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Friday, January 1, 2021

• TSMC and Samsung to face major issues in the development of 3nm

Wednesday, December 30, 2020

• TSMC, other foundries' revenue expected to reach new high in 2021

Tuesday, December 29, 2020

• Prospects for the Semiconductor Industry in the Post-COVID Era
• Foundry Revenue Expected to Reach New High in 2021

Monday, December 28, 2020

• Why the next 10 years may belong to ARM
• Graphcore raises $222 million in Series E Funding Round
• Foundry Revenue Expected to Reach New High in 2021 with Close to 6% YoY Growth as Capacities Remain Scarce Across Industry, Says TrendForce
• Fabless Company Share of IC Sales to Set New Record in 2020 at 32.9%

Sunday, December 27, 2020

• Wave Computing and MIPS Technologies Reach Agreement to Exit Bankruptcy
• Advanced Packaging For More-than-Moore Era

Wednesday, December 23, 2020

• Chip Startups are Gaining Traction in Auto Industry
• United States, Europe and China Leading AI Development

Tuesday, December 22, 2020

• iWave Unveils the Implementation of ARINC 818-2 IP Core On Microsemi PolarFire FPGA
• WiLAN Subsidiary Acquires Substantial Patent Portfolio from MediaTek
• North American Semiconductor Equipment Industry Posts November 2020 Billings
• New iPhone Models Become Key to Qualcomm's Top Spot in 3Q20 Revenue Ranking of Global Top 10 IC Design (Fabless) Companies, Says TrendForce

Monday, December 21, 2020

• Top deals in 2020

Sunday, December 20, 2020

• Rianta Releases AES Crypto and HMAC Acceleration ASIC IP Cores
• Retune DSP's Wake Word Engine Now Available for CEVA Audio/Voice DSPs
• MosChip Technologies Achieves ISO 9001:2015 Certification
• Creonic Participates in Horizon 2020 EPIC Research Project