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Monday, December 27, 2021
Edge Computing, AI, and the Cloud
Leti proposes FD-SOI spin qubit platform for quantum computing
Sunday, December 26, 2021
Arm CPUs Make Gains in Data Centers
Access Advance Welcomes Microsoft as a Licensor and Licensee of the HEVC Advance Patent Pool
GlobalFoundries Announces Extension of AMD Wafer Supply Agreement to Guarantee Supply
Wednesday, December 22, 2021
Despite Withdrawals, CES Organizers Push on With 2022 Show
Tuesday, December 21, 2021
A Novel Machine-Learning based SoC Performance Monitoring Methodology under Wide-Range PVT Variations with Unknown Critical Paths
CAES developing 16-core RISC-V based microprocessor for space
Synopsys Chosen by Juniper Networks to Accelerate Development of Photonic ICs for Next-Gen Data Centers
Successful conclusion of European Processor Initiative Phase One
First Open Wi-Fi 'HaLow' development platform
Weebit Nano receives first silicon demonstration wafers integrating its embedded ReRAM module
The European Space Agency (ESA) has awarded a contract to CAES, in the frame of the ARTES Competitiveness & Growth programme, to develop System-on-Chip for space applications
Kneron Announces $25 Million Funding To Advance Smart City Technology For Auto
Monday, December 20, 2021
17 Semiconductor Companies Forecast to Have >$10B Sales in 2021
Interview with the CEO at Silex Insight - Michel Van Maercke
Renesas Completes Acquisition of Celeno
17 Semiconductor Companies Forecast to Have >$10.0 Billion in Sales This Year
Real Intent Joins DARPA Toolbox Initiative to Provide Mil/Aero/Defense Grade Static Sign-Off
North American Semiconductor Equipment Industry Posts November 2021 Billings
Sunday, December 19, 2021
SiPearl awarded a €17.5M funding from the EIC Accelerator program
Intel CEO Says Chip Shortage To Last Until 2023
UK doubles venture capital investment in tech
Taiwan approves TSMC fab investment plan in Japan
Teledatics Introduces World's First Open Wi-Fi "HaLow" Development Platform
Imagination's Series3NX neural network accelerator helps UNISOC to create 5G smartphone platform
Teledatics Introduces World's First Open Wi-Fi
Creonic GmbH is Heavily Invested in the Expansion and Research of 6G Technologies
SiPearl awarded a ?17.5M funding from the EIC Accelerator program
Imagination appoints Carol Chesney to board as non-executive director
Hardent VESA DSC IP Cores Licensed by Teledyne LeCroy for DisplayPort Test Solution
PCIe 5.0 & PCIe 4.0 PHYs and Controller IP Cores are available for immediate licensing to maximize your Interface speed for complex SoCs
Thursday, December 16, 2021
Kandou Closes $75 Million in Series D Funding
Gowin Automotive-grade FPGAs Pass SAIC's 2500h Heat Resistance Tests
TSMC Introduces N4X Process
Wednesday, December 15, 2021
Samsung and IBM reveal plans to make next-generation CPU with 5 nm process
StarFive Released Open-Sourced Dubhe Linux SDK in RVspace Community
Kandou Delivers USB-C Multiprotocol Retimer Product Family for USB4 Support
TSMC Presents 2021 Excellent Performance Award to Outstanding Suppliers
Synopsys Initiates $200 Million Accelerated Share Repurchase Agreement
Synopsys SiliconSmart Library Characterization Solution Achieves Certification for TSMC N5, N4 and N3 Advanced Processes
3Q21 Revenue of Global Top 10 IC Design (Fabless) Companies Reach US$33.7 billion, Four Taiwanese Companies Make List, Says TrendForce
Lattice Expands Automate Solution Stack and Propel Design Tool Capabilities to Accelerate Industrial Application Development
Atomic Rules introduces the world's highest performance PCIe host interface for Intel Agilex F-Series FPGAs
Cliosoft Selected for Rapid Assured Microelectronics Prototypes (RAMP) Program
Secure Thingz and Intrinsic ID Partner to Ensure Supply Chains of Trust for the Embedded Industry
MediaTek Dimensity 9000 uses Armv9 technology for unparalleled performance
Industry's fastest TLS accelerator ready to boost Xilinx Versal platform
TSMC Newest N4X Process Targets HPC Products
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