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Sunday, January 16, 2022
Fraunhofer's MPEG-H Audio selected as the sole mandatory audio system for Brazil's next-generation TV 3.0 broadcast service
Electronic System Design Industry Logs 17% Year-Over-Year Revenue Growth in Q3 2021, ESD Alliance Reports
Deep Vision Adopts SiFive RISC-V to Add OpenCV-Enabled AI Support
TSMC's 2022 Expansion Budget Exceeds $40 Billion
MIPI UFS 3.1, M-PHY 4.1, Unipro 1.8, ONFi 4.1 and many more IP Cores are available for immediate licensing for your advanced UFS Device Applications as a complete bundled solution
Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems
Baikal Electronics allies with IP-cores domestic developer
Alphawave IP: Q4 2021 Trading and Business Update
Thursday, January 13, 2022
Ceva Adds Homogenous AI Acceleration to Third-Gen Engine
SmartDV Joins Open RF Association
Wednesday, January 12, 2022
Access Advance Announces the Initial Group of VVC/H.266 Video Patent Pool Licensors
Efabless Series A-1 Round Led by New North Ventures Drives Open-Source-Enabled Chip Design
TSMC Reports Fourth Quarter EPS of NT$6.41
Five AI Inference Trends for 2022
intoPIX TicoRAW improves RAW image workflows and camera designs
Tuesday, January 11, 2022
5G Predictions for 2022
Why Qualcomm won't built its own foundry
Reinventing Traceability: Adding domain intelligence with Arteris Harmony Trace
Xylon releases a new version of its MPSoC IP Framework for Multi-Camera Vision Applications
Nvidia-Arm plays "strong-Intel" card in UK deal probe
VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving
Aptiv Announces the Acquisition of Wind River, A Leading Provider of Intelligent Edge Software Solutions, From TPG
Nvidia-Arm plays
Intilop Partners with IBM in Extreme Networking to deliver one thousand TCP & UDP connections on IBM's Big Data servers
Rambus Root of Trust Delivers FIPS 140-2 CMVP Security in Kyocera Multifunction Products
Semi Content in Electronic Systems Reached Record High in 2021
Kyocera Selects Rambus for IoT Security
Industry's First use of TLM for the At-Speed Verification of a PCIe-Based Avionics Design Requiring DO-254 Compliance
PCI-SIG Releases PCIe 6.0 Specification Delivering Record Performance to Power Big Data Applications
Monday, January 10, 2022
IoT Spending in APAC to Reach $437B in 2025
Expedera Joins Global Semiconductor Alliance
Processor architecture for edge AI/ML inference workloads
Intel Agilex I-Series FPGA: REFLEX CES launches a brand new board with 400 Gigabit Ethernet capability
Chip shortage in 2022 and beyond: What you need to know
Alphawave Collaborates with Microchip on AlphaCore 112Gbps IP for 800G and 1.6T Ethernet Applications
Sondrel explains the vital coordinating role of Systems Architects
Sunday, January 9, 2022
A*STAR's Institute of Microelectronics and Soitec to develop next-generation silicon carbide semiconductors
OPENEDGES Announces the Industry First 4-/8-bit Mixed-Precision Neural Network Processing Unit IP
HEVC Advance Patent Pool Momentum Grows
2022 Semiconductor Sales to Grow 11% After Surging 25% in 2021
Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications
Mauna Kea Semiconductors (MKSemi) Raises $12.8 Million Pre-A+ Round, Launches Breakthrough Low Power Ultra-Wideband Product
proteanTecs and Alchip Bring Production Visibility to Advanced ASICs
TSMC December 2021 Revenue Report
eDisplay Port/Display Port v1.4 Tx PHY and Controller IP Cores in 12FFC and 40LP for cutting edge display applications is available for immediate licensing
Thursday, January 6, 2022
CEVA's Bluetooth Dual Mode 5.3 SIG Qualified Platform Offers Improved Security, Less Interference and Better Power Consumption for Wireless Audio
Wednesday, January 5, 2022
Nestwave and Samea Unveil Ultra-Low-Power Super-Thin, Re-Usable GPS Tracker
Analog Compute is Key to The Next Era of AI Innovation
Lattice FPGAs Power Next Generation Lenovo Edge/AI Experiences
SK hynix completes the First Phase of Intel NAND and SSD Business Acquisition
CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture
UMC Reports Sales for December 2021
Wi-Fi CERTIFIED 6 Release 2 adds new features for advanced Wi-Fi applications
Convey 4K & 8K over Gigabit Network, Cat5E cables and Wifi-6 Using intoPIX TicoXS FIP Codec, the smart path is here
Arteris IP Added to Russell 2000 Index
Tuesday, January 4, 2022
Cadence boss takes on Credo chair
Wi-Fi CERTIFIED 6™ Release 2 adds new features for advanced Wi-Fi® applications
GUC Monthly Sales Report - December 2021
Winner Micro Licenses CEVA's Bluetooth and Wi-Fi IP Platforms for IoT Connectivity SoC
Dolphin Design, a leader in Edge Computing and AI platforms for the Internet of Things (IoT), is expanding into Asia and opens a processing center in Singapore
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