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Thursday, May 6, 2021

• GlobalFoundries Sharpens Photonics Edge for Quantum Manufacturing

Wednesday, May 5, 2021

• CCSDS 231.0-B-3 LDPC Encoder and Decoder IP Core from Creonic Now Available
• UMC Reports Sales for April 2021
• CEVA's Bluetooth Dual Mode 5.2 Platform Achieves SIG Qualification, Expedites IC Design for TWS Earbuds and More

Tuesday, May 4, 2021

• TSMC prioritizes automotive chip supply to ease shortage
• PsiQuantum and GLOBALFOUNDRIES to Build the World's First Full-scale Quantum Computer
• Synopsys Delivers Enhanced Memory Design Productivity to Nanya Technology
• Cadence Wins Four 2020 Samsung Foundry SAFE EDA Awards
• Achronix Announces First Quarter 2021 Financial Results and Business Highlights
• Synopsys Completes Acquisition of MorethanIP
• Karen Rogge Joins Rambus Board of Directors
• Lattice Semiconductor Reports First Quarter 2021 Results
• Xilinx Reports Fiscal Fourth Quarter and Fiscal Year 2021 Results
• OmniVision Reduces Automotive Camera Design Complexity with the New, High-Performance OAX4000 ASIC Image Signal Processor
• GUC Monthly Sales Report - Apr 2021

Monday, May 3, 2021

• Intel to put $3.5bn into packaging
• NovaceneAI and CMC Microsystems deliver quantum computing to biz users
• Arm v9, the Next 10 Years
• MIPI Alliance Releases Specifications to Streamline Integration of In-Vehicle Displays, Add Functional Safety to Display Data Streams
• Synopsys to Showcase New Application Security Orchestration Solution at RSA Conference
• Esperanto Technologies Adopts Movellus Maestro AI, Intelligent Clock Networks for Its ET-SoC-1 Chip
• Rambus Reports First Quarter 2021 Financial Results
• Samsung Expected to Recapture #1 Semi Supplier Ranking in 2Q21
• SmartDV Unveils Automation Tool Suite for Use with Its Extensive Verification IP Portfolio

Sunday, May 2, 2021

• Scaleable RISC-V module for distributed AI processing
• UMC taps customers for $3.5bn fab expansion
• The Future of FPGAs
• Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports
• Faraday Reports First Quarter 2021 Revenues at NT$1,535 Million
• PathPartner Joins BlackBerry QNX Channel Partner Program to Deliver Safety-Critical and Secure Software Solutions for Automotive Industry
• BLE/15.4 2.4GHz+Sub-GHz Multi-Protocol RF Transceiver Phy KGD & IP for adding wireless Connectivity to "any MCU/SoC"
• Q1 Global Semiconductor Sales Increase 3.6% Over Previous Quarter
• Flex Logix And The Air Force Research Laboratory Sign A Broad License To Use EFLX Embedded FPGA IP In GLOBALFOUNDRIES' 12LP And 12LP+ Processes
• FPGAs in the Storm

Thursday, April 29, 2021

• Intel CEO Pat Gelsinger Seeks Support for EU Foundries
• China on way to self reliance in 28-nm chips; to attain maturity in 14-mm category as well
• Thalia Design Automation successfully delivers voltage regulator in a 22nm process node with 45% reduction in design time using its AMALIA software

Wednesday, April 28, 2021

• EnSilica Mixed Signal ASIC is PPAP Approved for Luxury Hybrid Car
• RISC-V International Welcomes Chengwei Capital as a Premier Member
• SiFive and Samsung Foundry Extend Partnership to Accelerate AI SoC Development
• CEVA Lauded by Frost & Sullivan for Addressing the Challenges of Connected Devices with Its Smart Sensing MotionEngine Software
• Fabless Suppliers Held a Record 33% of the 2020 IC Market
• Global Unichip Corporation Deploys Cadence Clarity 3D Solver to Achieve 5X Speedup of Systems Analysis for 112G Long-Reach Network Switch

Tuesday, April 27, 2021

• Cadence collaborates with Arm to accelerate SoC development
• "KI-PREDICT" – Intelligent process monitoring with on-sensor signal preprocessing
• Astera Labs and Avery Design Partner on CXL 2.0 Verification for Smart Retimer Portfolio to Improve Performance in Data-Centric Applications
• Valens Announces Successful Tapeout of First MIPI A-PHY Compliant Chipsets for Long-Reach, Ultra-High-Speed Automotive Connectivity
• Vidatronic Announces Series of Integrated Power Management Unit (PMU) IP Cores Optimized for Augmented/Virtual Reality Applications
• ACL Digital Partners with Mobiveil, High-Speed Silicon IP Platform Leader
• Skyworks to Acquire the Infrastructure & Automotive Business of Silicon Labs
• Achronix and Napatech Partner to Target Data Center Networking
• Arm Leverages Synopsys Fusion Compiler to Enable Best PPA for Latest Neoverse Platforms
• Alphawave IP aims for 100 engineers in UK design center
• Achronix Adopts eMemory IP for FPGA Hardware Root of Trust
• ARM pushes chiplets and 3D packaging for Neoverse chips

Monday, April 26, 2021

• Soitec wins two awards for its employee share ownership schemes Paris Stock Exchange:SOI
• Automotive Ethernet PHY addresses next-gen connected cars
• SiPearl launches the recruitment of 10 engineers per month in France & Germany
• Transforming compute for next-generation infrastructure
• Synopsys and Arm Deliver Comprehensive Solutions to Increase Performance and Accelerate Time-to-Market for High-Performance Computing, Data Center and AI SoCs
• Lattice and Rambus to Partner on Next-Generation Security Solutions
• BitSim and NOW Electronics joins forces BitSim
• Tiempo Secure Selects IC'Alps to Accelerate Silicon Implementation of Secure Element IP for IoT Applications
• Silicon Catalyst Announces Six Newly Admitted Companies to Semiconductor Incubator

Sunday, April 25, 2021

• Dialog adds low power Flash devices to IoT Portfolio
• Domain specific accelerators for RISC-V
• TSMC Update: 2nm in Development, 3nm and 4nm on Track for 2022
• Flex Logix Appoints CFO and VP of Inference Hardware to Senior Management Team; Announces Expansion to Austin, TX
• Defacto Technologies Announces SoC Compiler, v9
• Nvidia-ARM deal runs into security issues in the UK
• videantis and Continental sign strategic supplier contract and announce SOPs with videantis-enabled camera system
• Anritsu Corporation Selects PLDA's PCIe Solution for its Next Generation of Handheld Spectrum Analyzers