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Monday, December 30, 2024

• SoftBank's Izanagi AI processor could arrive in 2025, says report
• 2025 Expert Quantum Predictions - PQC And Quantum Cybersecurity
• Can Samsung outpace TSMC in the 2nm era?
• Established "Advanced SoC Research for Automotive" with 12 companies, led by automotive manufacturers
• Video Interview: Progress on FAMES Pilot Line for 10-nm and 7-nm FD-SOI

Sunday, December 29, 2024

• Top Merger and Acquisition in Tech in 2024: Key Acquisitions Shaping the Business Landscape
• TSMC (TSM) Spotlight: The Foundry of 21st Century Gold
• Software-defined vehicle (SDV): A technology to watch in 2025
• TSMC silicon photonics tech first co-package optics (CPO) samples ready for NVIDIA, Broadcom
• 64Gbps Universal chiplet boosts interconnect data rates

Saturday, December 28, 2024

• CES 2025: AI-powered tech to dominate world's biggest electronics trade show

Friday, December 27, 2024

• EnSilica PLC Demonstrates Strong Growth and Market Position in ASIC Industry

Thursday, December 26, 2024

• TSMC Sets Key Milestone in Japan as Kumamoto Fab Begins Mass Production
• China Becomes a Contender in Quantum Computing
• Software-Defined Vehicles: 'State-of-the-Art' and Challenges with AD and ADAS Computing Systems
• Cadence Appoints Moshe Gavrielov to Board of Directors
• South Korea accelerates world's largest semiconductor complex
• 7 top IoT trends to watch in 2025 and beyond
• Chiplets Extend Automotive SoC AI and GPU Capability

Wednesday, December 25, 2024

• Gen3 UCIe IP elevates chiplet link speeds
• L&T Technology Services Marks 10 Years of Engineering Excellence with Siemens

Monday, December 23, 2024

• GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
• TSMC, Intel, Samsung Foundry ready to battle over the start of 2nm production next year
• Infineon Ranked Among World's Most Sustainable Companies
• Arm vs. RISC-V in 2025: Which Architecture Will Lead the Way?

Sunday, December 22, 2024

• QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
• Micon Global and Silvaco Announce New Partnership
• Everything Goes Up! Top Trends of 2024
• Synopsys' $35 bln Ansys acquisition to be approved in EU, sources say

Saturday, December 21, 2024

• Arm loses out in Qualcomm court case, wants a re-trial

Friday, December 20, 2024

• Alphawave Semi Scales UCIeâ„¢ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity

Thursday, December 19, 2024

• Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
• Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
• Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
• Jury is out in the Arm vs Qualcomm trial
• With an Eye on TSMC, Rapidus Foundry Approaches 2nm Process
• Europe okays Italy's €1.3 billion subsidy for chiplet fab

Wednesday, December 18, 2024

• VeriSilicon unveils next-generation high-performance Vitality architecture GPU IP series
• RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
• Third day for Arm vs Qualcomm trial
• Enhancements to Creonic's DVB-S2X IP Cores for Greater Flexibility and Performance