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Sunday, January 2, 2022

• CES 2022: IoT and AI Set to Take Center Stage
• Intel's technology trends
• Axiomise Unveils Intelligent Debug Solution for Formal Verification of RISC-V Cores
• USB 4.0, MIPI DSI/CSI 2.0, Display Port 1.4, HDMI 2.1, DDR5, PCIe5.0, 1G Ethernet IP Cores and many more Wired Interface IP Cores available for immediate licensing
• ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems
• WiLAN Subsidiary Polaris Signs License Agreement with Marvell
• Samsung and SK to Make Massive Investments in System Semiconductors

Thursday, December 30, 2021

• Securing the IoT: Technical Approaches to Defend and Protect IoT Nodes
• AMD and Xilinx Provide Update Regarding Expected Timing of Acquisition Close

Wednesday, December 29, 2021

• 2022 tech themes: A look ahead

Tuesday, December 28, 2021

• 3Q21 Revenue of Global Top 10 Fabless Companies Hits $33.7B
• Siemens mPower Solution Now Certified for TSMC's N7 and N5 Nodes
• TSMC reportedly getting everything lined up for 2nm production in 2025

Monday, December 27, 2021

• Edge Computing, AI, and the Cloud
• Leti proposes FD-SOI spin qubit platform for quantum computing

Sunday, December 26, 2021

• Arm CPUs Make Gains in Data Centers
• Access Advance Welcomes Microsoft as a Licensor and Licensee of the HEVC Advance Patent Pool
• GlobalFoundries Announces Extension of AMD Wafer Supply Agreement to Guarantee Supply

Wednesday, December 22, 2021

• Despite Withdrawals, CES Organizers Push on With 2022 Show

Tuesday, December 21, 2021

• A Novel Machine-Learning based SoC Performance Monitoring Methodology under Wide-Range PVT Variations with Unknown Critical Paths
• CAES developing 16-core RISC-V based microprocessor for space
• Synopsys Chosen by Juniper Networks to Accelerate Development of Photonic ICs for Next-Gen Data Centers
• Successful conclusion of European Processor Initiative Phase One
• First Open Wi-Fi 'HaLow' development platform
• Weebit Nano receives first silicon demonstration wafers integrating its embedded ReRAM module
• The European Space Agency (ESA) has awarded a contract to CAES, in the frame of the ARTES Competitiveness & Growth programme, to develop System-on-Chip for space applications
• Kneron Announces $25 Million Funding To Advance Smart City Technology For Auto