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Thursday, February 11, 2021

• The Arm ecosystem ships a record 6.7 billion Arm-based chips in a single quarter
• Comcores sells wireless assets to Analog Devices

Wednesday, February 10, 2021

• Siemens and ADS deliver HDAP enablement solutions
• TSMC to Raise $9 Billion for Expansion Amid Shortages
• Fraunhofer IIS and intoPIX announce joint licensing program for JPEG XS
• Lattice FPGAs with High I/O Density Bring Low Power Signal Bridging and Interface Management to Edge Devices
• Israeli AI Chip Startup Raises Seed Funding

Tuesday, February 9, 2021

• Arteris IP Adds Two Veteran Executives to its Board of Directors
• Integrated solution for vehicle ethernet audio video bridging
• Cloud-Native Processors for a Cloud-Native World
• QuickLogic Launches Qomu - an Open Source SoC Dev Kit That Fits in Your USB Port
• eTopus Technology Announces Innovative SerDes Technology for Data Center, Cloud, Edge, and 5G Base Stations
• Tiempo Secure announces the availability of its Secure Element IP core on GF 22 FDX and TSMC 16 FFC
• Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%

Tuesday, February 9, 2021

• TSMC Board of Directors Meeting Resolutions

Monday, February 8, 2021

• European Semiconductor Sales Fell by 6% in 2020
• CEA-Leti Announces EU Project to Create Dynamically Programmable Wireless 6G Environments
• Renesas updates R-Car V3H with improved deep learning performance
• Time sensitive networking is supporting Ethernet applications
• TSMC to set up 3DIC material R&D center in Japan
• UK government helps NWF develop GaN foundry process
• Device Authority, EPS Global and Intrinsic ID Announce Strategic Partnership
• Synopsys Receives Customers' Choice Award for Paper Presented at TSMC 2020 Open Innovation Platform Ecosystem Forum
• Fraunhofer IPMS presents TSN IP core designs with low latency for automotive on-board networks
• CHIPS Alliance Brings on Rob Mains as New Executive Director
• TSMC January 2021 Revenue Report
• Palma Ceia SemiDesign Expands Asia Team, Names Bo Liu Senior Director of Engineering in China
• Gartner Says Apple and Samsung Extended Their Lead as Top Semiconductor Customers in 2020

Monday, February 8, 2021

• Storage system based on WD 100Gb NVMe-oF Bridge ASIC with ePHY IP

Sunday, February 7, 2021

• Preconfigured platforms connect IoT applications through the cloud
• 2021 Auto Industry Outlook: What Can We Expect from BEVs, Connected Cars & Software?
• Synopsys Selected for Rapid Assured Microelectronics Prototypes Program
• Renesas and Dialog Semiconductor to Join Forces to Advance Global Leadership in Embedded Solutions
• Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development Using EFLX Embedded FPGA (eFPGA) IP
• GUC Monthly Sales Report - Jan 2021
• Rianta Releases 800G Optimized Single Channel Ethernet Controller IP Core
• DVB-S2X Narrowband Demodulator / Decoder IP Core licensed to a leading US TV Semiconductor Company
• Renesas to adopt Crypto Quantique's QuarkLink security platform as part of its microcontroller ecosystem for the IoT
• UMC Reports Sales for January 2021

Saturday, February 6, 2021

• Xanadu and CMC Microsystems to collaborate on quantum computing

Wednesday, February 3, 2021

• French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very Low Temperature
• Samsung to expand MRAM applications
• Total MPU Sales Surprise With Strong Gains in 2020, More Upside in 2021
• Xilinx Collaborates with Fujitsu to Support 5G Deployments in the US
• AWS and Arm Demonstrate Production-Scale Electronic Design Automation in the Cloud
• RISC-V Processor Designs Emerge
• Sondrel builds on 7nm design work to offer 5nm
• SiTune Introduces World's First 5G Infrastructure Transceiver Solutions
• IoT security platform delivers fast, comprehensive connectivity and device management for any root-of-trust
• Socionext Adopts TSMC's 5-nanometer Technology for Custom SoCs Targeting Next-Generation Automotive Applications
• SMIC Reports 2020 Fourth Quarter Results
• Arteris IP FlexNoC Interconnect and Resilience Package Supports Socionext's 5nm Automotive Chip Production
• Pulsic Delivers Real-Time, Accurate, Layout Previews to Analog Circuits Designers with the new Animate Preview
• Can Open Source Hardware Emulate Linux?
• Crypto Quantique Opens IoT Security Platform to Multiple RoTs
• Open Source: It's Not Just for Software Anymore

Tuesday, February 2, 2021

• RISC-V Processor Designs Emerge
• Top 10 IC Growth Categories Target Emerging Applications in 2021
• Xylon Announces Availability of Its 2.3 MP HDR Automotive Video Camera
• SmartDV 2020 Revenue Increases by 51%
• SCALINX, Semiconductor Fabless Focusing on Signal Conversion Chips Secures 10.5 Million Euros Funding
• Palo Alto Networks expands IoT security to healthcare
• Renesas Expands Low-Power Industrial and IoT Applications Reach With New RA4M2 MCU Group in Arm Cortex-Based MCU Family
• NXP Launches Flexible IoT Cloud Platform to Securely Manage and Connect Edge Devices
• CEA Is the First Research Center to Acquire A Cryogenic Prober for Testing Quantum Bits
• European project for commercial silicon quantum processor
• Italian startup for 3D chiplet package co-design
• Sondrel supports 5nm Samsung and TSMC nodes
• SCALINX, Semiconductor Fabless Focusing on Signal Conversion Chips Secures 10.5 Million Euros Funding

Monday, February 1, 2021

• ASIL-D DAQ system for automotive battery systems
• Siemens and MaRS partner to accelerate innovation for startups in development of autonomous and connected vehicles
• Open Source: It's Not Just for Software Anymore
• Custom graphics extensions boost RISC-V
• 2020 Global Silicon Revenue Remains Stable as Wafer Area Shipments Edge Up Despite COVID-19 Disruption
• LeapMind Announces Participation in Alliance Program of Xilinx, a Major US FPGA Innovator
• This is How Intel Gets Out of Manufacturing
• Intrinsic ID Reports Strong Growth in 2020 for Its Semiconductor Security Solution as COVID Accelerates Shift to Online Working and Learning
• Rambus Reports Fourth Quarter and Fiscal Year 2020 Financial Results

Sunday, January 31, 2021

• Samsung Electronics Interested in Acquiring Automotive Semiconductor Companies
• Imagination IP in Chinese AI integration
• Reports: NXP, Infineon top Samsung's shopping list
• PUFsecurity Crypto Co-processor PUFiot Passed NIST CAVP Certification
• Jieli joins TempowOS Chipset Partner Program
• Global Semiconductor Sales Increase 6.5% to $439 billion in 2020
• Siemens Digital Industries Software appoints new Senior Vice President and Managing Director for Asia Pacific region
• Synapse Design and Flex Logix Tape Out Mutual Customer ASIC on a New Process in Less Than a Year Using Embedded FPGA (eFPGA) Technology
• Imagination and PaddlePaddle announce collaboration to grow the ecosystem for artificial intelligence (AI) for developers worldwide
• Top-10 IC Growth Categories Target Emerging Applications in 2021
• Advanced DDR Memory Interface PHY's and Controllers IP Cores available in advanced process nodes including TSMC 7FFC
• AnalogX Announces World's Lowest Power SERDES IP in 7nm and 6nm and Expansion Plan