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Sunday, September 11, 2022

• CEA & Partners Present 'Powerful Step Towards Industrialization' Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium
• TSMC to mass produce chips on upgraded version of 3nm process in 2023
• Taiwan's TSMC 2nm chip fab ready for construction, to be operational by 2025
• ARM, IBM team on low power analog AI chip
• Expanded Partnership Between Arteris and Arm to Accelerate Automotive Electronics
• Hisense Selects Synaptics' DBM10L Processor For First AI-Enabled Always-On Voice Remote Control
• SoC.one and Imagination Technologies Partner to Enable Adoption of RISC-V for Automotive Design
• Cortus Announces the Launch of its New Secure Low Power RISC-V Microcontrollers
• 1G Ethernet PHY IP Cores solution for all your Gigabit network applications is available of immediate licensing!!

Thursday, September 8, 2022

• Andes Technology Corp. Announces Its RISC-V CPU IP Serves as the Computing Engine in the New Renesas R9A02G020 MCU ASSP
• OPENEDGES Listing on KOSDAQ this September
• Fraunhofer IIS and Astrodesign cooperate to offer JPEG XS solutions for video equipment manufacturer
• intoPIX SDKs rev up performance to meet the rapidly increasing encoding and decoding demand of Software-based Production & Pro-AV
• Brite Semiconductor Provides USB IP Total Solution
• Flex Logix's Barrie Mullins To present at the 2022 AI Hardware Summit

Wednesday, September 7, 2022

• Fraunhofer IIS announces its JPEG XS SDK 5.0 solutions achieving 25% higher speed for en- and decoding
• Memory Market Collapse to Lift TSMC to Top Spot in 3Q22 Ranking
• IPrium releases CCSDS 131.2 Turbo SCCC Modulator
• Chris Stevens, Industry Veteran Joins BrainChip to Lead WW Sales
• QuickLogic Awarded a $6.9 Million Base Contract to Develop Strategic Radiation Hardened FPGA Technology
• SiMa.ai Partners with GUC to Accelerate Time to Market for Industry's First Purpose-Built Machine Learning Platform for the Embedded Edge
• Samsung Sounds Alarm About '22 Chip Market Landing
• TSMC August 2022 Revenue Report
• Global Semiconductor Equipment Billings Increase 7% in Q2 2022, SEMI Reports
• intoPIX unveils new FastTicoRAW & FastTicoXS codecs for Apple silicon and makes the switch to ARM-based technology simple
• Renesas Extends Leading RISC-V Embedded Processing Portfolio with New Motor Control ASSP Solution
• TSMC becomes No.1 Chip Company

Tuesday, September 6, 2022

• Global Top Ten IC Design House Revenue Spikes 32% in 2Q22, Ability to Destock Inventory to be Tested in 2H22, Says TrendForce
• Morse Micro Raises $140M in Series B Funding to Accelerate IoT Connectivity and Revolutionize our Digital Future
• Global Semiconductor Sales Increase 7.3% Year-to-Year in July, but Growth Slows
• NASA Selects SiFive and Makes RISC-V the Go-to Ecosystem for Future Space Missions

Tuesday, September 6, 2022

• Alphawave Adopts Diakopto's PrimeXâ„¢ as Top-Level EM/IR Signoff Methodology for 5nm and 3nm Technologies

Monday, September 5, 2022

• Making chip design easy
• Archer Materials partners with GlobalFoundries to advance 12CQ chip fabrication - Quantum Computing
• Alphawave Adopts Diakopto's PrimeX™ as Top-Level EM/IR Signoff Methodology for 5nm and 3nm Technologies
• Intrinsic ID Collaborates with Synopsys to Boost SoC Security and Accelerate Time to Market
• UMC Reports Sales for August 2022
• SiMa.ai Develops the Industry's First Purpose-Built Machine Learning System-on-Chip with TSMC's Power Efficient Technology
• DELTACAST announces low-bitrate SMPTE 2110-22 video streaming support in its IP Virtual Card with intoPIX JPEG XS Software
• Sondrel complements its Architecting the Future IP platforms with pre-packaged supply chains for reduced risk

Sunday, September 4, 2022

• From Presence Detection to Vital Sensing: How to Develop Your IoT Solution Quickly
• TSMC plans to mass produce 2nm chips in 2025 and adopts US EDA software: report
• New U.S. Rule Could "Impair" China's AI Progress
• Elevate your High-speed data transmissions to the next level for all Display interfaces with the MIPI D-PHY/ LVDS Combo PHY IP Cores in 40nm
• Sonical partners with Dolphin Design to build the future of hearables
• Qualcomm hits back at ARM over lawsuit
• GUC Monthly Sales Report - August 2022

Friday, September 2, 2022

• Why Automotive Cybersecurity Is Important

Thursday, September 1, 2022

• Video IP integrated into MLSoC platform
• Imagination hires Michael Trzupek as new Chief Financial Officer
• USB Promoter Group Announces USB4® Version 2.0
• Arasan achieves ISO 26262 ASIL B automotive safety certification for its Total eMMC IP Solution

Wednesday, August 31, 2022

• Synopsys Approves Stock Repurchase Program with Authorization Up to $1.5 Billion
• Intel Taps MIPS eVocore for Intel Pathfinder for RISC-V
• Cadence Completes Acquisition of OpenEye Scientific
• Avant Technology Represents NSITEXE's RISC-V Processor IP Products in Taiwan and China
• Menta SAS is exhibiting at DVCon India 2022 and will offer a Technical Workshop
• Alphawave IP Announces Completion of Acquisition of OpenFive

Wednesday, August 31, 2022

• Intel® Pathfinder for RISC-V Delivers New Capabilities for Pre-Silicon Development

Tuesday, August 30, 2022

• Renesas to acquire Steradian for ADAS radar expertise
• Intel puts more weight behind RISC-V with Pathfinder platform
• Arm Files Lawsuit Against Qualcomm and Nuvia for Breach of License Agreements and Trademark Infringement
• Rapid Silicon's Raptor Software Out-Performs All EDA Tools in the Industry
• CHIPS Act to Revitalize the U.S. Semiconductor Manufacturing Industry
• Renesas to Acquire Steradian to Expand Its Reach in the Radar Market
• NSITEXE teams for RISC-V edge AI platform
• Samsung Electronics to Produce Google's 3-nm Mobile Chips
• Codasip joins Intel Pathfinder for RISC-V program
• Four Large Agreements Prop Up 2022 Semiconductor M&A Total
• Q2'22 saw a significant decline in GPU and PC shipments quarter to quarter
• Intel Pathfinder for RISC-V Delivers New Capabilities for Pre-Silicon Development
• Allegro DVT Partners with SiMa.ai to Optimize Power Efficiency for Embedded Edge Applications