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Monday, February 23, 2026
Fabless semiconductor startup Vervesemi raises $10 Mn in Series A round
sensiBel Licenses Sofics’ Advanced ESD Solutions for their Studio-quality MEMS Microphone Technology
RISC-V IP Core - TAE520 : R52, Comparable Performance functional-safety processor
Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
Siemens wins Best of Show Award for "Packaging: Design" at 2026 Chiplet Summit
M31 Validates MIPI M-PHY v5.0 IP on 4nm, Advances 3nm Development to Enable UFS 4.1 Applications
Sunday, February 22, 2026
Europractice 2.0 secures EU funding until September 2028
Europe Doubles Down on Semiconductor Strengths
Funding must be activated for semiconductor success
Ceva to Participate in Upcoming Investor Conferences and Industry Events
EnSilica to sponsor Tiny Tapeout workshop at the University of Sheffield
Thursday, February 19, 2026
Chiplet Summit Announces 2026 Best of Show Award Winners
India Budget 2026-2027: Semiconductors, Manufacturing, and Tax Reforms
Former Altera CEO Sandra Rivera Assumes Role as VSORA’s Chair of the Board
Cadence Reports Fourth Quarter and Fiscal Year 2025 Financial Results
QuickLogic Announces $13 Million Contract Award for its Strategic Radiation Hardened Program
CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration
Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making
Keysight Introduces PAM3 Signaling with New GDDR7 Transmitter Compliance Solution for Next-Generation Graphics Memory
Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs
GlobalFoundries and Renesas Expand Partnership to Accelerate U.S. Semiconductor Manufacturing
Samsung foundry steps up push to chase TSMC with 2 nm expansion and 1.4 nm plan
TSMC scaling back 8‑inch production as advanced node demand surges
Wednesday, February 18, 2026
Keysight Introduces PAM3 Signaling with New GDDR7 Transmitter Compliance Solution for Next-Generation Graphics Memory
Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs
Monday, February 16, 2026
TES Launches its µEngine: Parallel CPU System for Deterministic Real-Time HDL Applications
DVB-S2 Modulator Available For Implementation From Global IP Core
Semiconductor sales set new record as logic and memory lead growth
EnSilica to highlight turnkey ASIC expertise and European supply resilience at embedded world 2026
Victor Peng Joins Rambus Board of Directors
Fraunhofer IPMS develops new 10G TSN endpoint IP Core for deterministic high-speed Ethernet networks
Aftermarket ADAS kit targets commercial vehicle retrofits
BrainChip Announces Immediate Availability of Akida™ Pico for Remote Evaluation via FPGA Cloud
RISC-V Pivots from Academia to Industrial Heavyweight
SmartDV and Mirabilis Design Announce Strategic Collaboration for System-Level Modeling of SmartDV IP
RISC-V IP Core Portfolio at Embedded World 2026, Powering Next-Gen Embedded Systems for Automotive, IoT & Industrial Systems…
Friday, February 13, 2026
CEA and Soitec launch their collaborative area
Synopsys to showcase AI-driven engineering innovation at India AI Impact Summit 2026
Arteris Network-on-Chip Technology Achieves Deployment Milestone of 4 Billion Chips and Chiplets
Thursday, February 12, 2026
Compartmentalisation by Microservices
We CAN! Now in XL
Rambus Announces Departure of Chief Financial Officer
EnSilica to Highlight Complete Ku- and Ka-band User Terminal Chipset at MWC Barcelona 2026
STMicroelectronics introduces the first automotive microcontroller with AI acceleration for edge intelligence
Physical AI: Fueling the Next Wave of Semiconductor Growth
Arteris Technology Deployed More Broadly by NXP to Accelerate Edge AI Leadership
Keysight Enables Enterprise-Scale AI Adoption in Semiconductor Design with SOS Enterprise
The Data Dilemma: Cracking the Code of Data Movement for the Next Wave of Semiconductor Innovation
QuickLogic Corporation to Exhibit and Present at Chiplet Summit 2026
EU launches NanoIC pilot line to oversee development of sub-2nm chips on the continent
SkyeChip’s UCIe 3.0 Advanced Package PHY IP for SF4X Listed on Samsung Foundry CONNECT
Wednesday, February 11, 2026
EU approves €3B German State aid for cleantech manufacturing
Will the Global Foundry Landscape Be Shifted with Japan’s Revival?
GlobalFoundries Reports Fourth Quarter 2025 and Fiscal Year 2025 Financial Results
Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home
Cadence Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification
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