Step Away From ARM’s Ecosystem By Working On An SSD Controller Chip Based On RISC-V Architecture
• ADTechnology Pivots to 2nm Chiplet Platform by 2030
• Japan's Rapidus ramps up 2nm chip plans while eyeing factories on the Moon
• OPENEDGES Advances Commercialization of LPDDR6/5X Memory Subsystem IP, Targeting Next-Generation AI and HPC Markets

Wednesday, April 8, 2026

• Intel Joins Musk’s TerraFab AI Chip Project
• Qualcomm Joins Korea's 'Challenge AX' Program to Support AI Startups
• Codasip announces strategic pivot and divestiture
• Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips

Tuesday, April 7, 2026

• TES offers a High-Frequency Synthesizer and Clock Generator IP for X-FAB XT018 - 0.18µm BCD-on-SOI technology
• DDR5/LPDDR5/DDR4 Combo PHY & Controller IP Core in 12FFC - Eliminating Memory Interface Risk

Monday, April 6, 2026

• Rambus Recognized by Forbes as One of America’s Most Successful Mid‑Cap Companies for 2026
• India’s Semiconductor Leap: Four Plants to be Operational by 2026, Says Ashwini Vaishnaw
• Fujitsu plans dedicated 1.4nm AI chip manufactured entirely in Japan by Rapidus — AI chip to be designed and manufactured domestically
• Synopsys and ISBA partner to boost India’s startup ecosystem
• Synopsys strengthens cooperation with Armenia in education and technology - Vice President
• Renesas’ Radiation Hardened ICs Take Flight on NASA’s Artemis II Crewed Lunar Mission
• Quantum-Safe Cryptography: Companies and Players Across the Landscape [2026]
• IBM Announces Strategic Collaboration with Arm to Shape the Future of Enterprise Computing
• Can Your NPU Run DOOM? Chimera Can.
• China’s tech self-sufficiency drive reaches new milestone with powerful RISC-V chips
• Advancement of NiuXin PCIe IP: From PCIe 3.0 to PCIe 5.0, Strengthening the Foundation of Chip Interconnection
• Keysight Adds Assembly Simulation to Virtual Manufacturing Portfolio
• Synopsys Advances Die‑to‑Die Connectivity with 64G UCIe IP Tape‑Out
• Japan’s Rapidus Races TSMC and Samsung in 1nm Chip Foundry