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Sunday, April 10, 2022

• Intel Says It'll Deliver 2025 Chip Tech a Half Year Early
• China opens new research institute to develop RISC-V processor project
• Chiplets Get a Formal Standard with UCIe 1.0
• 200mm Semiconductor Fab Capacity Set to Surge 21% to Mitigate Supply-Demand Imbalance, SEMI Reports
• Taipei Puts Case for Being Close to Core of Semiconductor Ecosystem
• MIPI CSI-2 Tx and Rx Controller IP Cores for Highly modular and configurable Camera Interfaces is available for immediate licensing
• Cadence Spectre FX FastSPICE Simulator Is Adopted by SK Hynix to Accelerate DRAM Design
• CFX announces commercial availability of anti-fuse OTP technology on 28HV process
• Top Five Leaders Continue Expanding Share of Global IC Fab Capacity
• Chiplets Get a Formal Standard with UCIe 1.0
• TSMC March 2022 Revenue Report

Saturday, April 9, 2022

• TSMC Q1 Revenue Record: 35.5% Increase Year-Over-Year

Thursday, April 7, 2022

• MACsec solution for 5G transport network security is available
• The Art of Predictability : How Axiomise is Making Formal Verification Mainstream
• UMC Reports Sales for March 2022
• Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications

Wednesday, April 6, 2022

• Intel, Micron, and Analog Devices Join MITRE Engenuity's Semiconductor Alliance to Define Principles for Joint Research and Collaboration for a More Resilient U.S. Semiconductor Industry
• SmartDV Expands Executive Team With McKenzie Ross as Vice President of Marketing
• Synopsys and Juniper Networks Invest in New Company to Pursue Fast-Growing Silicon Photonics Market
• Weebit Nano demo chips integrating its embedded ReRAM module successfully complete functional testing phase
• Claudia Fan Munce Joins Arteris IP Board of Directors
• SK hynix Looking to Buy Arm
• RISC-V startup recruits former Agile Analog CEO Ramsdale
• Andes Releases AndeSight IDE v5.1 to Simplify Software Development for RISC-V Heterogeneous Multiprocessor and AI
• Sondrel warns that packaging lead time have dramatically increased from 8 to more than 50 weeks

Tuesday, April 5, 2022

• What Drives Autonomous Vehicles?
• Sondrel warns that packaging lead times have jumped to more than 50 weeks
• Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for AI Training Applications
• Codasip appoints Japan EDA veteran
• Global Semiconductor Sales Increase 32.4% Year-to-Year, 3.4% Month-to-Month in February
• GUC Monthly Sales Report - March 2022
• Trilinear Technologies Announces the sixth generation of DisplayPort Link Controller Cores
• Silicon Creations' Engineering Team Completes Training for Automotive Quality Certification

Monday, April 4, 2022

• Automation for the automators of things
• Can SiFive thrive? Chip designer needs a strong RISC-V ecosystem to succeed
• Chinese Companies Hold Only 4% of Global IC Marketshare
• Flex Logix Leads eFPGA Market with more than 17 Licensed Customers
• Arteris IP FlexNoC Interconnect and Resilience Package Licensed in Neural Network Accelerator Chip Project Led by BMW Group
• BrainChip and SiFive Partner to Deploy AI/ML Technology at the Edge
• New Arm-based cloud services from Microsoft highlight the power of choice in computing
• MIPI UFS Controller, MIPI Unipro Controller and MIPI M-PHY IP Cores available in different Fabs and Nodes for all High-density Flash Storage applications in advanced SoCs
• Eurosmart publishes PP-0117 Secure Sub-System SoC Protection Profile: Tiempo Secure IP products are ready

Sunday, April 3, 2022

• Forget the metaverse – Labster raises $47m to build the 'eduverse'
• Samsung and Western Digital begin far-reaching collaboration
• Nvidia to Use TSMC's 4-nm Process to Produce H100 GPUs
• Electronic System Design Industry Logs 14.4% Year-Over-Year Revenue Growth in Q4 2021, ESD Alliance Reports
• Hynix mulling a bid for Arm
• SMIC Announces 2021 Annual Results
• VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium

Friday, April 1, 2022

• Why Did Intel x86 Beat RISC Processors in the 1990s?

Thursday, March 31, 2022

• RISC-V takes steps to minimize fragmentation

Wednesday, March 30, 2022

• Samsung Foundry Adopts Leading Voltage-Timing Signoff Solution from Synopsys and Ansys for Advanced-Node, Energy-Efficient Chips
• Chip demand is slowing says TSMC chairman
• Arm transfers most of its Arm China shareholding to Softbank
• M31 Speeds Delivery of Silicon IP by 5X Using the Cadence Library Characterization Solution in the Cloud
• Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development
• SEGGER Embedded Studio for Arm now with hard real-time C++ support
• ARIES Embedded Presents New MCXL Reference IP Design
• intoPIX announces TicoRAW integration into the new Novitec industrial camera portfolio
• SiFive Appoints Nicole Singer as Chief Human Resources Officer to Drive SiFive Growth and Hiring
• WiLAN and Kyocera Enter New Wireless License

Tuesday, March 29, 2022

• TSMC says demand for smartphones, PCs starting to slow
• Samsung, TSMC Appeal For The $52 Billion US Chip Program
• Arm plans transfer of shares in China JV to speed up U.S. IPO - FT
• AMD may be looking towards RISC-V in future CPUs
• Alena Shiltova becomes Marketing Communications Manager at Menta
• Synopsys Launches Industry's First Broad-Scale Cloud SaaS Solution to Transform Chip Development Landscape
• Alma Technologies Launches Scalable Encoder and Decoder Semiconductor IP for VESA DSC 1.2b Visually Lossless Compression
• CAST Receives ISO 9001:2015 Certification
• Flex Logix Announces Production Availability of InferX X1M Boards for Edge AI Vision Systems
• QuickLogic Announces a New $1.5 Million eFPGA Contract
• IAR Systems enables powerful AI/ML applications based on Alif Semiconductor's microcontrollers and fusion processors
• Microcontrollers Get a Lift from Automotive After 2021 Rebound