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Thursday, February 13, 2025

• Arm takes manufacturing into its own hands as it plans to sell chips
• Qualitas Semiconductor entered into IP Licensing Agreement with a Leading Korean System Semiconductor Design Company
• Why RISC-V is a viable option for safety-critical applications

Wednesday, February 12, 2025

• New Memory Architectures for SoCs and Multi-Die Systems
• What Will Sustainable Semiconductor Manufacturing Look Like by 2035?
• Ceva, Inc. Announces Fourth Quarter and Full Year 2024 Financial Results
• Synopsys Expands the Industry's Highest Performance Hardware-Assisted Verification Portfolio to Propel Next-Generation Semiconductor and Design Innovation
• Paras Defence Invests in Logic Fruit Technologies to Boost Defence Tech Capabilities at AERO India 2025
• Worldwide Silicon Wafer Shipments and Revenue Start Recovery in Late 2024, SEMI Reports
• Can silicon photonics overcome scaling challenges for AI and data centers?

Tuesday, February 11, 2025

• Soitec Accelerates Diversification to Withstand Down Cycles
• OpenAI to tape-out on TSMC 3nm this year
• Semiconductor Giants Navigate AI Boom & Trade War
• Could Thomas Caulfield lead Intel or a merged Intel-GloFo?
• Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
• TSMC Board of Directors Meeting Resolutions

Monday, February 10, 2025

• intoPIX Drives Innovation in Automotive Ethernet and Data Transmission
• ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio
• Groundbreaking Formal Verification Further Enhances the Quality of CHERIoT-Ibex

Monday, February 10, 2025

• Rambus to Present at Loop Capital Expert Call and Morgan Stanley Technology, Media & Telecom Conference
• Exploring Rapidus' Path to 2nm Mass Production: 3 Key Challenges Ahead

Sunday, February 9, 2025

• Silicon Creations Expands Clocking IP Portfolio on TSMC N2P Technology including Novel Temperature Sensor Design
• UMC Reports Sales for January 2025
• CEA-Leti Announces FAMES Pilot Line In Nature Reviews Electrical Engineering
• Gelsinger Invests In British AI Chip Startup Fractile
• EnSilica: Unaudited Results for the Half Year Ended 30 November 2024
• Onsemi's Treo Taps Weebit ReRAM
• Qualcomm says Arm has withdrawn license breach notice
• Logic Fruit Announces Strategic Partnership with PACE at Aero India 2025
• TSMC January 2025 Revenue Report and the Statement on the Impact of Earthquake
• EnSilica: Unaudited Results for the Half Year Ended 30 November 2024
• QuickLogic Integrates Synopsys Synplify Synthesis for Best-in-Class Quality of Results
• QuickLogic Unveils Aurora 2.9: Enhanced Performance and Seamless Integration
• T2M IP Announces Licensing of ASIL-B Qualified CAN XL, QSPI, LIN 2.0, I2C IP Cores to Leading Automotive Customer
• CEA-Leti Announces FAMES Pilot Line in Nature Reviews Electrical Engineering
• SoftBank in talks to buy server chip firm Ampere
• CEA-Leti Announces FAMES Pilot Line In Nature Reviews Electrical Engineering
• Gartner Says Worldwide Semiconductor Revenue Grew 18% in 2024
• Veriest Solutions Strengthens North American Presence at DVCon US 2025

Thursday, February 6, 2025

• Samsung Foundry 2 nm initial yields highly promising after last year's 3 nm struggles
• High-Performance 16-Bit ADC and DAC IP Cores Now Available for Licensing

Wednesday, February 5, 2025

• Intel partners with Japanese research institution for next-generation quantum computer
• Post-Quantum Cryptography–Securing Semiconductors in a Post-Quantum World
• Arm Holdings plc Reports Results for the Third Quarter of the Fiscal Year Ended 2025
• Why UCIe is Key to Connectivity for Next-Gen AI Chiplets
• Axiomise Launches footprint, Area Analyzer for Silicon Design

Tuesday, February 4, 2025

• Arm Reports Record Revenue in Q3
• Global semiconductor revenue to hit $705 billion in 2025 on rising AI demand
• Cadence Virtuoso Studio advanced optimization enhances MediaTek's efficiency by 30%
• Ceva-Waves Wi-Fi 6 IP Powers WUQI Microelectronics Wi-Fi/Bluetooth Combo Chip
• Accellera Board Approves Universal Verification Methodology for Mixed-Signal (UVM-MS) 1.0 Standard for Release
• GlobalFoundries Announces Leadership Transition to Drive Next Phase of Growth
• Mirabilis Design Adds System-Level Modelling Support for Industry-Standard Arteris FlexNoC and Ncore Network-on-Chip IPs

Monday, February 3, 2025

• Predictions for Multi-Die System Designs in 2025
• The First Step to a Quantum-Safe Future With Samsung Knox
• OpenAI, SoftBank tap Samsung for Stargate AI initiative
• CHERI Protects Memory at the Hardware Level
• TSMC plans for 1nm-capable gigafab in Tainan, says report
• CoMira Solutions unveils its new 1.6T Ethernet UMAC IP
• Rambus Reports Fourth Quarter and Fiscal Year 2024 Financial Results
• intoPIX Unveils Cutting-Edge AV Innovations at ISE 2025
• RISC-V in Space Workshop 2025 in Gothenburg
• Dolphin Semiconductor strengthens its governance with two key Board appointments