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Friday, July 8, 2022

• True Circuits Attends Design Automation Conference

Thursday, July 7, 2022

• TSMC June 2022 Revenue Report
• Cadence Introduces the Voltus-XFi Custom Power Integrity Solution, Delivering over 3X Productivity Gains
• Nordic Semiconductor to acquire U.S. memory specialist Mobile Semiconductor
• Fabless Suppliers Hold Record 34.8% Share of Global IC Sales
• True Circuits Attends Design Automation Conference

Wednesday, July 6, 2022

• RISC-V Opens the Door on 48-bit Computing
• First RISC-V-Based SoC FPGA Enters Mass Production
• Imperas Announces Partnership with Breker to Drive Rigorous Processor-to-System Level Verification for RISC-V
• QuiX Quantum lands €5.5 million for development of world's most powerful photonic quantum computer
• Innolink - The advanced Chiplet solution complies with the Universal Chiplet Interconnect Express (UCIe) standard
• Brite Semiconductor Introduces Two Innovative Technologies For DDR PHY
• Order Cancellations Strike, 8-inch Fab Capacity Utilization Rate Declines Most in 2H22, Says TrendForce
• GUC Demonstrate World's First HBM3 PHY, Controller, and CoWoS Platform at 7.2 Gbps

Tuesday, July 5, 2022

• Imperas announce the latest RISC-V test suites are now available free with riscvOVPsimPlus
• Digital Core Design and Resquant are ready for quantum computing-resistant cryptography
• proteanTecs to Showcase Deep Data Analytics at DAC and SEMICON West 2022
• Nestwave Announces that Renesas has Adopted its IoT Geolocation Technology for Forthcoming LTE-M/NB-IoT Module
• WiLAN Signs Second Wireless License in Automotive Industry
• UMC Reports Sales for June 2022
• Outsourcing Supply Chain Management for chip manufacture can increase yields and quality
• Global Semiconductor Sales Increase 18.0% Year-to-Year, 1.8% Month-to-Month in May

Monday, July 4, 2022

• Automotive Cybersecurity: More Than In-Vehicle and Cloud
• Europe Needs 2-nm Manufacturing Process by 2030, says Soitec's CEO
• Ultra-low power memory targets the metaverse
• Faraday to Showcase FPGA-Go-ASIC Service at DAC in San Francisco
• Ludicrous Low Power (L2P) by SILICONGATE
• Multiport Memory With Analog Port Patent Issued
• Infineon to strengthen its leading expertise as IoT solution provider by acquiring verification expert NoBug in Romania and Serbia
• GUC Monthly Sales Report - June 2022

Monday, July 4, 2022

• Vidatronic Announces Power Management IP Now Certified on Globalfoundries' 22FDX® Platform for IoT Applications

Sunday, July 3, 2022

• Optima Launches New IC Security Verification Solution
• SEGGER's product line fully supports Arm Cortex-M85
• Enhance your High-Density data processing capabilities to new heights with the USB 3.2/ PCIe 3.1/ SATA 3.2 Combo PHY IP Core interface in 28HPC+/HPC process technology
• Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets
• Veriest Joins the Global Semiconductor Alliance

Thursday, June 30, 2022

• The First RISC-V Laptop Announced With Quad-Core CPU, 16GB RAM, Linux Support
• Samsung Leads Chip Industry with Nanochip Production
• Sondrel appoints Gareth Jones as VP ASIC
• Accenture Completes Acquisition of XtremeEDA to Expand Silicon Design Capabilities in Canada and US

Wednesday, June 29, 2022

• Multiport Memory With Analog Port Patent Issued
• 2022 a Focus for 12-inch Capacity Expansion, 20% Annual Growth Expected in Mature Process Capacity, Says TrendForce
• The Role of Hardware Root of Trust in Edge Devices
• Alphacore Joins Forces with Quantum Leap Solutions to Bring World-Class Design IP to the North American Commercial Market
• Breker Verification Systems Joins RISC-V International as a Strategic Member to Drive Cache Coherency and SoC Integration Verification Methodologies
• ETSI and MIPI Alliance Announce Incorporation of MIPI I3C Basic into ETSI Smart Secure Platform
• Xiphera's first financing round successfully completed
• Intel Foundry Services Forms Alliance to Enable Design in the Cloud
• New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs
• Top Five MPU Suppliers Expand Share of Sales to 86% in 2021
• New S2C Multi-FPGA Prototyping Software Eases the Pain
• SiFive expands global operations, opening UK R&D Centre in Cambridge
• Truechip Adds USB 4 Hub Model & USB 4 Retimer Model to its Verification IP Portfolio
• Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture

Tuesday, June 28, 2022

• TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later
• GlobalFoundries marks milestone in new Singapore fab to open 2023
• Siemens and NVIDIA to enable industrial metaverse
• ARM launches ray tracing GPU core for smartphone chips
• Siemens launches Siemens Xcelerator - an open digital business platform to accelerate digital transformation
• Weebit Nano tapes out ReRAM demo chip to SkyWater foundry
• EnSilica chassis control ASIC for premium automotive brand enters mass production
• Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions
• Cadence Expands Collaboration with Arm to Accelerate Mobile Device Silicon Success
• Vidatronic Announces Power Management IP Now Certified on Globalfoundries' 22FDX® Platform for IoT Applications
• Synopsys and Arm Strengthen Partnership to Advance Next-Gen Mobile SoCs for Arm's Total Compute Solutions
• Arm Total Compute Solutions redefine visual experiences and supercharge mobile gaming

Monday, June 27, 2022

• Intel boosts cloud EDA for its foundry business
• Meet Axiomise's Ashish Darbari at DAC to Learn about Benefits of Formal Verification
• New startup MachineWare enables ultra-fast RISC-V simulation
• Synaptics Selects Allegro DVT's VVC Compliance Streams
• SiFive Expands Global Operations, Opens UK R&D Center in Cambridge
• Enhanced Serial Peripheral Interface (eSPI) Master/Slave Controller
• UMC, eMemory, and PUFsecurity Announce Successful Silicon-Proven Secure Embedded Flash IP
• Vayyar Selects proteanTecs to Advance Vehicle Safety with Predictive Analytics
• Flex Logix Hires Barrie Mullins as Vice President of Product Management
• Accenture Announces Intent to Acquire XtremeEDA to Expand Silicon Design Capabilities in Canada and US

Sunday, June 26, 2022

• TSMC Japan 3DIC R&D Center Completes Clean Room Construction in AIST Tsukuba Center
• Ansys Multiphysics Solutions Achieve Certification for TSMC's N3E and N4P Process Technologies
• Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
• sureCore's ultra-low memory technologies enable designers to create the reality of the metaverse
• Ansys and TSMC Collaborate to Deliver Multiphysics Design Methodology for Wireless Chips
• IAR Systems enable Visual Studio Code extensions to meet developer demands
• TSMC Japan 3DIC R＆D Center Completes Clean Room Construction in AIST Tsukuba Center
• GbE (10/100/1000 Base-T) PHY IP licensed by 3 different customers in Q2 alone for Worldwide Use