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Thursday, February 25, 2021

• Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market

Wednesday, February 24, 2021

• TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
• MulticoreWare Inc. Becomes CEVA's Trusted Partner for Imaging & Computer Vision
• BrainChip Inc. and NaNose Medical Successfully Detect COVID-19 in Exhaled Breath with Fast High-Accuracy Results
• Samsung's foundry biz market share to increase in Q1 2021
• Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
• Rambus and AMD Extend Patent License Agreement

Tuesday, February 23, 2021

• Synopsys Delivers Breakthrough Performance with New ZeBu Empower Emulation System for Hardware-Software Power Verification
• CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS
• Cadence Completes Acquisition of NUMECA
• CMC Microsystems and Deeplite seek to advance AI R&D
• IoT Product Development Market Challenges and Opportunities 2021-2025
• Top 10 foundries expected to increase revenues by 20%
• Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications
• Xilinx Revolutionizes the Modern Data Center with Software-Defined, Hardware Accelerated Alveo SmartNICs
• AccelerComm Unveils Fully Integrated PUSCH Decoder to Supercharge 5G NR for Performance-Critical Channels
• RISC-V International Unveils Fast Track Architecture Extension Process and Ratifies ZiHintPause Extension
• Tianyihexin Licenses Codasip's L30 for Powering Intelligent Wearable Device Solutions
• North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time
• Achronix Announces 2020 Financial Results and Business Highlights

Monday, February 22, 2021

• TSMC's 3nm Process On Track For 2 Year, 2X Performance Improvement – Chairman
• SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications
• Nations' Latest BLE 5 IC Powered By CEVA Bluetooth Low Energy IP
• Tiempo Secure is a winner of the French Government's Great Cybersecurity Challenge to make smart objects more resilient to cyberattacks
• Eureka Technology IP Core Supports NASA's MARS 2020 Perseverance Rover Mission

Sunday, February 21, 2021

• Khronos and EMVA Collaborate to Gather Requirements for Embedded Camera and Sensor API Standards
• China chases semiconductor self-sufficiency
• Imagination's GPU selected by StarFive to create high-performance, small and low-cost BeagleV RISC-V AI single board computer
• Syntiant Adopts Movellus' Clock Network for its Low-Power NDP120 Deep Learning Processor
• CEVA Moves to Standardize DSP-enabled Bluetooth Audio IP with New Bluebud Wireless Audio Platform for TWS Earbuds, Smartwatches and Wearables
• Samsung Foundry Certifies Synopsys IC Validator for 5nm and 4nm Advanced Process Technologies
• IAR Systems introduces 64-bit Arm core support in leading embedded development tools
• CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by 30%
• Chipus Joins FDXcelerator Program Bringing Ultra-Low-Power and Compact Power Management Solution for Hearables and Wearables
• Secure-IC and MosChip Announce Strategic Partnership to Provide Turnkey ASIC Solutions With Embedded Security for Edge Applications

Thursday, February 18, 2021

• ADAS and Its Unintended Consequences
• Moschip Unveils Focused Strategy For Turn-Key ASIC Solutions
• Sales of Logic ICs Account for Largest Share of China's IC Market in 2020
• aicas and SiFive Bridge Flexibility and Performance with RISC-V, JamaicaVM Integration
• Achronix and Logic Fruit Introduce IP Solutions for Test and Measurement Applications

Wednesday, February 17, 2021

• Proposed Arm Buyout: Huang on So Many Levels
• Mark Redford Named Vice President, Operations & Supply Chain for Palma Ceia SemiDesign - Former Arm Executive
• SPARK Microsystems Announces CDN$17.5 Million Financing
• PLDA Announces a Unique CXL Verification IP Ecosystem, Delivering Robust Verification That Reduces Time-to-Design for CXL 2.0 Applications
• JEDEC Publishes DDR4 NVDIMM-P Bus Protocol Standard
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2021
• Micro Magic, Inc. Delivers Ultra Low Power 64-Bit RISC-V Core
• New Website Dedicated to Advancing PUF Security Technology
• TSMC Will Raise to Expand Capacity Amid Chip Shortages
• Enabling AI Vision at the Edge

Tuesday, February 16, 2021

• Tech: Why TSMC is the world's most underestimated tech giant
• New Automotive SoCs Provide a Window to ADAS Trends
• Samsung Develops Industry's First High Bandwidth Memory with AI Processing Power
• The Promise & Pitfalls of Open Hardware Development
• Veriest Solutions and CEVA develop functional safety verification methodology for automotive devices
• Renesas Develops Automotive SoC Functional Safety Technologies for CNN Accelerator Cores and ASIL D Control Combining World-Class Performance and Power Efficiency
• Arteris IP Adds a Record 28 New Licensees in 2020
• CEVA Appoints Jaclyn Liu to its Board of Directors; Bruce A. Mann Retires

Monday, February 15, 2021

• Semiconductor Industry: TSMC Invests in Japan for 3D SoIC
• SMIC unable to keep up with demand amid shortage and sanctions
• La French Tech Unveils 2021 Startup Cohort
• New SMUs to optimize battery life in IoT and semiconductors
• Globalfoundries to manufacture secure chips for US DoD
• ISSCC Plenary: A Bright Foundry Future
• CHIPS Alliance Welcomes Antmicro and VeriSilicon to the Platinum Membership Level
• CEVA, Inc. Announces Fourth Quarter and Year End 2020 Financial Results
• Flex Logix EFLX eFPGA in design for GLOBALFOUNDRIES 22FDX
• Objections grow to Nvidia-ARM deal
• Imec Showcases World's First Sub-5mW, IEEE 802.15.4z Ultra-Wideband Transmitter Chip

Monday, February 15, 2021

• Vitesse and Xilinx Demonstrate OIF Interoperability Enabling 10Gbps Ethernet at OFC 2003

Sunday, February 14, 2021

• Silex Insight partners with Crypto Quantique to deliver end-to-end IoT security
• 5GNR L1/L2/L3 Phy+SW Stack IP available for SoC & FPGA Ue & gNodeB development
• videantis passes milestone of enabling 10 million production vehicles
• U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York
• High Performance Computing Demand Puts Premium on Backend Engineering Expertise