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Thursday, November 10, 2022

• Report says Apple, TSMC talk about moving 3nm chip production to U.S.
• Guerrilla RF Starts Sampling its Second Series of Digital Step Attenuators Based on Rapid Fire™ Technology
• Arm technology is defining the future of computing: Record royalties highlight increasing diversity of products and market segment growth
• Cryogenic CMOS design enabled by Semiwise
• After 1Q23 Bottom, Expectations Increase for a 2Q23 IC Market Rebound
• Bringing next-level 3D gaming to life with Arm Immortalis
• ShortLink AB and Dolphin Design partner to create a highly energy-efficient Sub-GHz ASIC design platform

Wednesday, November 9, 2022

• MEMS micro-mirrors improve Lidar sensing for vehicles
• UK, Canada, and Singapore join forces to secure IoT devices
• Compact RISC-V Cores Bring the Power to Wearables, Consumer Devices
• Arteris Announces Financial Results for the Third Quarter 2022 and Estimated Fourth Quarter and Full Year 2022 Guidance
• TSMC October 2022 Revenue Report
• SMIC Reports 2022 Third Quarter Results
• Mythic strapped for cash
• LC3plus certified for the Hi-Res Audio Wireless Logo
• Codasip to boost RISC-V security through Cerberus acquisition

Tuesday, November 8, 2022

• Arm integrates IoT development tools into GitHub, autoML platforms Qeexo, Nota.AI
• What's Driving the Latest Automotive Designs
• CEVA, Inc. Announces Third Quarter 2022 Financial Results
• Alphawave IP Receives 2022 TSMC OIP Partner of the Year Award for High-Speed SerDes IP Innovations
• CEVA, Inc. Announces CEO Transition Plan
• DDR5/DDR4/LPDDR5 Combo PHY IP Cores which is Silicon Proven in 12FFC with Matching Controller IP Cores is available for license to accelerate your Memory Interfacing Speeds
• Arteris Announces New Employment Inducement Grants

Monday, November 7, 2022

• QuickLogic Taps MA Technology to Distribute eFPGA Technology in Taiwan
• Chiplet Interconnect Technology Heads Toward Commercialization
• Eliyan Closes $40M Series A Funding Round and Unveils Industry's Highest Performance Chiplet Interconnect Technologies
• Christel Mauffet-Smith Joins Arteris as Executive Vice President of Global Sales
• POLYN Technology, Edge Impulse Join Forces to Advance Tiny AI Products
• Weebit Nano receives from SkyWater Technology the first silicon wafers it manufactured with embedded Weebit ReRAM
• Arasan announces MIPI DSI IP for FPGA supporting full C-PHY 2.0 speeds
• Silvaco Announces Appointment of Five Industry Veterans to Its Board of Directors

Sunday, November 6, 2022

• Arm continues to accelerate IoT software development with new partnerships
• Global Silicon Wafer Shipments Projected to Set New Record in 2022, SEMI Reports
• Xiphera and Flex Logix Publish Joint White Paper on Solving the Quantum Threat with Post-Quantum Cryptography on eFPGA
• MPEG LA Takes Measures to Assist VVC Adoption
• Market Dynamics, Technologies Drive Automotive Design
• GUC Monthly Sales Report - October 2022
• eMemory Receives 2022 TSMC OIP Partner of the Year Award for Embedded Memory IP
• UMC Reports Sales for October 2022

Saturday, November 5, 2022

• TSMC Grants a Sweep of EDA Certifications for New Process Nodes

Friday, November 4, 2022

• Arm Aims to Be at the Center of Increasingly Diverse Datacenter

Thursday, November 3, 2022

• AI needs automated testing, monitoring
• SMIC: The Chinese company at the centre of US-China chip war
• Intel: Our Goal Is to Become Second Largest Foundry by 2030
• NSITEXE develops "DR4100" General Purpose Accelerator for SoC
• Creonic Participates in 6G Research Project Led by Deutsche Telekom

Wednesday, November 2, 2022

• SiFive Awarded TSMC Open Innovation Platform Partner of the Year
• Finding Talent to Run New Fabs Might Be Challenging
• Tony Fadell Joins Arm Board of Directors
• Sondrel appoints Thomas Flynn as VP Sales North America
• QuickLogic Partners with MA Technology to Distribute eFPGA Technology
• SiMa.ai Welcomes Industry Leader Harald Kroeger to Scale its Business in the Automotive Market
• Secure-IC acquires Silex Insight's security business to accelerate its chip-to-cloud plan and develop the next-generation of embedded cybersecurity solutions
• Silicon Creations Named 2022 TSMC OIP Partner of the Year for Analog and Mixed-Signal IP

Tuesday, November 1, 2022

• Synopsys Expands Channel Partner Strategy into Australia and New Zealand
• With its New RISC-V Processors, SiFive Bets on Compute Density
• Andes Technology Unveils The AndesCore® AX60 Series, An Out-Of-Order Superscalar Multicore RISC-V Processor Family
• Bitech Technologies Reports Completion of Its FPGA design and the Launch of Its ASIC Initiatives for Bitcoin Mining
• Siemens expands industry-leading integrated circuit verification portfolio with acquisition of Avery Design Systems
• Delay in Mass Production of New Intel Products a Boon for AMD, Proportion of AMD x86 Server CPUs Forecast to Exceed 22% in 2023, Says TrendForce
• Codasip delivers custom RISC-V processing to SiliconArts ray-tracing GPUs
• Surecore's Low Power Memory Delivers Improved Power Efficiency For BLE-Enabled Devices
• NextNav Announces Acquisition of Nestwave
• CEVA and ASR Micro Celebrate Milestone - 100 Million Wireless IoT Chips Shipped
• Arteris FlexNoC Interconnect Licensed by Microchip Technology for Microcontroller Development
• QuickLogic Announces Changes to its Board of Directors
• Rambus Reports Third Quarter 2022 Financial Results
• BrainChip Appoints Duy-Loan Le to its Board of Directors

Monday, October 31, 2022

• NB IoT Temperature Tracking Sensors for Cold Chain
• SiFive's New High-Performance Processors Offer a Significant Upgrade for Wearable and Consumer Products
• Quadric's New Chimera GPNPU Processor IP Blends NPU and DSP into New Category of Hybrid SoC Processor

Monday, October 31, 2022

• Vidatronic Releases FlexSIMOâ„¢ DC-DC Converter Technology for Highly Efficient Power Delivery in IoT, AR/VR, and Metaverse SoCs

Sunday, October 30, 2022

• Nova Scotia Community College (NSCC) Joins CMC Microsystems
• Weebit qualifies ReRAM for production on 130nm process
• TSMC says no commitment made on 1nm foundry location
• Rambus and Samsung Electronics Extend Comprehensive Agreement
• Intel signs 7 out of top 10 fabless companies, sees 18A test chip
• MIPI DSI and CSI Controllers IP Cores, for your High-Resolution Cameras, Display and Consumer Products, is available for immediate licensing
• EnSilica growth continues with new Bristol ASIC design office
• Floadia Announces MTP IP without extra Mask Available on 55nm
• Monthly Semiconductor Sales Decrease 0.5% Globally in September