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Thursday, January 14, 2021

• USB 3.2: A USB Type-C Challenge for SoC Designers

Wednesday, January 13, 2021

• China tech firm releases the world's first RISC-V structured PC
• Jim Keller joins Tenstorrent as President and CTO.
• Qualcomm to Acquire NUVIA
• TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
• Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices
• Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
• Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series
• TSMC Reports Fourth Quarter EPS of NT$5.51
• BeagleBoard.org and Seeed Introduce the First Affordable RISC-V Board Designed to Run Linux
• Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO
• Ginger Lee Named Chief Financial Officer for Palma Ceia SemiDesign
• Semiconductor Industry: Continuous Semiconductor Supply Shortage
• SOI Industry Consortium Joins SEMI as Strategic Association Partner
• Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology

Tuesday, January 12, 2021

• Alibaba, Tencent and Baidu spared from US investor blacklist
• AMD's Xilinx Acquisition Moves Forward As Regulatory Waiting Period Expires
• Syntiant Surpasses Milestone of 10 Million Processors Shipped
• Netflix Now Streaming xHE-AAC Audio on Android Mobile
• Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100
• Value of Semiconductor Industry M&A Agreements Sets Record in 2020

Monday, January 11, 2021

• SEGGER introduces new Open Flashloader for direct programming of any RISC-V system
• CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family
• Secure-IC And Menta Co-Develop Solution To Optimize Embedded Cybersecurity
• Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip
• Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs

Sunday, January 10, 2021

• Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras
• Wi-Fi Alliance Wi-Fi predictions for 2021
• DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation
• Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core
• ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q3 2020
• Flex Logix Appoints Dana McCarty as Vice President of Sales and Marketing for AI Inference Products

Thursday, January 7, 2021

• TSMC December 2020 Revenue Report
• Achronix to List on Nasdaq Through Merger with ACE Convergence
• UMC Reports Sales for December 2020

Wednesday, January 6, 2021

• Kevin Steptoe Joins Palma Ceia SemiDesign as EVP Program Management
• DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor
• Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Apps
• Andes Technology Provides RISC-V CPU Core to SK Telecom
• China Forecast to Fall Far Short of its "Made in China 2025" Goals for ICs
• 6GHz for Wi-Fi or 5G? And the Winner is...

Tuesday, January 5, 2021

• UK competition authority to investigate Arm-Nvidia deal
• IQ-Analog Antenna Processor ASIC Powers Lockheed Martin Phased Array Sensors
• Semiconductor Industry: Expect Record-high Foundry Investment in 2021
• CFX announces commercial availability of anti-fuse OTP technology on 90nm BCD process
• Imagination, update on 2020 progress
• Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed
• Edgewater Announces New Funding and Organizational Changes
• Industry Veterans Cathal Phelan, John Kent, and Michael Reiha Join Silvaco Technical Advisory Board
• Achronix in talks to IPO
• More HDMI 2.1 Enabled Products Reach The Market Bringing Advanced Consumer Entertainment Features To a Wide Audience
• GUC Monthly Sales Report - Dec 2020

Monday, January 4, 2021

• SMIC gains a rise in their share value
• EU Hexa-X Project Gets €12m to Develop 6G Vision
• Where Are GPUs Headed in 2021?
• EPS Global and Intrinsic-ID Announce Strategic Partnership
• Global Smartphone Production Expected to Reach 1.36 Billion Units in 2021 as Huawei Drops Out of Top-Six Ranking, Says TrendForce
• Arteris IP FlexNoC Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet TSN Switch Chip
• CEVA and DARPA Establish Partnership for Technology Innovation

Sunday, January 3, 2021

• GaN Devices in LiDAR System Design
• 4D Imaging Radar Looks to Advance ADAS and Level 5 Automation
• Edge AI: Energy-saving "building blocks" for smart end devices
• Global Semiconductor Sales Increase 7 Percent Year-to-Year in November
• OmniVision Announces World's First Dedicated Driver Monitoring System ASIC With Integrated AI Neural Processing Unit, Image Signal Processor and DDR3 Memory
• Greek IP company Adveos bought by Shanghai-based Beken