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Monday, June 2, 2025

• Metanoia Communications Selects Andes Technology RISC-V Processor to Boost 5G O-RAN Efficiency and Accelerate Development
• Ex-TSMC executive joins Samsung Foundry to lead US expansion
• What's making smart cities and homes even smarter?
• Metanoia Communications Selects Andes Technology RISC-V Processor to Boost 5G O-RAN Efficiency and Accelerate Development
• Siemens and IBM collaborate to bring SysML v2 model-based systems engineering to Siemens Xcelerator
• 12-bit, 5MS/s SAR ADC IP Core for Ultra-Low Power Precision Applications: T2M Unveils New IP
• Chevin are proud to be awarded runner-up of Arm Silicon Startups Contest 2025
• HPC Innovator Taps Aion Silicon for $12M RISC-V Accelerator Program
• Making Technology Real: GlobalFoundries' Vision for the Future

Sunday, June 1, 2025

• Japan's Softbank will join hands with U.S. Intel to develop a new memory semiconductor that will be used for artificial intelligence (AI)

Friday, May 30, 2025

• How Cadence Is Powering Greener Semiconductor Innovation

Thursday, May 29, 2025

• AI memory chip guru to unveil road map for next-generation HBMs
• Synopsys Issues Statement in Connection with BIS Letter
• TSMC to Open EU Design Center in Munich in Q3
• 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz
• SCI Semiconductor raises £2.5m to develop security-enhanced microcontroller based on CHERI

Wednesday, May 28, 2025

• Keysight Technologies (KEYS) to Acquire Divested Assets from Synopsys and Ansys
• Trump Blocks Chip Design Software Firms From Selling In China
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2025
• CEA Backs RISC-V for Sovereign, Scalable Computing
• Arteris Bridges Hardware-Software Gap with New EDA Tool
• Rapidus to assist training in Vietnam's semiconductor industry
• Ireland Maps Out 'Silicon Island' National Semiconductor Strategy
• Toward High-Density Embedded LiDAR for the Autonomous Vehicle of Tomorrow
• ICTK Partners with BTQ of Canada for Quantum-safe Security Solutions
• SCI Semiconductor secures £2.5m towards developing CHERI-secured MCU
• TSMC dazzles in Amsterdam
• TSMC to Open First European Design Center in Munich by Q3 2025, Focusing on AI and Automotive
• EnSilica Establishes New Engineering Hub in Cambridge
• Brite Semiconductor Releases TCAM IP based on 28HKC+ Process

Tuesday, May 27, 2025

• Keysight Announces Executive Leadership Transitions and New Appointments
• Imec ITF World 2025: The hardware horizon for AI
• Alphawave IP extends Qualcomm PUSU deadline for third time
• Soitec reports fourth quarter revenue and Full-year results of fiscal year 2025
• Towards next-generation edge-AI technologies: EU consortium opens services to external customers
• Imec's 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz

Monday, May 26, 2025

• Veriest & Xsight - Advancing Data Transfer for Cloud Data Centers
• CFX's 55nm BCD process OTP IP has been put on the shelves
• AMD sees TSMC as the clear favorite for 2nm, but Samsung remains in the game
• RISC-V Turns 15 With Fast Global Adoption
• High-Performance USB 3.2 Gen1 & Gen2 PHY and Controller IP Cores from T2M, Powers Next-Gen SoCs

Sunday, May 25, 2025

• Samsung to use Glass Substrate for Semiconductor manufacturing in 2028

Friday, May 23, 2025

• Smart Chips, Safe Trips: How DFT Powers the Future of Autonomy with Vijayaprabhuvel Rajavel
• Xiphera Wins ECSO STARtup Award 2025 for Innovation in Cybersecurity
• Analogue Insight and Tetrivis Announce Joint Development of "Eurytion RFK1," a UCIe based 12nm Ka/Ku-Band RF Chiplet Transceiver

Thursday, May 22, 2025

• How Taiwan stays ahead in semiconductor race
• Pioneering energy-efficient AI with innovative ferroelectric technology
• Samsung Electronics Nears Decision on Foundry Business Separation
• EnSilica expands satcoms user terminal portfolio with dual-beam, dual-polarization Ku-band analogue beamformer chipset
• SiFive Collaborates with Red Hat to Support Red Hat Enterprise Linux for RISC-V
• GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation

Wednesday, May 21, 2025

• Siemens democratizes AI-driven PCB design for small and medium electronics teams
• Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D
• Intel eyes sale of network and edge unit as cost-cutting continues: report
• The RISC-V World Sees Changes, Milestones, and Innovations
• Creonic Adds oFEC Codec IP Core to Portfolio, Expanding High-Speed Networking Solutions for ASIC and FPGA
• Expedera's Origin Evolution NPU IP Brings Generative AI to Edge Devices
• Cost-Optimized PolarFire® Core FPGAs and SoCs from Microchip Technology Deliver High Performance with a 30% Lower Price Tag
• BrainChip CTO to Present on Architectural Innovation for Low-Power AI at the Embedded Vision Summit