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Friday, August 22, 2025

• Photonic wins $1 million CAD grant to advance quantum networking
• Nvidia CEO Jensen Huang to Visit TSMC
• Nordic-powered LE Audio and Auracast modules simplify product development and reduce time to market for wireless audio solutions
• Chiplets Consolidation Wave is Just Beginning
• Silvaco Announces CEO Transition
• What Does SoftBank's Investment in Intel Stand For?

Thursday, August 21, 2025

• Superspeed PCIe coming in 2028
• Keysight Completes Industry-First PSA Certified Level 4 Evaluation for Silicon Labs’ SiXG301 SoC
• MSU Leveraging Intel 16 and the Cadence Tool Flow for Academic Chip Tapeout
• Former BelGaN-site to become Europe's first 'full-fledged photonic chip centre'
• Cirrus Logic and GlobalFoundries Expand Strategic Investment to Advance Next-Generation Mixed-Signal Semiconductor Manufacturing in the U.S.
• Samsung to set up chip packaging R&D center in Yokohama, raise stakes vs TSMC
• Chips&Media Launches Cframe60: A Lossless & Lossy frame Compression Standalone HW IP

Wednesday, August 20, 2025

• Dassault Systemes and Vietnam's National Innovation Center Unite Industry Leaders to Accelerate Nation's Semiconductor Rise
• DDR4, LPDDR4 Supply Tightens Sharply Amid Structural Shortage-drive Price Surge
• DEEPX Signs 2nm Process Agreement with Samsung Foundry to Develop World's First On-Device Generative AI Chip 'DX-M2'
• European Project to Repurpose Fiber-Optic Cables Into Photonic Sensors
• UK needs 7000 AI chip designers over the next five years says report
• New Renesas USB-C Power Solution with Innovative Three-Level Topology Improves Performance and Reduces System Size
• India's First Compound Semiconductor Wafer Fab Gets Approval
• Ansys Announces Agreement to Offer Access to NVIDIA Omniverse Technology from within Simulation Solutions
• SoftBank Group and Intel Corporation Sign $2B Investment Agreement

Tuesday, August 19, 2025

• BOS CSMO Shares Insights on the Future Car
• Softbank backs Intel in $2bn deal
• Keysight Technologies Reports Third Quarter 2025 Results
• The Future of the Edge: The Rising Tide for Better AI Performance, Scalability, and Security
• UCIe 3.0 Supports Full Backward Compatibility, Boosts Data Rate for 2D Chiplets
• Cirrus Logic and GlobalFoundries Expand Strategic Investment to Advance Next-Generation Mixed-Signal Semiconductor Manufacturing in the U.S.
• Arteris Wins Gold Stevie® Award for Most Innovative Tech Company of the Year

Monday, August 18, 2025

• Feature-packed smart ring modules integrate Nordic's nRF54L15 SoC delivering next level processing and power consumption performance
• MIPI C/D PHY and DSI Controller IP Licensed by Tier-1 US Customer, Strengthening T2M's Position in Automotive and AR/VR Markets
• Smart glasses becoming a serious market
• CFX's 40nm HV Process OTP IP Now Available at Fab
• TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
• Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA
• NIST Finalizes ‘Lightweight Cryptography’ Standard to Protect Small Devices
• QuickLogic Appoints Ron Shelton to Board of Directors
• GlobalFoundries Completes Acquisition of MIPS

Friday, August 15, 2025

• Dominic Maidment, Unilever: IoT gives supply chains 'a sixth sense'
• U.K. Startup Scaling Quantum Computing With Photonics

Thursday, August 14, 2025

• Intel Shows Its Cutting-Edge 18A Process Is Ready for Non-x86 SoCs in a Live Demo, Aiming to Attract Fabless Customers Like Apple That Rely on ARM
• MIPI I3C/I3C Basic Implementers Collaborate to Test, Improve Innovations at Recent Plugfest
• Embracing the Chiplet Journey
• Will Robots Use Reasoning At The Edge?
• Siemens, Arm and Southampton Uni announce Cre8Ventures Education Program
• Oxford Ionics delivers quantum computer to UK NQCC
• TSMC Board of Directors Meeting Resolutions
• EnSilica Establishes New EU Mixed-Signal Design Centre in Budapest, Hungary
• Brite Semiconductor Releases PCIe 4.0 PHY IP
• Perceptia Completes Silicon Characterisation of pPLL03 for GF 22FDX - Report Now Available

Wednesday, August 13, 2025

• OIF at ECOC 2025: Eliminating Barriers and Accelerating Innovation
• Silvaco's CEO, Babak Taheri, to Attend the Jefferies' Semis, IT Hardware & Comm Tech Summit in Chicago
• Siemens empowers Europe's next generation of semiconductor innovators with Open Higher Education Program
• Nordic Semiconductor continues to power ahead
• AI and Semiconductors Dance a Quick Two-Step
• Anthropic details its AI safety strategy
• Why does it MATTER? Understanding the universal protocol that’s making smart homes even smarter
• Can Huawei's open-sourced CANN toolkit break the CUDA monopoly?
• TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
• Samsung boosts HBM specialist hiring, scales back foundry recruitment
• Wave Photonics launches its PDK Management Platform with CORNERSTONE as the first user
• Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA
• Arm Neural Technology Delivers Smarter, Sharper, More Efficient Mobile Graphics for Developers

Tuesday, August 12, 2025

• NVIDIA latest: Blackwell GPU and software updates
• Ceva, Inc. Announces Second Quarter 2025 Financial Results
• Dnotitia Launches the World's First MCP-Based AI Agent Workstation with Integrated Vector Database

Monday, August 11, 2025

• AIoT 2.0 brings smarter voice and visual features to connected devices
• Eseye: Why the true cost of IoT connectivity is often hidden
• GlobalFoundries Expands Partnership with Apple to Advance Wireless Connectivity and Power Management, Reinforcing U.S. Chip Manufacturing Leadership
• Open Compute Project Enables Silicon Diversity in AI Clusters