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Thursday, December 3, 2020
Chip Startups are Succeeding with Silicon Catalyst and Partners Like Arm
CFX announces commercial availability of anti-fuse OTP technology on Silterra I11L process
intoPIX delivers its new full stack of TICO-RAW solutions improving RAW image workflows and camera designs
Codasip announces three new RISC‑V Application Processor Cores providing Multi-core and SIMD capability
Wednesday, December 2, 2020
RISC-V for ultra-low power processing and AI on the edge
Synopsys and Samsung Foundry Collaborate to Deliver Fastest Design Closure and Signoff for Process Nodes Down to 3nm
IAR Systems and GigaDevice extend partnership with powerful Arm solutions
Esperanto Technologies to Reveal Chip with 1000+ Cores at RISC-V Summit
Third-Quarter 2020 Global Semiconductor Equipment Billings Surge 30% Year-Over-Year, SEMI Reports
Can IBM Ecosystem Advance AI Chip Performance 1000x?
Imperas Simulator Supports Andes Custom Extension to Accelerate Software Development in Domain Specific Applications
Faster, Smaller and More Accurate Edge AI Using Deeplite and Andes Technology Software + Hardware
Rockley Photonics Collaborates with Cadence to Create a High-Performance System for Hyperscale Data Centers
Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time
Andes RISC-V Vector Processor NX27V Is Upgraded to RVV 1.0
Embeetle and GigaDevice collaborate to bring a new powerful and simple IDE to ARM and RISC-V based MCUs
BrainChip Confirms Completion of the Akida Production Design
Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2020
Alibaba-Backed Media AI Firm Finds Innovative Applications
Tuesday, December 1, 2020
64-bit RISC-V Core Claims to Outperform Apple M1 SoC
Mobiveil Announces Compute Express Link (CXL) 2.0 Design IP, Successful Completion of CXL 1.1 Validation with Intel's CXL Host Platform
PCIe Gen5 & PCIe Gen4 Phy IP available in TSMC 12FFC
Monday, November 30, 2020
China's AI unicorns reveal fatal flaw in rush to go public
China a step closer to microchip independence
Infineon to set up global AI hub in Singapore
Imagination hires Tim Whitfield as new Chief of Engineering
Bluetooth RF Transceiver Phy KGD for adding Bluetooth Connectivity to "any SoC"
Secure-IC Announces U.S. Subsidiary Opening
PLDA Announces the Successful CXL Interoperability with pre-production Intel Xeon CPU, Code Named Sapphire Rapids
Faraday Leads Industry to Adopt TCFD Framework for Corporate Sustainability
Xilinx Acquires Assets of Falcon Computing Solutions to Advance Software Programmability and Expand Developer Community
Sunday, November 29, 2020
IO and multiprotocol processing in highly demanding embedded architectures
Samsung Electronics Squaring Off with TSMC in Packaging Technology
RF-SOI Engineered Substrates at the Heart of Modern RF mmWave Front-ends
TSMC To Fall Behind Both Intel, Samsung By 2024
Andes Announces New RISC-V Processors: Superscalar 45-Series with Multi-core Support and 27-Series with Level-2 Cache Controller
Broadcom Debuts Industry's First 5nm ASIC for Data Center and Cloud Infrastructure
Imagination sells Ensigma Wi-Fi technology to Nordic Semiconductor
Nordic Semiconductor expands into Wi-Fi by acquiring the entire Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group
Xiphera announces FPGA-based TLS 1.3 IP core for mission-critical applications
BrainChip Appoints Geoffrey Carrick as Non-Executive Director
Arteris IP Completes Acquisition of Magillem Design Services Assets, Creating World's Premier System-on-Chip Integration Company
Thursday, November 26, 2020
China moves closer to self-reliance in 7nm chip production
TSMC confirms 3nm tech for 2022, could enable epic 80 billion transistor GPUs
Wednesday, November 25, 2020
SMIC gets massive orders- customer demand is strong
intoPIX demos newest compression technologies shaping the future of lossless quality wired/wireless transmission: 4K/8K JPEG XS, TICO-RAW and FlinQ - lowest latency & power, highest quality
IAR Systems delivers extended optimization and trace capabilities for RISC-V development
intoPIX demos newest compression technologies shaping the future of lossless quality wired/wireless transmission : 4K/8K JPEG XS, TICO-RAW and FlinQ - lowest latency & power, highest quality
Faraday Supplies 28eHV Memory Compilers for Mobile OLED Display Driver IC
Innatera raises EUR 5M to bring neuromorphic intelligence to the sensor-edge
The Growing Market for Specialized Artificial Intelligence IP in SoCs
Tuesday, November 24, 2020
TSMC adopts 3D stacking tech for chips along with Google and AMD
SK Telecom develops AI processor
proteanTecs CEO to present Universal Chip Telemetry™ at the Taiwan Semiconductor Executive Summit (TSES)
China to spend $165bn on 5G
TSMC's 3 nm plant in southern Taiwan reaches construction milestone
Gyrfalcon Launches AI-X: Full-Stack Solution for Edge-AI Development
Monday, November 23, 2020
IRIS Switzerland Adopts Silvaco TCAD Software for the Development of Photodiodes for Autonomous Driving Applications
5G and eSIM technologies will help grow industrial IoT connections to 37b by 2025
3 Basic Facts About Automotive Sensor Degradation
Taiwan Semiconductor Research Institute signs access deal with Arm
Intel to Keep Its Number One Semiconductor Supplier Ranking in 2020
Sunday, November 22, 2020
AI Accelerator Targets Video Analytics at the Edge
Beyond 5G – Is it time to start thinking about 6G?
Mythic launches industry-first AI analog matrix processor
North American Semiconductor Equipment Industry Posts October 2020 Billings
Audio Weaver + TalkTo reference design now available on Qualcomm QCS400 series of audio System-on-Chips (SoCs)
China TSMC Rival HSMC Runs Out of Cash, Ex-CEO Says
CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification
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