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Tuesday, October 7, 2025

• AI's Silicon Revolution: How Intelligent Machines are Redrawing the Semiconductor Landscape
• Omni Design Technologies Tapes Out Ultra-High-Speed 64GSPS ADC on TSMC N3 process
• DCD-SEMI Brings Full ASIL-D Functional Safety to Entire Automotive IP Cores Portfolio

Monday, October 6, 2025

• Arm Announces Earnings Release Date for Second Quarter Fiscal Year Ended 2026
• Micron Brings the Next Evolution of AI PC Memory
• Andes Technology Expands Comprehensive AndeSentry™ Security Suite with Complete Trusted Execution Environment Support for Embedded Systems
• Weebit Nano tapes out embedded ReRAM test chips at onsemi production fab
• Creonic Updates Doppler Channel IP Core with Extended Frequency Band and Sampling Range
• QuickLogic Announces $1M eFPGA Hard IP Contract for Data Center ASIC
• India ready to rev up chipmaking, industry pioneer says
• NLM Photonics validates silicon-organic hybrid performance at over 200G
• STARLight Ignites Europe's Silicon Photonics Ambitions: From Lab to Fab at 300mm
• GlobalFoundries, Corning collaborate on co-packaged optics
• Toward a secure Europe: The Netherlands to build a pan-European quantum network
• From Foundry to Fridge: Europe’s Role in the Global Quantum Supply Chain
• Keysight Expands End-of-Line Test Portfolio to Power the Future of Electric Mobility
• AI Drives PCIe Aspirations
• Samsung and OpenAI Announce Strategic Partnership to Accelerate Advancements in Global AI Infrastructure
• Project SpikeHERO Researches AI Chip for Fiber Optic Networks
• Tenstorrent Considers Multiple Chipmakers for Production Amid AI Growth
• SiPearl: launch of Athena1, the sovereign processor dedicated to dual-use
• Siemens and ASE collaborate on Innovator3D IC driven 3Dblox workflows for ASE's VIPack platform
• Siemens Unveils "Groundbreaking" Software for Automated Analog IC Tests
• Analog Bits Awarded TSMC's 2025 OIP Partner of the Year Award
• Keller says Intel needs to fix its foundry game
• Intel Allegedly in Talks with AMD for Potential Foundry Manufacturing Deal
• Rapidus Reportedly Flags U.S. Firms as Potential Customers, IBM and Tenstorrent Lead the Pack
• ASIC North Enters Strategic Channel Partnership with GlobalFoundries

Thursday, October 2, 2025

• Imec debuts a beyond-110GHz C-band GeSi electro-absorption modulator (EAM) on its 300mm silicon photonics platform
• Dnotitia Releases "Dnotitia NIAH," an Open-Source Benchmark for Long-Context LLM Performance

Wednesday, October 1, 2025

• Northern Poland Emerging as Europe's Next Semiconductor Hub
• Photonics leaders call for a €2 bn EU program to 'keep Europe competitive'
• Taiwan will not agree to 50-50 chip production deal with US, negotiator says
• Soitec initiates succession process for chief executive officer Pierre Barnabé
• Synopsys Gives Its Major EDA Offerings a Gen-AI Facelift
• TSMC Price Hikes End the Era of Cheap Transistors
• Alphawave Semi Delivers Cutting-Edge UCIe Chiplet IP on TSMC 3DFabric Platform
• Codasip RISC-V processors certified up to ASIL-D
• Key ASIC Berhad Signs RM1.11 Million Contract to Jointly Develop AI-Driven, Ultra-Low Power RF Navigation Chip with Middle East Partner
• Analogue Insight IP Group Launches Analogue Insight SAFE in Portland, Oregon to Deliver Certification-Grade Security IP for Next-Gen SoCs and Chiplets.

Tuesday, September 30, 2025

• Keysight Unveils 3GPP AI Simulation Platform to Accelerate AI-enabled 6G Communications
• CAST Expands Security IP Portfolio with High‑Performance SM4 Cipher Core
• Chip Interfaces and Prodigy Technovations validate I3C Target at MIPI Plugfest in Poland
• Silicon Creations Receives 9th Consecutive TSMC OIP Partner of the Year Award for Mixed Signal IP
• Advanced 112G SerDes PAM4 IP core for Low-Power, Multi-Reach Connectivity Across Silicon-Proven 12/7/6/5nm Nodes

Monday, September 29, 2025

• Semiconductor coalition demands revamped EU Chips Act
• Synopsys Introduces Digital Twin Racetrack and NVIDIA Omniverse to STEM Racing
• Quantum eMotion and Jmem Technology Join Forces to Deliver the First-Ever Full-Stack Quantum-Resilient Security Chip
• GlobalFoundries and Corning Collaborate To Deliver Detachable Fiber Connector Solutions to Scale Next-Generation Optical Connectivity

Saturday, September 27, 2025

• French Team Led by CEA-Leti Develops First Hybrid Memory Technology Enabling On-Chip AI Learning and Inference

Friday, September 26, 2025

• AI and Chiplets Prominent at TSMC OIP 2025
• Innosilicon to Showcase High-Speed Interface IP and Advanced SoC Solutions at the 2025 TSMC OIP Ecosystem Forum
• Weebit Nano Joins EDGE AI FOUNDATION to Advance Intelligent Systems at the Edge
• Xiphera and iWave Partner to deliver secure solutions on Altera FPGAs

Thursday, September 25, 2025

• Tenstorrent and CoreLab Technology Forge Alliance to Launch Open-Architecture Platform for Robotics and Automotive AI
• The Quantum Race: Finding Europe's Formula 1
• Tenstorrent Productizes RISC-V CPU And AI IP
• ARM unveils design office for advanced chips as India pushes chip growth
• Intel Reportedly Explores Investment Talks With Apple, Foundry Seen as Key
• Europe drives to dominate photonics
• Allegro DVT Supports AV2 Standard Ecosystem with the Launch of Comprehensive Compliance Test Tools
• Cadence Unveils AI-Driven ROCS X AI-Enabled Molecular Search, Unlocking Multi-trillion Molecule Virtual Screening
• Tenstorrent and CoreLab Technology Forge Alliance to Launch Open-Architecture Platform for Robotics and Automotive AI
• Baya Systems Collaborates with Tenstorrent to demonstrate Optimized Subsystem for TT-Ascalon™ Processors, Joins OCA Ecosystem
• proteanTecs Announces Silicon-Proven IP on TSMC's Advanced N2P Process
• M31 Advances AIoT Innovation with Ultra Low Power Memory Compilers on TSMC N6e Platform
• Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation
• Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
• Cadence Partners with TSMC to Power Next-Generation Innovations Using AI Flows and IP for TSMC Advanced Nodes and 3DFabric
• Perceptia Introduces pPLL08N: A Family of Compact Narrow-Band RF PLLs which Complement pPLL08W
• eMemory Recognized with 16th TSMC Open Innovation Platform® (OIP) Partner of the Year Award