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Sunday, November 7, 2021

• U.S. Looks to Coordinate Global Cybersecurity
• Heterogeneous Computing Is About Optimizing Resources
• Corigine Brings Prototyping And Emulation Acceleration To The Desktop With MimicTurbo GT Card
• Mythic Adds Two Silicon Valley Veterans to Its Leadership Team
• GUC Monthly Sales Report - Oct 2021
• Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 40nm ULP is available for immediate licensing for Audio SoC applications.
• IAR Systems enables early technology adoption of the AI-capable Arm Cortex-M55 core

Thursday, November 4, 2021

• Siemens Named A 'Leader' in Industrial Internet-of-Things Software Platforms Q3 2021 Report
• sureCore-led consortium wins £6.5M Innovate UK grant to develop cryogenic CMOS IP to accelerate Quantum Computing scalability

Wednesday, November 3, 2021

• Codasip expands ecosystem with XtremeEDA
• Worldwide Silicon Wafer Shipments Reach Record High in Third Quarter of 2021, SEMI Reports
• UMC Reports Sales for October 2021
• Imagination launches the most advanced ray tracing GPU
• Samsung and Alphawave IP Announce Acceleration of Deep Partnership with Flagship Global Hyperscaler Design Win at 4nm
• SECURE-IC exhibits and gives conferences at the european cyber week
• eMemory and UMC Bring New ReRAM Intellectual Property to Market
• Embedded FPGA (eFPGA) technology: Past, present, and future

Tuesday, November 2, 2021

• Four automotive functional safety mistakes that must be avoided
• Silicon Creations Named 2021 TSMC Partner of the Year for Analog / Mixed-Signal IP
• Nextchip licenses aiMotive's aiWare4 for their Apache6 automotive domain processor
• Tessolve Joins GlobalFoundries' Design Enablement Network Program as a Design Partner to Bring Advanced Design Solutions to Accelerate Customer Product Development
• TSMC Recognizes Long-Standing Collaboration with Synopsys on Semiconductor Innovation with Multiple OIP Partner of the Year Awards
• Sondrel develops Performance Verification Environment to fast-track ASIC creation
• proteanTecs UCT Supports TSMC 3nm Process Technology to Accelerate Lifecycle Health Monitoring

Monday, November 1, 2021

• Codasip appoints Brett Cline to drive company growth worldwide
• Morse Micro Unveils Wi-Fi CERTIFIED HaLow Platform and Industry's First 8MHz Reference Design
• Wi-Fi CERTIFIED HaLow delivers long range, low power Wi-Fi
• USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP Cores for High Bandwidth, Low Power data communication in PCs, Mobiles, SSDs, and other Multimedia Devices.
• IBM and NeuReality team up to build the next generation of AI inference platforms
• Rambus Reports Third Quarter 2021 Financial Results
• DDR5 Ecosystem Ramps Up
• GlobalFoundries Announces Closing of Initial Public Offering
• Synopsys Acquires AI-Powered, Real-Time Performance Optimization Leader Concertio
• Weebit delivers its most successful quarter, achieving key business and technical milestones

Sunday, October 31, 2021

• Siemens Collaborates with TSMC on Design Tool Certifications for Advanced Technologies
• Alphawave IP Receives Prestigious 2021 TSMC OIP Partner of the Year Award for High-Speed SERDES IP
• Andes Technology Issues GDR to Be Listed on Luxembourg Stock Exchange for Expansion Plan
• M31 Technology Receives 2021 TSMC OIP Partner of the Year Award

Friday, October 29, 2021

• GlobalFoundries CEO: We're sold out of semiconductor chip capacity through 2023

Thursday, October 28, 2021

• Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead
• Annual Foundry Revenue Expected to Reach Historical High in 2022
• Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices
• Truechip Introduces Silicon IP For Network on Chip (NoC) Focussed For Tilelink RISC-V Chips
• proteanTecs Receives 2021 TSMC OIP Partner of the Year Award
• eMemory Receives 2021 TSMC OIP Partner of the Year Award for Embedded Memory IP

Wednesday, October 27, 2021

• Samsung plans to triple foundry chip production capacity by 2026
• SiPearl: collaboration with Intel to accelerate exascale supercomputing deployment in Europe
• Faraday Reports Third Quarter 2021 Revenues at NT$2,218 Million, Up 31% QoQ
• Semiconductor Sector Shows Signs of Cooling
• S2C Delivers VU19P FPGA-based Logic Matrix LX2 - a New Benchmark in High-performance & High-density Prototyping
• Morris Chang says domestic US chip supply chain is impossible
• Rapid Silicon Announces Seed Funding of $15M
• Samsung to triple foundry capacity
• AccelerComm Announces 5G IP with O-RAN Acceleration Abstraction Layer (AAL) Interface
• Codasip Founder Karel Masarik elected to RISC-V Technical Steering Committee
• Annual Foundry Revenue Expected to Reach Historical High Once Again in 2022 with 13% YoY Increase with Chip Shortage Showing Sign of Easing
• Europe opens extended investigation into ARM-Nvidia deal
• SiFive has briefly pulled back the curtains on its most powerful Risc-V processor yet.
• GlobalFoundries Announces Pricing of Initial Public Offering
• Achronix Demonstrates Speedster7t High-Performance Interfaces
• VESA Publishes Embedded DisplayPort Standard Version 1.5