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Wednesday, August 25, 2021

• Can AI Design a Better Chip Than a Human?
• JEDEC Publishes XFM Embedded and Removable Memory Device Standard to Expand Storage Solutions in Embedded and Automotive Applications
• UK Regulator Says Nvidia-Arm Deal Could Stifle Innovation
• North American Semiconductor Equipment Industry Posts July 2021 Billings
• Cerebras Systems Announces World's First Brain-Scale Artificial Intelligence Solution
• Lattice Certus-NX FPGAs Optimized for Automotive Applications
• Synopsys Initiates $175 Million Accelerated Share Repurchase Agreement
• Espressif Systems Announces an IEEE 802.15.4 + Bluetooth 5 (LE) RISC-V SoC
• Lattice Semi Tunes its FPGA For Auto Apps

Tuesday, August 24, 2021

• CAES to Enable Critical Infrastructure for Next Generation Lunar Landers
• Flex Logix Appoints Lee Leibig As Vice President Of Sales For AI Inference
• Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem
• Esperanto Technologies Unveils Energy-Efficient RISC-V-Based Machine Learning Accelerator Chip
• Brainchip looks at transfer and incremental learning - which is more efficient?
• TSMC shares up on price increase; company declines to comment

Monday, August 23, 2021

• MIPI DSI-2 boosts user-experience in mobile/automotive displays
• Quantum Computing Technologies Highlight CMC Microsystems' Plan to Accelerate High Tech Manufacturing in Canada
• Synopsys Enables First-Pass Silicon Success for Achronix's New FPGA for Data and AI Acceleration Applications
• Rambus Preps for HBM3
• IBM claims its new processor can detect fraud in real time
• TSMC Confirms 3nm Delay
• PragmatIC Semiconductor re-invents the iconic processor that changed the world
• Imagination, update on 2021 progress
• Engineering recruitment stepped up by surge in demand for ultra-low power memory solutions
• eTopus Selects Diakopto's ParagonX Platform for Ultra-High Speed SerDes IP
• Samsung HBM-PIM AI accelerator converges logic and memory
• Rambus Preps for HBM3

Sunday, August 22, 2021

• Intel Foundry Services Wins US Defense Contract for Chips with 18A Node
• ARM Nvidia deal goes to full investigation in the UK
• Samsung Passes Intel to Become World's Largest Semi Supplier in 2Q21
• BAE Systems collaborates with GlobalFoundries to produce radiation-hardened single board computers for space
• Rambus HBM3-Ready Memory Subsystem Advances AI/ML Performance

Saturday, August 21, 2021

• Diakopto Unveils PrimeXâ„¢ - Revolutionary EDA Solution for Top-Hierarchy Power Grid and Signal Net EM/IR

Thursday, August 19, 2021

• Samsung re-takes No.1 spot
• Nvidia-Arm merger would substantially lessen competition says U.K. government report
• Renesas-Dialog deal: MCUs evolving into powerful SoCs
• Samsung Overtakes Intel to Become World's Largest Semi Supplier in 2Q 2021

Wednesday, August 18, 2021

• Prodapt Acquires Innovative Logic, will Expand to Silicon Valley, and Serve Global Digital Platform Companies
• Edge-computing voice recognition on DSP-capable RISC-V processors
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2021
• Andes Technology and Cyberon Collaborate to Provide Edge-Computing Voice Recognition Solution on DSP-capable RISC-V Processors
• Dialog launches new family of auto buck converters

Tuesday, August 17, 2021

• Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation
• Imec and Xanadu engage in SiN
• Rambus Completes Acquisition of PLDA
• Arasan Chip Systems announces its 2'nd Generation Sureboot QSPI IP
• Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications

Monday, August 16, 2021

• Intel, Synopsys set for trademark battle
• Tech Investors Remain Bullish on AI Startups
• AV Safety-Report Scorecard Reveals Gaps in Information
• RISC-V wireless chip with Adaptive Body Bias reaches pW power
• CSEM and USJC team up to develop an ultra-low-power chip
• Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready Memory Subsystem
• BrainChip Receives Akida Chips from Socionext America
• Major Update to MIPI DSI-2 Specification Enables Advancements in Mobile Displays
• Xpeedic EDA Cloud Platform on Microsoft Azure
• AV Safety-Report Scorecard Reveals Gaps in Information
• Cadence and Tower release RF SOI process

Sunday, August 15, 2021

• RISC-V CEO: Biggest opportunity to change computing since the 1980s
• NVIDIA and the $40bn acquisition of Arm: Will the UK government block it - and should it?
• Cobham to buy Ultra Electronics for £2.57bn
• CrossBar Aims to Secure Computing with ReRAM
• Rambus HBM subsystem more than doubles HBM2E speed
• The Worldwide Semiconductor Market is expected to show an outstanding growth-rate of 25.1 percent in 2021
• Renesas and Dialog Semiconductor Announce Conclusion of Final Regulatory Review and the Expected Closing Date for Renesas' Proposed Acquisition of Dialog Semiconductor
• Palma Ceia SemiDesign Named to EE Times "Silicon 100 Startups Worth Watching In 2021"
• Tower Semiconductor and Cadence Announce New Reference Flow for Advanced 5G Communications and Automotive IC Development
• Motivo, Inc. Raises $12 Million Series A to Accelerate AI-Enabled Chip Design and Improve Manufacturing Yields