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Wednesday, July 22, 2026

• Siemens to acquire Defacto Technologies to complement its EDA portfolio with automated SoC design creation

Tuesday, July 21, 2026

• Arteris Deployed by Speedata for Data Center Compute
• CAST Enhances Serial Memory Controller IP with Encryption, Low-Power, and ASIL-Ready Options

Monday, July 20, 2026

• Siemens and Cloudberry VC collaborate to accelerate European deep-tech innovation
• RISC-V CPU IP Core - TAE500 -- Accelerate Automotive SoC Development with Functional Safety-Ready Solutions
• TSMC Reports Second Quarter EPS of NT$27.25
• Alphacore excited to exhibit at IEEE Nuclear & Space Radiation Effects Conference (NSREC 2026) in San Juan, Puerto Rico
• BOS Semiconductors Participates in Physical AI Super Connect in Silicon Valley 2026
• Keysight and Sateliot Selected by European Space Agency to Develop Blockchain‑Enabled Framework for 5G Non‑Terrestrial Networks
• ZeroPoint Technologies Announces ZeroStream
• RISC-V Is Inevitable, State of the Union Keynote Argues
• MEMTECH announces MemVerify-LPDDR5x memory simulation & verification platform
• Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging
• Samsung Foundry completes tape-out of Tesla’s next-gen AI chip
• Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design

Friday, July 17, 2026

• QuickLogic and PQSecure Enable Reprogrammable Post-Quantum Cryptography for SoCs
• Dolphin Semiconductor and INTERA Group Announce Reference Platform Combining Analog Voice Sensing and Neuromorphic AI for Ultra-Low-Power Edge Intelligence

Thursday, July 16, 2026

• Defacto’s SoC Compiler Drastically Improved Productivity of L&T Semiconductor Technologies
• Cabinet approves Rs 1.27 lakh crore Semicon 2.0 to strengthen India’s semiconductor ecosystem
• Spain Semiconductor Industry Convenes to Forge Domestic Alliances
• TrendForce Forecasts Up to 18% Server DRAM Price Increase in 3Q
• TSMC Achieves Record $13.75 Billion Revenue in June 2026
• Intel Invests €5 Billion to Expand Manufacturing in Europe
• TSMC to raise mature-node foundry prices starting January 2027
• TYLsemi Raises $43 Million to Launch First Full-Stack Chiplet Platform for Custom AI Silicon
• Quadric Extends Series C to $46M with Second Close led by World Bank's IFC
• Five Test Considerations to Prepare for Q-Day
• EU unveils action plan for AI and cybersecurity
• Swissbit, Nexperia Partner on Secure Hardware Platforms
• Siemens expands Saskatoon R&D hub to advance Industrial AI in semiconductor design
• Axelera AI Publicly Releases Voyager Wingman, an AI Assistant That Speeds Application Development
• Dnotitia Unveils STAR-KV, Achieving UP to 20x KV CacheCompression, Selected as an ICML 2026 Spotlight Paper
• MIPS on the RISC-V Shift: ‘Physical AI Is Agentic AI at the Edge’
• New JEDEC® SPHBM4 Standard Enables HBM4-Class Bandwidth on Organic Substrates
• China Develops Its First 3.5D "Infinity Chiplet" & 3D DRAM Tech As It Tackles External HBM Constraints Through Domestic AI Supply Chain
• SILITH and UMC Achieve Mass Production Milestone for Silicon Photonics
• Intel Resolves 18A Yield Variability; A Storm to Engulf Samsung and TSMC?

Wednesday, July 15, 2026

• Analog Bits Expands Global Engineering Footprint with New Design Center in Dongtan, South Korea

Tuesday, July 14, 2026

• Arteris Expands Partnership with Arm to Accelerate Semiconductor Cybersecurity

Monday, July 13, 2026

• 12FFC MIPI A-PHY Tx/Rx IP for Next-Gen Automotive SoCs
• Alok Jain: The Engineer Who Never Wanted to Be a Manager
• InfiniNode secures EUR 2 million financing to advance on-chip data movement technologies for next-generation compute systems
• BOS Semiconductors Named One of Forbes Korea's 2026 FAST-GROWING STARTUPS 50
• Photonics projects shine a light on Europe’s future innovation
• Keysight Delivers New High-Performance 4x100GE Network Cybersecurity Test Platform
• Choosing Between RTOS and Bare-Metal for Edge IoT Devices: A Guide from SignOff Semiconductors
• EU unveils action plan for AI and cybersecurity
• SiPearl CEO Philippe Notton on Europe’s AI processors, chiplets, and semiconductor sovereignty
• The Dawn of Agentic AI Super-Agents
• Sony joins MIPI Alliance board
• Enabling Next-Generation Data Center Infrastructure for Agentic AI: Introducing the Rambus DDR5 9600 Server RDIMM Chipset
• Tesla-Samsung AI5 Chip Hits Tape-Out at Taylor Fab on 2nm Process
• Rapidus to match TSMC on 2-nanometer chip pricing, Japan firm’s president says

Friday, July 10, 2026

• INCIRT Announces Availability of Its PLL Series in the GlobalFoundries (GF) GlobalSolutions™ Ecosystem