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Thursday, November 19, 2020
Coventor and CMC Microsystems expand collaboration to further enable innovation in semiconductor and microsystem technology development
Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign
Wednesday, November 18, 2020
Synopsys Acquires Precision Optical Measurements Provider LIGHT TEC
Arm Expands microNPU IP for Application Processors
Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions
AI Startup Deep Vision Powers AI Innovation at the Edge
Ferroelectric Memory GmbH (FMC) Raises $20 Million to Accelerate Next-Generation Memory for AI, IoT, Edge Computing, and Data Center Applications
Secure Thingz supports next-generation Secure Install technologies for IP Protection and malware prevention
Mentor joins Nano 2022 R&D program to foster innovation in semiconductor design and verification
Tuesday, November 17, 2020
18 New AI Startups in France in 2020 vs. 120 in 2019
SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge
Introducing new Arm Roadmap Guarantee and other Arm IoT initiatives for accelerating Endpoint AI
Dialog launches partner programme for its open industrial IoT edge server
Foundry Revenue Expected to Increase by 23.8% YoY in 2020, with Advanced Nodes and 8-Inch Capacities Being Key to Industry Competitiveness in 2021, Says TrendForce
Fugaku Tops Supercomputer Rankings Again as Arm HPC Ecosystem Expands
First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced
Wafer Capacity by Feature Size Shows Strongest Growth at <10nm
Bouffalo Lab Standardizes on SiFive RISC-V Embedded CPU Core IP for New IoT Products
BrainChip Appoints Todd Vierra Director of Technical Sales
Monday, November 16, 2020
Dialog Semiconductor Introduces SmartServer™ IoT Partner Ecosystem for Edge Solutions in Smart Buildings and Factories
NTLab joined Samsung Foundry IP Ecosystem
Kandou can do more with $92.3 million
NXP, AWS create cloud platform for vehicle data services
Arteris IP Achieves Major Milestone: 150th Licensee
Kandou Raises $92.3 Million in Series C Funding
GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC
Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications
Marvell Announces Industry's First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure
Sunday, November 15, 2020
First steps to European multicore RISC-V chip for space
Alibaba's Ultra High-Performance Superscalar Processor - XuanTie910
Apple M1 Processor, Passing on the Chiplets
SimpleMachines, Inc. Debuts First-of-its-Kind High Performance Chip
BrainChip Demonstrates How Its Akida Technology Is Delivering the Next-Generation of AI at the Edge at First-Ever AI Field Day
Lattice Expands Radiant Software Tool Capabilities
Wednesday, November 11, 2020
Nestwave Recognized for IoT Innovation in 2020 Mobile Breakthrough Awards Program
Google Partners with SkyWater and Efabless to Enable Open Source Manufacturing of Custom ASICs
Silvaco Acquires Memory Compiler Technology of Dolphin Design SAS
Xilinx and Samsung Deliver Industry's First Adaptable Computational Storage Drives
CXL Consortium Releases Compute Express Link 2.0 Specification
Lattice Accelerates Development of Low Power FPGA-Based Custom Solutions with Lattice Design Group
De-RISC first anniversary, a H2020 project which will create the first RISC-V, fully European platform for space
Efinix Announces Trion Titanium Tapeout at TSMC 16 nm Process Node
CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC
Synopsys Acquires In-chip Monitoring Solutions Leader Moortec
Vidatronic Achieves up to 10X Speedup Using the Cadence Spectre X Simulator
Faraday's 22nm Fundamental IP Adopted for Intelligent IoT Devices
Imagination launches multi-core IMG Series4 NNA - the ultimate AI accelerator delivering industry-disruptive performance for ADAS and autonomous driving
Time-Sensitive Networking Market is Projected to Reach USD 1 Billion by 2026
Solving the problem of growing ASIC respins
Hyundai Embraces Nvidia for Future Fleet AI, IVI Services
CEA-Leti, Intel Expand Collaboration on 3D Packaging
Tuesday, November 10, 2020
Sound United Adds MPEG-H 3D Audio format to Denon & Marantz Home Theater Components
TSMC October 2020 Revenue Report
Advanced Packaging: Interview with Intel's Ramune Nagisetty
Monday, November 9, 2020
Korea's Semiconductor Exports to China Increasing
TSMC to spend US$3.5b on Arizona subsidiary
Kameleon Security and Xilinx Collaborate on New Cybersecurity Solution for Servers, Cloud Computing and Data Centers
Avery Design Debuts QEMU Virtual Host to SystemVerilog PCIe VIP HW-SW Co-simulation Solution for Pre-silicon System-level Simulation of NVMe SSD and PCIe Designs
PLDA Announces CXL 2.0 Support in their XpressLINK Family of CXL Controller IP
Graphcore leverages multiple Mentor technologies for its massive, second-generation AI platform
Synopsys Announces Industry's First CXL 2.0 VIP Solution for Breakthrough SoC Performance
Pinnacle Imaging Systems Announces Denali 3.0 ISP
Silex Insight delivers state-of-the-art security features to the award-winning Secure Vault technology from Silicon Labs
CAST Releases MIPI I3C Basic Slave Controller IP Core
Sunday, November 8, 2020
MosChip Technologies appoints Semiconductor Business Veteran, Swamy Irrinki As "Vice President of Marketing and Business Development" to Oversee and Drive Continued Business Growth
Cadence Achieves Industry-First ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X DSP IP
UMC Reports Sales for October 2020
European Processor Initiative: Second year of activities
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