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Thursday, March 25, 2021

• GUC and Ansys Expedite Advanced-IC Designs for Next-Generation Applications with State-of-the-Art Simulation Workflow
• Siemens delivers next-generation, comprehensive hardware-assisted verification system

Wednesday, March 24, 2021

• Intel Investing $20B in Building Foundry Business
• CEA-Leti Goes For Optical Phased Arrays to Cut LiDAR Cost
• North American Semiconductor Equipment Industry Posts February 2021 Billings, Surpassing $3 Billion for Second Consecutive Month
• PLDA Joins ETP4HPC to share its expertise in High Speed Interconnect Solution IP with the European High Performance Computing Ecosystem
• Revenue of Top 10 IC Design (Fabless) Companies for 2020 Undergoes 26.4% Increase YoY Due to High Demand for Notebooks and Networking Products, Says TrendForce
• Imagination launches IMG Labs to create breakthrough technologies
• Intel CEO Pat Gelsinger Announces "IDM 2.0" Strategy for Manufacturing, Innovation and Product Leadership
• Mitacs and OpenHW Group partner on $22.5M first-of-its-kind open-source research program

Tuesday, March 23, 2021

• More resilient cybersecurity for IoT devices
• CEVA Unveils MotionEngine Scout, a Highly-Accurate Dead Reckoning Software Solution for Indoor Autonomous Robots
• GLOBALFOUNDRIES and Cadence Add Machine Learning Capabilities to DFM Signoff for GF's Most Advanced FinFET Solutions
• WISeKey Partners with Cortus to Secure Automated Vehicles Capable of Controlling All Aspects of Driving Without Human Intervention
• Achronix Adopts Movellus Maestro Clock Network for Its Speedster7t FPGAs
• Synopsys Collaborates with Keysight Technologies to Deliver Integrated Custom Design Flow for 5G Designs
• Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature

Monday, March 22, 2021

• One-Way Data Transfer Secures Industry 4.0 Networks
• Software Driving Changes in Automotive Industry
• Europe Aiming for Manufacturing Capacities for 2nm
• Intel's tilt to foundry opens a door to upstart RISC-V technology
• Valtrix and Codasip Cooperate on Verification of RISC-V Systems
• (Re)Shoring Up Semiconductor Manufacturing

Sunday, March 21, 2021

• Will Fan-Out Wafer-Level Packaging Keep Moore's Law Valid?
• Apple to Build New Mobile Wireless Design Center in Munich
• OpenPOWER Foundation Provides Microwatt for Fabrication on Skywater Open PDK Shuttle
• Global Semiconductor Materials Market Sets New High With 5% Expansion in 2020, SEMI Reports
• Flex Logix raises $55M to accelerate market adoption of AI inference and eFPGA solutions
• Chip Makers Must Learn New Ways to Play "D"

Friday, March 19, 2021

• sureCore Unveils New Low Voltage Register Files

Thursday, March 18, 2021

• Samsung, TSMC Spending to Dominate Advanced IC Technology Nodes

Wednesday, March 17, 2021

• Japanese AI processor firm picks Risc-V for partner CPU
• SMIC and Shenzhen government to invest $2.35 billion to build new foundry in China
• Sondrel designs its first Radiation-Hard chip
• Siemens' Veloce Virtual Network App Certified for IxVerify 3.0
• More than Chiplets | Facebook Enters the Fray
• SiFive and ArchiTek Enable Secure, Private, Flexible Edge AI Computing With AiOnIc Processor
• Global Fab Equipment Spending Poised to Log Three Straight Years of Record Highs, SEMI Reports
• Smart Lighting Platform "end to end" Management Solution licensed by leading European Lighting Company
• Advanced Nodes Boosting Foundry Revenues

Tuesday, March 16, 2021

• South Korea and China Increase Patent Applications in Europe
• US$150 billion needed in 5 years to catch up with TSMC: IC Insights
• Arasan announces its next generation of C-PHY/ D-PHY Combo IP Core compliant with the latest MIPI Specifications
• Panasonic Starts Licensing IP Core for Semiconductors Complying with the IEEE 1901-2020 International Standard
• Samsung and TSMC Seeking to Spend Their Way to Worldwide Domination of Advanced IC Technology
• Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis
• Synopsys Launches Industry's First Complete IP Solution for PCI Express 6.0

Monday, March 15, 2021

• James Mitarotonda Joins Rambus Board of Directors
• Qualcomm Completes Acquisition of NUVIA
• Lattice Partners with DARPA Toolbox Initiative to Accelerate Technology Innovation
• Ron Black Joins Codasip as Executive Chairman
• Socionext's latest generation of smart display controllers uses APIX3 technology from Inova Semiconductors
• Secure-IC Announces Partnership With U.S. DARPA To Foster Security Technology Innovation
• QuickLogic Joins DARPA Toolbox Initiative to Provide Mil/Aero/Defense Grade Programmable Logic
• Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
• Alphawave IP and EnSilica Announce Partnership for Expansion in the United Kingdom and Europe

Sunday, March 14, 2021

• 2 charts show how much the world depends on Taiwan for semiconductors
• MIPS, China's Loongson CPU Are Both Going All-in on RISC-V
• A high-performance and optimized Video IP: Chips&Media at the Semiconductor360 Live 2021
• Rockley Selects Synopsys for Silicon Photonics Design Solutions
• NUVIA Selects Avery Design for Next Generation PCIe Verification