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Sunday, December 19, 2021
SiPearl awarded a €17.5M funding from the EIC Accelerator program
Intel CEO Says Chip Shortage To Last Until 2023
UK doubles venture capital investment in tech
Taiwan approves TSMC fab investment plan in Japan
Teledatics Introduces World's First Open Wi-Fi "HaLow" Development Platform
Imagination's Series3NX neural network accelerator helps UNISOC to create 5G smartphone platform
Teledatics Introduces World's First Open Wi-Fi
Creonic GmbH is Heavily Invested in the Expansion and Research of 6G Technologies
SiPearl awarded a ?17.5M funding from the EIC Accelerator program
Imagination appoints Carol Chesney to board as non-executive director
Hardent VESA DSC IP Cores Licensed by Teledyne LeCroy for DisplayPort Test Solution
PCIe 5.0 & PCIe 4.0 PHYs and Controller IP Cores are available for immediate licensing to maximize your Interface speed for complex SoCs
Thursday, December 16, 2021
Kandou Closes $75 Million in Series D Funding
Gowin Automotive-grade FPGAs Pass SAIC's 2500h Heat Resistance Tests
TSMC Introduces N4X Process
Wednesday, December 15, 2021
Samsung and IBM reveal plans to make next-generation CPU with 5 nm process
StarFive Released Open-Sourced Dubhe Linux SDK in RVspace Community
Kandou Delivers USB-C Multiprotocol Retimer Product Family for USB4 Support
TSMC Presents 2021 Excellent Performance Award to Outstanding Suppliers
Synopsys Initiates $200 Million Accelerated Share Repurchase Agreement
Synopsys SiliconSmart Library Characterization Solution Achieves Certification for TSMC N5, N4 and N3 Advanced Processes
3Q21 Revenue of Global Top 10 IC Design (Fabless) Companies Reach US$33.7 billion, Four Taiwanese Companies Make List, Says TrendForce
Lattice Expands Automate Solution Stack and Propel Design Tool Capabilities to Accelerate Industrial Application Development
Atomic Rules introduces the world's highest performance PCIe host interface for Intel Agilex F-Series FPGAs
Cliosoft Selected for Rapid Assured Microelectronics Prototypes (RAMP) Program
Secure Thingz and Intrinsic ID Partner to Ensure Supply Chains of Trust for the Embedded Industry
MediaTek Dimensity 9000 uses Armv9 technology for unparalleled performance
Industry's fastest TLS accelerator ready to boost Xilinx Versal platform
TSMC Newest N4X Process Targets HPC Products
Tuesday, December 14, 2021
Intel CEO trip to Taiwan seeks to secure TSMC 3nm supply: analyst
Benchmarking Neuromorphic Computing: Devil Is in the Details
Phase-change memory comes to 18nm FDSOI
Maven Silicon - ARM Approved Training Partner
IBM, Samsung Unveil VTFET to Extend Moore's Law
FPGA Development Opens Up
Ultra-Low power GNSS Multi-Constellation Digital IP core available for Battery powered IoT devices and Smart Wearables SoC application
Monday, December 13, 2021
Security Standards Are a Must for Consumer IoT
The Status of AI at the Edge? It's Complicated
New RISC-V verification product changes the fabric of processor DV
MIPI M-PHY Update Doubles Peak Data Rate for Next-Generation Flash Memory Storage Applications
SEMIFIVE Acquires Hanatec
Semi Capex on Pace for 34% Growth in 2021 to Record $152.0 Billion
IC Manage Launches Holodeck on AWS Marketplace for Instant Cloud Bursting
Sunday, December 12, 2021
Imec demonstrates successful monolithic integration of Schottky diodes and depletion-mode HEMTs with 200 V GaN-IC
Silex Insight to divest their video business to Audinate
Hisense Enters Into MPEG LA's AVC Patent Portfolio License
Siemens' new mPower solution gains certification for TSMC's N7 and N5 technologies
CXL Put Through Its Paces
CEVA and Mimi Hearing Technologies Partner to Democratize Assistive Hearing for the True Wireless Earbuds Market
10/100/1000M Ethernet PHY IP Core in ST 28FDSOI technology licensed to a leading Chinese Semiconductor company for Broadband Access Networks Application
MoSys Partners with Silicom to Provide Stellar Packet Classification IP Optimized for Intel FPGA-Based SmartNICs and Infrastructure Processing Units
Arasan announces the immediate availability of its ultra-low power MIPI D-PHY IP for the GlobalFoundries 12nm FinFET process node
Thursday, December 9, 2021
Synopsys Approves Stock Repurchase Program with Authorization Up to $1 Billion
AST SpaceMobile Selects EnSilica to Support the Development of its Next Generation Advanced Cellular ASIC Chip
Floadia Develops Memory Technology That Retains Ultra-high-precision Analog Data for Extended Periods
TSMC November 2021 Revenue Report
Wednesday, December 8, 2021
China's road to homegrown chip glory looks to be going for a RISC-V future
With CHIPS Act, US Risks Building a White Elephant
sureCore delivers ultra-low power register files with more than 50% less power than off-the-shelf versions
IC Market Direction Indicator Points to 11% Growth in 2022
Siemens collaborates with PDF Solutions to boost IC yield and speed time to market
RISC-V Celebrates Incredible Year of Growth and Progress, Ratifying Multiple Technical Specifications, Launching New Education Programs, and Accelerating Broad Industry Adoption
StarFive VisionFive Single Board Computer Officially for Sale, Accelerating RISC-V Ecosystem Development
proteanTecs Expands into Mobile and Boosts Management to Accommodate Growth
BMW Group Signs Agreement with Inova Semiconductor and GlobalFoundries to Secure Supply
SEGGER adds 64-bit RISC-V support to Embedded Studio
Intel Announces Intent to Take Mobileye Public
Expedera Raises $18M Series A Funding to Advance Its Deep Learning Accelerator IP
EU stops the clock on Nvidia-Arm investigation
TSMC in spat with Intel
Tuesday, December 7, 2021
BMW, GloFo sign chip supply agreement
AMD may use Samsung's 4nm node for Chromebook processors
StarFive Starts Delivery of High Performance RISC-V CPU Core IP "Dubhe"
Webinar : USB 3.1 Gen2 Device Controller IP Core usage in Intel Quartus Prime Pro
Avery Design Systems Offers Comprehensive Verification Support for the New HBM3 Interface Standard
5G New Radio Release-15 gNodeB reference design (includes L1-L2-L3) Stack for 5G Private Enterprise Networks, available for immediate licensing
GUC Optimizes Quality of Results and Accelerates Time to Tapeout Using the Cadence Digital Full Flow
NextChip Selects Rambus Security IP to Secure Apache6 Automotive Processor
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