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Thursday, March 11, 2021

• First software-defined 5G New Radio demonstration over GEO satellite
• Cornami Partners with Inpher, Pioneer in Secret Computing, to Deliver Quantum-Secure Privacy-Preserving Computing on Encrypted Data
• Open RF Association and MIPI Alliance Sign Cooperation Framework (Liaison) Agreement

Wednesday, March 10, 2021

• AI Drives Memory Interconnect Evolution
• https://www.eetimes.com/ai-drives-memory-interconnect-evolution
• OpenHW Group and Mitacs announce OpenHW Accelerate
• Tortuga Logic Announces Expansion of Product Portfolio with Development of New Security Governance Platform
• SiPearl passes a key milestone for Rhea's launch by moving into an accelerated simulation phase with Siemens' Veloce platform
• Allegro DVT Releases New Versions of its Encoder and Decoder IPs with Support for 12-bit sample size and 4:4:4 Chroma Format
• Mixel, Rambus and Hardent Collaborate to Deliver State-of-the-Art Integrated MIPI Display Subsystem Solution
• Vtool Appoints EmergeTek as Cogita Sales Representative

Tuesday, March 9, 2021

• QuickLogic, SparkFun and Crowd Supply Launch the SparkFun Thing Plus - QuickLogic EOS S3 Development Kit
• Eta Compute's Low Power AI Vision Board Accelerates Design, Test, and Deployment of Transformative Embedded Vision Solutions
• USB 4.0, USB 3.2, USB 3.1, USB 3.0, USB 2.0, Device, Hub, Host & Dual Mode proven Interface IP Controllers are available immediately to License
• Compound Photonics Partners with GLOBALFOUNDRIES to Manufacture World's First Monolithic Microdisplay for Real-Time AR
• TSMC February 2021 Revenue Report
• IC Insights Raises Its 2021 IC Market Forecast from 12% to 19% Growth
• 10 Millionth Achronix Speedcore eFPGA IP Core Shipped

Monday, March 8, 2021

• Hsinchu Baoshan R&D center to work on 3nm process: TSMC
• TSMC together with Apple are developing 2nm process technology
• Alphawave and PLDA Announce a Collaboration to Create Tightly-Integrated Controller and PHY IP Solutions for Interconnects Including PCIe 5.0, CXL and PCIe 6.0
• AMD and Xilinx Special Meetings of Stockholders to be Held on April 7, 2021
• Synopsys ARC EV Processor Enables Kyocera Document Solutions to Launch AI-enabled Multifunctional Printer SoC
• EPI EPAC1.0 RISC-V core boots Linux on FPGA
• GLOBALFOUNDRIES 22FDX RF Solution Provides the Basis for Next-Gen mmWave Automotive Radar
• Codasip Announces Commercial Add-ons to SWeRV Core EH1

Sunday, March 7, 2021

• Wait, What? MIPS Becomes RISC-V
• Progress in Importation of US Equipment Dispels Doubts on SMIC's Capacity Expansion for Mature Nodes for Now, Says TrendForce
• Intel stung for $2bn in Waco judgment
• Intel to Collaborate with Microsoft on DARPA Program
• UMC Reports Sales for February 2021
• Automakers Will Go Fabless
• GUC Monthly Sales Report - February 2021

Thursday, March 4, 2021

• IAR unveils certified edition of its development toolchain for RISC-V

Wednesday, March 3, 2021

• Silex Insight unleashes their new video codec (Colibri), that will shape the future of AV over IP distribution over 1GbE
• Wanxiang Blockchain Forms RISC-V International Blockchain SIG with Ecosystem Partners
• BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI
• Airborne System Design Assurance: Aldec Adds 60+ New HDL Rules to ALINT-PRO's DO-254 Plug-In
• Leopard Imaging Collaborates with Socionext, Hailo, and AWS to Launch EdgeTuring
• IAR Systems announces availability of RISC-V development tools with certification for IEC 61508 and ISO 26262
• Thalia successfully completes 20th 22nm analog IP reuse engagement
• Revenue per Wafer Climbs As Demand Surges for 5nm/7nm IC Processes
• GPU shipments soar once more in Q4

Tuesday, March 2, 2021

• FD-SOI Boosts Operating Frequency And Reduces Power Consumption
• TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
• GlobalFoundries to invest $1.4 bn to increase output at three units
• BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI
• 28nm FD-SOI i.MX8 targets low power
• proteanTecs Joins the TSMC IP Alliance Program
• TSMC Ramping Up Production of 5-nm Chips
• Achronix and Mobiveil Announce Partnership to Deliver High-Speed Controller IP and FPGA Engineering Services
• Synopsys Announces Euclide to Accelerate Design and Verification Productivity

Monday, March 1, 2021

• Samsung Invests in Quantum Computing
• RISC-V Fast Tracks Simpler Extensions
• Global Semiconductor Sales Increase 13.2% year-to-year in January
• Wave Goodbye, Hello MIPS as Chapter 11 Resolved

Sunday, February 28, 2021

• Automotive smart camera development with open platform turnkey solutions
• China's most important chipmaker SMIC could be a big winner from the global semiconductor shortage
• AMD, TSMC & Imec Show Their Chiplet Playbooks at ISSCC
• Verisilicon High-Performance and High-Quality AI Video Processor Powers Leading Datacenters
• Metrics Announces an EDA as a Service Partnership Program with Semiconductor Intellectual Property Vendors
• Introducing Dolphin Design's new Audio CODEC for TWS devices with ANC capabilities
• Imperas Donates Latest RV32/64K Crypto (scalar) Architectural Validation Test Suites to the RISC-V Verification Ecosystem
• Velodyne Lidar Licenses TSN IP Core from CAST
• Arasan announces the immediate availability of its MIPI C-PHY / D-PHY Combo IP for SoC Designs on TSMC 22nm Process
• Flex Logix and DARPA Expand Partnership with the Addition of Silicon Proven EFLX eFPGA in 12 and 16 nm Process Technologies for DARPA's Toolbox Initiative