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Monday, September 7, 2026

• Comcores and AVANT Technology Partner to Expand Ethernet IP Opportunities in China and Taiwan
• How AI Is Reshaping the Global Semiconductor Patent Landscape
• Việt Nam moving deeper into global, regional semiconductor value chains
• Accelerating the UK semiconductor sector
• STMicroelectronics Stock Climbs 2.5%, Buoyed by Semiconductors
• Keysight to Showcase Expanded PNT Capabilities at ION GNSS+ 2026
• Key ASIC Berhad and CT Vision (International) Holdings Limited Sign Strategic MOU to Develop Landmark Green AI Data Centre and Integrated Renewable Energy Ecosystem in Malaysia
• Renesas Establishes Physical AI & Robotics Lab in Beijing to Accelerate Next-Generation Robotics Innovation
• Keysight Collaborates with the Centre for Assuring Autonomy at the University of York to Advance AI Safety Assurance for Software-Defined Vehicles
• Why semiconductors are critical to the future of IoT
• ai& and Tenstorrent Launch JapanFold, Bringing Open-Source, Sovereign Drug Discovery to Japan
• Silvaco Group unveils new MIPI PHY IP for GlobalFoundries 22FDX Plus and 12LP Plus
• Overcoming the thermal barrier in next-generation AI ASICs
• proteanTecs and MegaChips Collaborate to Bring Health and Performance Management Solutions to Next-Generation LSI Designs
• Samsung Teams Up with Arm to Develop 2nm On-Device AI Chip; OpenAI Rumored as Potential Customer

Thursday, September 3, 2026

• How AI Is Reshaping the Global Semiconductor Patent Landscape
• MIPS Launches Workload-Native Platforms for Physical AI
• ChipAgents Helps Andes Technology Dramatically Accelerate Custom Processor Design and Verification
• LG Electronics Taps Samsung Foundry for AI Home Chips
• Samsung Targets Memory Limits With 3D-Stacked HBM
• Siemens launches Eigen Engineering Agent in Thailand, bringing purpose-built industrial AI to automation engineering
• GlobalFoundries announces customer availability of UX platform technologies for intelligent edge, connectivity and Physical AI applications
• GlobalFoundries and RAAAM Memory Technologies announce the joint development of next-generation GCRAM technology and test chip on FDX platform
• TSMC's new verification line in Kaohsiung signals shift towards advanced packaging dominance

Wednesday, September 2, 2026

• Korea, Japan discuss chip, AI cooperation in economic security dialogue
• Korea sets $15.6 billion budget for chips and AI initiatives in 2027
• Cadence Subsystem for PCIe 6.0 Architecture Achieves First-Pass PCI Express Specification Compliance
• intoPIX Titanium FPGA SoC EDK Achieves IPMX Certification
• QuickLogic Unveils Next-Generation eFPGA Hard IP for GlobalFoundries 12LP
• Achieving ISO 26262 ASIL-B Certification for Functional Safety, Chips&Media’s ‘WAVE6331X FuSa’ Video Codec IP Meets the Rigorous Safety Standards Required by the Premium Automotive and Robotics Markets

Monday, August 31, 2026

• Silicon-Proven PCIe Gen 5 IP Core Accelerates the Future of High-Performance SoC Connectivity
• India seeks closer Taiwan semiconductor ties
• Q2 Foundry Market Grows 29%... TSMC Dominates with 73% Share, Samsung Stuck at 7%
• Rapidus to receive $944m allocation from Japanese government for AI chip manufacturing
• TSMC Solidifies Dominance with 73% Foundry Share
• Keysight Technologies Announces Participation in Upcoming Investor Conferences
• Weebit Nano FY26: Record revenue, new customer wins
• Photonic integrated circuits: the next frontier of advanced optoelectronic devices
• SEALSQ Subsidiary IC’Alps Advances QASIC Roadmap for Custom Quantum-Resistant ASICs
• Samsung Foundry begins full mass production of Nvidia's Groq 3 LPX chip
• Arm Reveals AGI Server CPU Architecture at Hot Chips, Targeting Agentic AI Workloads
• Semifive accelerates Korea's AI chip design with turnkey ASIC platform
• Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder
• MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
• NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
• IBM and Arm: Expanding the Arm ecosystem for the next era of enterprise computing
• Cadence Design Systems Sees AI Agents Driving Chip Design Boom and Growth
• Keysight Helps AttoTude Cut Terahertz IC Design Cycles by More Than 50%
• Siemens EDA Tools Now Certified for Intel 14A, 18A-P Process Technologies
• Samsung’s 4nm GAIA Could Mark First PIM Commercialization in AI PCs, Mass Production as Early as 2027

Thursday, August 27, 2026

• A scalable, shader-programmable vector graphics GPU core for low-power MCUs
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2026
• Integrated Photonics for Wireless Applications: Enabling Free-Space Optics, 6G, and Beyond
• Achronix Announces Availability of High-Performance JESD204C IP Core for Speedster7t FPGAs
• Korea's AI ambition faces power crunch
• Baya Systems Expands to Japan to Support Next-Generation AI Semiconductor Design
• BrainBoard1500 brings neuromorphic AI to embedded developers
• BrainChip’s AkidaTag Wins Global AI Award for Edge AI & IoT Intelligence
• RISC-V extensions for high performance embedded computing
• SiFive Paves the Path to Accelerated Adoption of RISC-V in the Datacenter with the BigSky Development Server
• UMC Shares Climb 6% on AI Foundry Investment Defying Market’s Semiconductor Downturn
• TSMC’s HBM-Packaging Yield Issues Help Intel, Analysts Say

Wednesday, August 26, 2026

• STMicroelectronics and NUS launch Corporate Lab to power the future of Edge AI in Singapore
• Intel Outlines Architectures for Agentic AI at Hot Chips 2026
• Photonic chip market to hit $9.3bn
• SK Hynix Next-Gen HBM Memory to Use Intel EMIB-T Packaging
• LTE Cat 1bis IP Cores for Next-Generation Cellular IoT SoC Development