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Sunday, April 24, 2022

• Mindtree and Sapiens Announce Partnership to Digitally Transform the Insurance Industry
• MosChip Announces Appointment of Rajeev Krishnamoorthy to its Board of Directors
• Menta will attend ChipEx2022 to present Soft IP to the Israeli market for the first time
• Edgecortix Announces Sakura AI Co-processor Delivering Industry Leading Low-Latency and Energy-Efficiency
• Localization of Chip Manufacturing Rising. Taiwan to Control 48% of Global Foundry Capacity in 2022, Says TrendForce
• Imagination and Ambarella partner on autonomous vehicle human-machine interface visualisations with ASIL functional safety
• 16G Multiprotocol Serdes IP Core with different Interface protocols for your High-Speed interconnect requirements in 28HPC+ process technology is available for immediate licensing
• Wafer Capacity Forecast to Climb 8.7% As 10 New Fabs Enter Production
• Indian startup Calligo leverages POSIT with RISC-V for high-performance computing
• Alibaba Cloud Announced Progress in Porting Android Functions onto RISC-V

Thursday, April 21, 2022

• TSMC Roadmap Update: N3E in 2024, N2 in 2026, Major Changes Incoming

Wednesday, April 20, 2022

• BrainChip and NVISO partner on human behavioural analytics in AI devices
• Semiconductor Industry: US and Taiwan Leading Semicon Process Technology
• Fraunhofer IIS introduces its JPEG XS ultra-low-latency software implementation at NAB 2022
• Codasip appoints Jaime Broome as its Automotive VP
• Xylon reveals new lossless MJPEG Encoder and Decoder IP Cores
• CoreHW Announces 5A DCDC IP Availability with Unique Advantages
• Esperanto Technologies' Massively Parallel RISC-V AI Inferencing Solution Now in Initial Evaluations
• BittWare Announces Partner Program to De-Risk Innovation and Reduce Time-to-Market for FPGA-Based Solutions
• Dayang D3-Edit 5 integrates intoPIX JPEG XS technology for ultimate performances
• Dayang D³-Edit 5 integrates intoPIX JPEG XS technology for ultimate performances
• Mobile Semiconductor's 22FDX Register File Memory Compiler Receives Globalfoundries Platinum Status

Tuesday, April 19, 2022

• RISC-V Startup Esperanto Technologies Samples First AI Silicon
• Prevas acquiring BitSim NOW AB
• Rapid Silicon Licenses AndesCore D45 with DSP/SIMD extensions and Andes Custom Extension Framework
• BrainChip and NVISO Partner on Human Behavioral Analytics in Automotive and Edge AI Devices

Monday, April 18, 2022

• Report: Russia to develop its own semiconductors
• Intel: Our fabs can mass produce silicon qubit devices
• TSMC Dwarfs Samsung Electronics in Foundry Business
• Intel: Our fabs can mass produce silicon qubit devices
• Hon Hai acquires arQana's Wireless Telecommunications Business
• Synopsys Introduces Industry's Highest Performance Neural Processor IP
• Agnisys Announces ISO 26262 and IEC 61508 Qualification for Entire IDesignSpec Suite - SoC Specification Automation Flow
• Flex Logix Appoints Chris Passier as Vice President, Platform Software and Vancouver, Canada Site Executive
• OPENEDGES Prepares for Initial Public Offering
• JESD204B Tx & Rx SerDes IP Core (12.5Gbps & 16Gbps) in 28HPC+ and 40LL process technologies for High-Speed Serial Interface with Matching Controller IP Core is available for immediate licensing

Sunday, April 17, 2022

• TSMC's 2025 timeline for 2nm chips suggests Intel gaining steam
• MOSCHIP Announces High Speed Serial Trace Probe (HSSTP) PHY With Link Layer in 6nm

Wednesday, April 13, 2022

• How Investments in Manufacturing will Benefit the Semiconductor Ecosystem
• Siemens' new mPower Digital solution now certified for GlobalFoundries' platforms
• Mirabilis Design announces Meraki Tech-Sol as their official sales & marketing partner in India for the VisualSim product-line
• Automotive Functional Safety with DCD's CAN ALL IP Core
• QuickLogic Adds GlobalFoundries 22FDX Process to its Growing List of Australis IP Generator-Based eFPGA IP
• TSMC Reports First Quarter EPS of NT$7.82
• SEGGER and Renesas deliver Device Lifecycle Management (DLM) for RA MCUs
• Gartner Says Worldwide Semiconductor Revenue Grew 26% in 2021
• Total IC Unit Shipments Forecast to Climb 9% This Year
• Renesas Introduces Industry's First PCIe Gen6 Clock Buffers and Multiplexers
• Synopsys Study Highlights Challenges with Managing Open Source Risk in Software Supply Chains

Tuesday, April 12, 2022

• SiemensÂ’ New mPower Digital Solution Now Certified for GlobalFoundriesÂ’ Platforms
• Siemens' New mPower Digital Solution Now Certified for GlobalFoundries' Platforms
• New Fujitsu cloud service is based Arm chips used in the world's fastest supercomputer
• Virtual development environment for fast automotive application software development
• POLYN Technology Delivers NASP Test Chip for Tiny AI
• 2021 Global Semiconductor Equipment Sales Surge 44% to Industry Record $102.6 Billion, SEMI Reports