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Wednesday, December 4, 2024

• Alphawave Semi Joins UALinkâ„¢ Consortium to Accelerate High-Speed AI Connections

Tuesday, December 3, 2024

• Soitec and Globalfoundries Collaborate in the Production of High-Performance Rf-Soi Semiconductors
• SiFive Empowers AI at Scale with RISC-V Innovation
• TSMC's Role In Shaping the Global Semiconductor Landscape: Trends And Innovations for 2025
• X-FAB Releases Embedded Flash Solution on its 110nm Automotive BCD-on-SOI Technology
• Alphawave Semi Joins UALink™ Consortium to Accelerate High-Speed AI Connections
• AST SpaceMobile and Cadence Collaborate to Advance the World's First and Only Planned Space-Based Global Cellular Broadband Network
• Comcores Announces Availability of its Ultra-Compact Ethernet TSN End Station Controller IP for Automotive Networks
• Kudelski IoT and PUFsecurity Combine IoT Security Strengths to Meet the Challenges of Increasing Global Regulation
• Now Gelsinger is gone, what is Intel's Plan B?
• Silvaco Joins SMART USA Institute to Propel Digital Twin Innovations Under CHIPS Manufacturing USA Program

Tuesday, December 3, 2024

• SK Hynix to produce HBM4 on 3 nm foundry process in 2025

Monday, December 2, 2024

• Comprehensive ADC/DAC and AFE IP Solutions: Empowering Next-Gen Applications Across Diverse Technology Nodes
• Arteris Deployed by Menta for Edge AI Chiplet Platform
• Allegro DVT Launches TV 3.0 Test Suite for Brazil's Next Generation Digital Terrestrial Television System
• Intel CEO's Departure Leaves Top U.S. Chipmaker Adrift
• Post-Quantum Cryptography: Moving Forward
• Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure
• SmartDV Licenses SDIO IP Family to Ranix for V2X Products
• Europe's chip market shrinks as WSTS trims forecasts for 2025

Sunday, December 1, 2024

• Intel Announces Retirement of CEO Pat Gelsinger
• Tenstorrent closes $693M+ of Series D funding led by Samsung Securities and AFW Partners
• TSMC's Path to Semiconductor Foundry Leadership: Insights from Morris Chang's Memoir
• TSMC 2024 Supply Chain Management Forum Presents Awards to Outstanding Suppliers
• IP players prominent in chiplet's 2024 diary

Friday, November 29, 2024

• Apple Orders M5 Chips from TSMC for Next-Gen Devices

Friday, November 29, 2024

• Advanced Packaging and Chiplets Can Be for Everyone

Thursday, November 28, 2024

• Leonardo in EECONE, for a sustainable electronics supply chain
• Infineon wins German Sustainability Award 2025
• At COP29, Leonardo's solutions to combat climate change
• Germany budgets for extra euro-billions in chip subsidies
• VeriSilicon partners with LVGL to enable advanced GPU acceleration for wearable devices and beyond
• Advanced Packaging and Chiplets Can Be for Everyone
• Interconnected devices and security: how to protect the Internet of Things?

Wednesday, November 27, 2024

• Siemens' Solido SPICE now certified for multiple leading-edge Samsung Foundry processes
• Silicon Creations Collaborates with Interex Semiconductor to Distribute High-Performance IPs in India
• Imagination DXS GPU IP recognised as game-changer for the car industry
• HighTec C/C++ Compiler Suite Supports Andes' ISO 26262 Certified RISC-V IP for Automotive Safety and Security Applications

Tuesday, November 26, 2024

• Think Silicon and LVGL Accelerate Graphics Libraries for Microcontrollers
• Government of India creating enabling environment for Semiconductor Design Community with direct access to National Chip Design Infrastructure
• TSMC May Bring 2nm Manufacturing Node to the U.S. After 2025
• Samsung Electronics Restructures Leadership, Reinforces Focus on Semiconductor Innovation

Tuesday, November 26, 2024

• Samsung Receiving Industry's First Global Recognition for Environmental Sustainability of its Semiconductor Solutions

Monday, November 25, 2024

• Andes Technology Collaborates with Lauterbach to Deliver RISC-V Trace Solution
• Alphawave Semi Drives Innovation in Hyperscale AI Accelerators with Advanced I/O Chiplet for Rebellions Inc
• Availability of New 16-bit 5MSps SAR ADC in 40nm Node Sets New Standards for High-Performance Data Conversion
• sureCore now licensing its CryoMem range of IP for Quantum Computing
• CryoMem Suite of Memory IP for QC is Now Available For Licensing
• Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor
• France to buy Atos supercomputing, quantum business for €1.1bn
• Tower Semiconductor Releases 300mm Silicon Photonics Process as a Standard Foundry Offering
• Integrated silicon photonics: making the quantum future a reality
• Using AI to build next generation wireless systems

Sunday, November 24, 2024

• Siliconally Releases SinglePHY 100BASE-T1 22FDX, an Automotive Ethernet PHY IP
• Role of FD-SOI in Powering AI-Driven IoT Applications
• US backs GlobalFoundries' semiconductor growth with $1.5 billion
• GlobalFoundries and IDEMIA Secure Transactions to Enable Next-Generation Smart Card IC on GF 28ESF3 Platform

Friday, November 22, 2024

• Redefining Hearing Aids with Cadence DSPs

Thursday, November 21, 2024

• EU looks to change rules on technology transfer, patent pools
• HPC customer engages Sondrel for high end chip design