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Sunday, July 3, 2022
Optima Launches New IC Security Verification Solution
SEGGER's product line fully supports Arm Cortex-M85
Enhance your High-Density data processing capabilities to new heights with the USB 3.2/ PCIe 3.1/ SATA 3.2 Combo PHY IP Core interface in 28HPC+/HPC process technology
Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets
Veriest Joins the Global Semiconductor Alliance
Thursday, June 30, 2022
The First RISC-V Laptop Announced With Quad-Core CPU, 16GB RAM, Linux Support
Samsung Leads Chip Industry with Nanochip Production
Sondrel appoints Gareth Jones as VP ASIC
Accenture Completes Acquisition of XtremeEDA to Expand Silicon Design Capabilities in Canada and US
Wednesday, June 29, 2022
Multiport Memory With Analog Port Patent Issued
2022 a Focus for 12-inch Capacity Expansion, 20% Annual Growth Expected in Mature Process Capacity, Says TrendForce
The Role of Hardware Root of Trust in Edge Devices
Alphacore Joins Forces with Quantum Leap Solutions to Bring World-Class Design IP to the North American Commercial Market
Breker Verification Systems Joins RISC-V International as a Strategic Member to Drive Cache Coherency and SoC Integration Verification Methodologies
ETSI and MIPI Alliance Announce Incorporation of MIPI I3C Basic into ETSI Smart Secure Platform
Xiphera's first financing round successfully completed
Intel Foundry Services Forms Alliance to Enable Design in the Cloud
New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs
Top Five MPU Suppliers Expand Share of Sales to 86% in 2021
New S2C Multi-FPGA Prototyping Software Eases the Pain
SiFive expands global operations, opening UK R&D Centre in Cambridge
Truechip Adds USB 4 Hub Model & USB 4 Retimer Model to its Verification IP Portfolio
Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture
Tuesday, June 28, 2022
TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later
GlobalFoundries marks milestone in new Singapore fab to open 2023
Siemens and NVIDIA to enable industrial metaverse
ARM launches ray tracing GPU core for smartphone chips
Siemens launches Siemens Xcelerator - an open digital business platform to accelerate digital transformation
Weebit Nano tapes out ReRAM demo chip to SkyWater foundry
EnSilica chassis control ASIC for premium automotive brand enters mass production
Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions
Cadence Expands Collaboration with Arm to Accelerate Mobile Device Silicon Success
Vidatronic Announces Power Management IP Now Certified on Globalfoundries' 22FDX® Platform for IoT Applications
Synopsys and Arm Strengthen Partnership to Advance Next-Gen Mobile SoCs for Arm's Total Compute Solutions
Arm Total Compute Solutions redefine visual experiences and supercharge mobile gaming
Monday, June 27, 2022
Intel boosts cloud EDA for its foundry business
Meet Axiomise's Ashish Darbari at DAC to Learn about Benefits of Formal Verification
New startup MachineWare enables ultra-fast RISC-V simulation
Synaptics Selects Allegro DVT's VVC Compliance Streams
SiFive Expands Global Operations, Opens UK R&D Center in Cambridge
Enhanced Serial Peripheral Interface (eSPI) Master/Slave Controller
UMC, eMemory, and PUFsecurity Announce Successful Silicon-Proven Secure Embedded Flash IP
Vayyar Selects proteanTecs to Advance Vehicle Safety with Predictive Analytics
Flex Logix Hires Barrie Mullins as Vice President of Product Management
Accenture Announces Intent to Acquire XtremeEDA to Expand Silicon Design Capabilities in Canada and US
Sunday, June 26, 2022
TSMC Japan 3DIC R&D Center Completes Clean Room Construction in AIST Tsukuba Center
Ansys Multiphysics Solutions Achieve Certification for TSMC's N3E and N4P Process Technologies
Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
sureCore's ultra-low memory technologies enable designers to create the reality of the metaverse
Ansys and TSMC Collaborate to Deliver Multiphysics Design Methodology for Wireless Chips
IAR Systems enable Visual Studio Code extensions to meet developer demands
TSMC Japan 3DIC R&D Center Completes Clean Room Construction in AIST Tsukuba Center
GbE (10/100/1000 Base-T) PHY IP licensed by 3 different customers in Q2 alone for Worldwide Use
Wednesday, June 22, 2022
CFX announces commercial availability of anti-fuse OTP technology on 90nm CIS process
IPrium releases 4-channel ATSC 8VSB Modulator
Synopsys Completes Acquisition of WhiteHat Security
Pulsic Enhances Unity Chip Planning Technology with Incremental Floor-planning Capability to Speed IP block Placement, Planning
Weebit Nano to publicly demonstrate its ReRAM IP module for the first time
GlobalFoundries Celebrates New Singapore Fab with Arrival of First Tool
Tortuga Logic Rebrands as Cycuity as It Addresses Evolving Needs in Product Security
Brite Launches High-Precision 16 bit SAR ADC
Xiphera receives Business Finland's Young Innovative Company funding
Tuesday, June 21, 2022
PCI-SIG® Announces PCI Express® 7.0 Specification to Reach 128 GT/s
Foundry Output Value Up 8% in 1Q22
RISC-V International emits more open CPU specs
TSMC Creates Design Options for New 3nm Node
Intento Design Secures Third Round of Investment to Accelerate Its Commercial Deployment
MosChip Technologies Appoints Semiconductor Industry Veteran, DVR Murthy As "Vice President of Strategic Initiatives" to Implement and Execute Expanded Solution Offerings
Codasip adds Veridify secure boot to RISC-V processors
CEVA Extends its RivieraWaves UWB IP to Support CCC's Digital Key 3.0 Standard for Keyless Access to Vehicles
M31 Technology has Developed and Validated the Ultra-Low Power 12nm PCIe 5.0 High-Speed Interface IP
PCI-SIG Announces PCI Express 7.0 Specification to Reach 128 GT/s
XtremeEDA to enable IoT security deployment with Crypto Quantique's solution using Codasip's RISC-V processor
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