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Wednesday, July 14, 2021

• Electronic System Design Industry Logs Record First-Quarter Revenue Growth, ESD Alliance Reports
• TSMC Reports Second Quarter EPS of NT$5.18
• Is analog IC fab renaissance in the works?
• Accellera Board Approves Security Annotation for Electronic Design Integration Standard 1.0 for Release
• Xenergic Raises 40 MSEK In New Share Issue
• Taiwan Maintains Edge as Largest Base for IC Wafer Capacity
• Quantware Launches the World's First Commercially Available Superconducting Quantum Processors, Accelerating the Advent of the Quantum Computer.
• Xilinx Versal HBM Series with Integrated High Bandwidth Memory Tackles Big Data Compute Challenges in the Network and Cloud
• Weebit completes design and tape-out of embedded ReRAM module
• Realtek selects Imagination GPU for use in DTV

Tuesday, July 13, 2021

• Neuromorphic processor leader Innatera appoints Prof. Alberto Sangiovanni-Vincentelli Chairman of Board
• Taiwan Maintains Lead in IC Wafer Capacity
• Rethinking Automotive Electronics Networks
• Innatera Unveils Neuromorphic AI Chip to Accelerate Spiking Networks
• Russia To Build RISC-V Processors for Laptops: 8-core, 2 GHz, 12nm, 2025
• Samsung Electronics May Apply 3-nm Process to Its Own Chips First

Monday, July 12, 2021

• IEEE Adopts MIPI A-PHY, First Industry-Standard, Long-Reach SerDes Physical Layer Interface for Automotive Applications
• RISC-V based XiangShan processor poses another threat to Intel
• European startup ships first commercial quantum processor
• China set to achieve 14 nm breakthrough in 2022
• TSMC looks to 12nm Dresden fab
• TTTech Aerospace releases the world's first 1 Gbit/s A664 End System IP certified to the highest civil aviation standards
• IQ-Analog Adopts Diakopto's ParagonX Platform for Next-Generation 5G Wireless Communications ICs
• Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs
• Achronix and ACE Convergence Acquisition Corp Mutually Agree to Terminate Merger Agreement

Sunday, July 11, 2021

• "Insolvent" Tsinghua Unigroup Aims to Restructure
• Algolux Closes $18.4 Million Series B Round for Robust Computer Vision
• Andes certifies Imperas RISC-V Reference Models for the new RISC-V P (SIMD/DSP) extension
• Flexible fab could slash chip shortage

Thursday, July 8, 2021

• TSMC to benefit from change in chip industry
• TSMC June 2021 Revenue Report
• Pim Tuyls: IoT Security, Technology Scaling, and Quantum Threats
• Fraunhofer IPMS RISC-V processor core for functional safety supported by development tools from IAR Systems

Wednesday, July 7, 2021

• Secure-IC receives the Cybersecurity Made in Europe label
• Liverpool 5G Create and Blu Wireless develop industry-boosting IP
• Another Industry first: Extreme Networking- 1K TCP & UDP Session on intel/Xilinx FPGAs, high availability application performance - 2U Accelerator box with Linux iWARP/RoCE
• Faraday Succeeds in 5G NR mmWave ASIC
• PUFsecurity Provides Free Access to its Root of Trust and Security Co-Processor Solutions

Tuesday, July 6, 2021

• Winbond, Renesas accelerate building of embedded AI
• 14nm FinFET production USB3.0/PCIe3.0/SATA3.0/SGMII Combo PHY IP Core, available for immediate licencing.
• Tech's Effects Are Not Always Clear. Here Are 10 Examples That Provides Clarity
• Aldec launches its first RISC-V PolarFire FPGA emulation board
• Renesas releases modular IoT development platform
• Solid-State LiDAR Empowers ADAS, Autonomous Driving
• Another Industry first: Extreme Networking- 1K TCP & UDP Session on intel/Xilinx FPGAs, high availability application performance – 2U Accelerator box with Linux iWARP/RoCE
• Corigine Delivers a Next-Generation Prototyping System for ASIC and Pre-Silicon Software Development

Monday, July 5, 2021

• Imec tackles interconnect heating at 1nm
• Rambus Completes Acquisition of AnalogX
• WiLAN Subsidiaries Sign License Agreement with PSMC
• Global Semiconductor Sales in May Up 26.2% Year-to-Year, 4.1% Month-to-Month
• Think Silicon and the Aristotle University of Thessaloniki Create a Research Team to Solve Engineering Challenges of Next-Generation Graphics and AI Processors

Sunday, July 4, 2021

• Open source XiangShan RISC-V processor could eventually challenge ARM Cotex-A76
• Apple and Intel to get first 3nm chips from TSMC
• UMC Reports Sales for June 2021
• Sondrel's SFA 100 IP platform for intelligence gathering chips at the Edge
• GUC Monthly Sales Report - June 2021
• Apple and Intel first to use TSMC 3nm
• Andes Technology Announces Over 2 Billion Shipments Of Andes-Embedded SoCs In 2020