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Wednesday, July 28, 2021

• Tensilica Xtensa processors address stringent automotive safety requirements
• IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year
• SmartDV Leads Industry with Greatest Number of Design and Verification MIPI Protocol Standards Solutions for Mobile Applications
• Optima Design Automation Announces TUV Certification of its Entire Safety Platform for ISO 26262 ASIL-D Functional Safety Verification
• Ampere to Acquire OnSpecta to Accelerate AI Inference on Cloud-Native Applications
• Silicon Wafer Shipments Reach New High in Second Quarter 2021, SEMI Reports

Tuesday, July 27, 2021

• Taiwan gives TSMC green light for most advanced chip plant
• The 2021 RISC-V Summit to Co-Locate with the 58th Design Automation Conference (DAC) in San Francisco
• Semiconductor Industry: Foundry Competition Intensifies
• Mercury introduces industry-first heterogeneous processing module with integrated artificial intelligence functionality
• PUFsecurity's PUFiot Helps IoT Devices Meet FIDO Device Onboard Specification
• DDR Combo PHY & Controller IP Core Silicon Proven in 12nm & 28nm available for immediate licensing
• JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications
• Cadence Tensilica Xtensa Processors Address Most Stringent Automotive Functional Safety Requirements with Full ISO 26262 Compliance to ASIL-D
• Arm's Startup Day Shows its Support for Future Hardware Startups
• What matters most in Samsung's foundry business?

Monday, July 26, 2021

• Soitec Aims to Triple Revenues by 2026, Joins EU Chip Alliance
• Manchester, Dresden, Globalfoundries produce SpiNNaker2 chip
• Intel charts path to 1nm - video
• Is RISC-V the Future?
• Blaize, leading AI Solution for Edge Computing, Announces $71M Series D Financing to Further Accelerate Growth
• TU Dresden, University of Manchester and GlobalFoundries Announce SpiNNaker2, a Breakthrough in AI Cloud Systems, Bringing Real-Time AI with below Millisecond Latency and high Energy Efficiency to Cloud Scale
• CAST And Avery Design Systems Expand IP Partnership to Support Next Generation High-Bandwidth Automotive Networking And Control Systems
• Cadence Announces Anirudh Devgan to Become CEO in December 2021; Lip-Bu Tan to Transition to Role of Executive Chairman at That Time
• IoT Pioneer Wiliot Secures $200 Million Investment Round Led by SoftBank Vision Fund 2

Sunday, July 25, 2021

• BrainChip Discusses AI's Positive Impact on the Human Condition with Public Interest Technology Advocate Katina Michael
• DDR Combo PHY & Controller IP Core Silicon Proven in 12nm & 28nm available for immediate licencing
• Bankrupt Tsinghua Unigroup advertises for investors
• TSMC considers German fab
• TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman

Thursday, July 22, 2021

• Tessent boosts simultaneous analysis of hardware and software in SoC designs
• Cadence Extends Digital Design Leadership with Revolutionary ML-based Cerebrus, Delivering Best-in-class Productivity and Quality of Results

Wednesday, July 21, 2021

• U.K. Government to Co-invest £375m in Breakthrough Tech Firms
• Fraunhofer IIS successfully tests terrestrial IoT technology mioty® via GEO satellite
• Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution
• DVB-S2X Wideband Demodulator IP Core from Creonic Now Available with Time-Slicing Support (Annex M)
• Moschip Continues to Soar Consecutively for the 6th Quarter
• Kameleon Security Adds Investment from Xilinx to Deliver Hardware Cybersecurity for Servers
• Achronix Announces Record Second Quarter 2021 Financial Results and Business Highlights
• CEVA Continues to Lead the Way in Wireless Connectivity with Bluetooth 5.3 IP
• NovaSparks Unveil the First FPGA Market Data Aggregator
• Is TSMC-Sony A Sign Of Things To Come?
• Agile Analog brings analog IP to RISC-V International

Tuesday, July 20, 2021

• After 3D printing now comes 4D printing
• A natively flexible 32-bit Arm microprocessor
• Adding Intelligence to the Grid
• Mercury teams up with CoreAVI to provide safety-certified solutions
• ARM shows first plastic M0+ microcontroller
• Intel's foundry ambitions could be slowed by lack of deal targets
• Attopsemi's I-fuse OTP IP Now Qualified on a Japanese Wafer Fab's 130nm BCD and Embedded into ABLIC's IC Product

Monday, July 19, 2021

• Where Will TSMC Be in 5 Years?
• Agile Analog joins RISC-V International as a strategic member
• A surprising new job for RERAM technology
• European Commission forms processor, semiconductor alliance
• CrossBar Announces ReRAM Based PUF Keys
• GOWIN Semiconductor Announces their ISP (Image Signal Processor) IP Core and Solution
• CAES Receives Contract from Vinnova to Advance High Performance RISC-V Space Computing
• GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing

Sunday, July 18, 2021

• $10m for French quantum carbon nanotube startup
• TSMC in 'Due Diligence' on Possible Japan Fab
• Chip Shortages May Persist Until 2023, Analysts Say
• CXL Product Pipeline Gets Flowing
• Precise-ITC 1.6T/800G/400G IP Product Series for Datacentre Application
• Secure-IC establishes new references to secure the Internet of Things
• Imperas updates Free reference model riscvOVPsimPlus with new RISC-V P (SIMD/DSP) extension and Architectural Validation Test Suites
• Samsung Foundry and Synopsys Collaborate to Accelerate Time to ISO 26262 Compliance for Automotive SoCs
• TSMC in "Due Diligence" on Possible Japan Fab
• Intel in talks to buy Globalfoundries
• Dolphin Design and CEA-List join forces for a new embedded AI computing platform