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Thursday, January 28, 2021

• China aims to strengthen its semiconductor supply chain with new standards group that includes Huawei, SMIC

Wednesday, January 27, 2021

• IoT Everywhere
• Palma Ceia SemiDesign Announces PCS1100 Wi-Fi 6E 4x4:4 Transceiver
• Synopsys Demonstrates Silicon Proof of DesignWare 112G Ethernet PHY IP in 5nm Process for High-Performance Computing SoCs
• MPEG LA Announces Development of VVC (Versatile Video Coding) Pool License
• Xilinx Reports Third Quarter Fiscal Year 2021 Results
• Faraday Reports Fourth Quarter 2020 Revenues at NT$1,430 Million, 2020 Annual Revenues NT$5,495 Million, Mass Production Up 18% YoY
• EdgeQ Adds Former Qualcomm CEO Paul Jacobs & CTO Matt Grob as Advisors to Disrupt the Current Closed RAN Ecosystem with RISC-V based Highly Programmable 5G and AI Platform
• Intrinsic ID's QuiddiKey PUF Selected by Fungible in Drive to Secure Next Gen Data Centers
• Palma Ceia SemiDesign Announces PCS1100 Wi-Fi 6E 4×4:4 Transceiver
• Amber Solutions Closes 2020 With Series B Funding Totaling More Than $8.5 Million
• RV64X: A Free, Open Source GPU for RISC-V
• Adopt the intoPIX JPEG XS Plugin for Adobe Premiere and ease your live video workflow
• UMC profit surges on robust semiconductor demand

Tuesday, January 26, 2021

• PathPartner Announces PT605 System on Module (SoM) & Smart Camera Reference Design Kit based on Qualcomm® QCS605 SoC
• HDL Design House Partners with Marketing Platform AnySilicon
• North American Semiconductor Equipment Industry Posts December 2020 Billings
• Gowin Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability
• EvoNexus partners with Arm to Accelerate Launch of New Semiconductor Startups
• Synopsys Delivers Industry's First Integrity and Data Encryption Security IP Modules for PCI Express 5.0 and Compute Express Link 2.0 Specifications
• Mirabilis Design integrates Fast Functional Processors into VisualSim Architect to close the software design, development and validation loop
• Patent report highlights AI boom
• Edge AI SoC for smart tiny devices
• Korea's Presence in Automotive Semiconductor Market Hardly Noticeable
• Palma Ceia SemiDesign Names Robert Young Chief Technology Officer
• IC Insights Releases the New 2021 Edition of The McClean Report
• Andes Technology Corp. Announces EdgeQ to Deliver Converged 5G and AI Silicon Platform with AndesCore RISC-V License for the 5G Open Radio Access Network
• Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance

Monday, January 25, 2021

• The world is dangerously dependent on Taiwan for semiconductors
• 5G Mixes, Matches Memories
• U-blox Integrates Cellular and GNSS in a Single SiP
• CEA-Leti Reports Breakthrough High-Performance Gyroscope For Automotive, Aeronautic and Industrial Applications
• Imperas extends RISC-V processor verification ecosystem
• Edge AI company AlphaICs raises $8 million in funding round led by Emerald Technology Ventures and Endiya Partners
• USB 4.0, USB 3.2, USB 3.0, USB 2.0 Silicon Proven PHYs in TSMC, UMC & SMIC Foundries available from T2MIP
• CXL gathers speed with 2.0 spec

Sunday, January 24, 2021

• VSORA AD1028 Named "Best Processor IP" by The Linley Group
• SMIC urges China's chipmakers to embrace advanced packaging as Moore's Law slows nanometre node progress and US sanctions bite
• Imperas Leads The RISC-V Processor Verification Ecosystem
• KeyASIC Inked Technologies and IP Deal of RM21Mil
• Avery Design Announces CXL 2.0 VIP
• 2020 Activities, Outlook for 2021 & Update of the Financial Objectives: Kalray Aims to Become a European Champion in Intelligent Processors

Thursday, January 21, 2021

• eInfochips Wins Design Services Company of the Year Award from IESA

Wednesday, January 20, 2021

• Samsung wins Intel foundry order; TSMC takes GPU deal
• It's Time to Look at FD-SOI (Again)
• Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
• Foxconn and Winbond Make Strategic Investment in Kneron
• Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC
• Arasan announces its Total eMMC IP solution for TSMC 22nm process
• Faraday Unveils Complete Imaging and Display High-Speed Interface IP Set on UMC 28nm and 40nm Processes
• MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences

Tuesday, January 19, 2021

• Nordic Development Kit provides easy access to AI and ML
• Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements
• Industry R&D Spending To Rise 4% After Hitting Record in 2020
• Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics
• Attopsemi Released White Paper "I-fuse - Most Reliable and Fully Testable OTP"

Monday, January 18, 2021

• What's next for FPGA maker Achronix post-IPO?
• CEA-Leti Reports Machine-Learning Breakthrough That Opens Way to Edge Learning
• Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools
• Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing
• Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC

Sunday, January 17, 2021

• Protocol and Interface Agnostic Universal D2D Controller for HPC and Chiplets
• TSMC's Massive Investment Plan Gives Samsung Electronics Plenty to Ponder on
• Intel outsources Core i3 to TSMC's 5nm process
• PLDA Announces XpressLINK-SOC CXL Controller IP with Support for the AMBA CXS Issue B Protocol
• TSMC Boosts Capital Expenditure Budget on Strong Outlook
• DCD With EBBM in USA & Greece