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Thursday, November 5, 2020
Open-Source RISC-V ISA Offers More
CEVA SenslinQ Platform Wins 2020 ASPENCORE World Electronics Achievement Award
Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement
Learn the Latest on RISC-V and Vector Processing at All Six Andes Technology Corporation's Presentations at the 2020 RISC-V Summit
Wednesday, November 4, 2020
Advanced packaging to have 31% CAGR 2019-25
GUC Monthly Sales Report - Oct 2020
New Wave Design and Verification Appoints New President
PLDA XpressSWITCH IP for PCIe technology first ever switch soft IP to pass PCI-SIG's PCIe 4.0 compliance tests
eMemory NeoFuse IP Qualified on GLOBALFOUNDRIES Advanced High Voltage Platform for OLED Applications
CEVA, Inc. Announces Third Quarter 2020 Financial Results
5G and Interconnect Are Pushing Innovations in Wireless
Tuesday, November 3, 2020
300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports
China to Expand Its Semiconductor Industry
Taiwan's TSMC begins hiring drive for its US foundry
Virtual electronica: Focus on Technical Trends and Innovations
How AI Impacts Memory & Interconnect Technology
Arm has launched a CPU monster that will get Intel and AMD very worried
Telink TLSR9 Wireless Audio & IoT RISC-V SoC integrates RISC-V DSP/SIMD P-extension
CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design.
Samsung Elec to fully employ 5-nano process to make own phones and others
28FDSOI "SoC White Box" SERDES & Controller IPs' are available for immediate licensing
Arteris IP FlexNoC Interconnect Products Licensed by Bosch for Multiple Automotive Chips
Imagination's new BXS GPU enables automotive graphics in Texas Instruments processor family
55 BCDLite Solution Positions GLOBALFOUNDRIES for Continued Leadership in Audio Amplifiers for Mobile Devices
Monday, November 2, 2020
Rambus Announces New Stock Repurchase Program
Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards
Xylon Announces a New Version of logiVIEW Multiview 3D Video Transformation Engine IP Core
Movellus Joins GLOBALFOUNDRIES Ecosystem Program, as Partner Providing Application-Optimized PLLs, DLLs, & Comprehensive Clocking Solutions
Rambus Reports Third Quarter 2020 Financial Results
NeuLinker Licenses Codasip Bk5 and Studio for Powering Innovative AI and Blockchain Solutions
Inaccel announces record-breaking speed on facial detection test using an FPGA cluster
Aldec Introduces Hardware Assisted RTL Simulation Acceleration for Microchip FPGA Designs
Sunday, November 1, 2020
Telink and Andes Announce the TLSR9 SoC with RISC-V Processor
Silicon Wafer Shipments Slip in Third Quarter 2020 but Strong for Year
Q3 Global Semiconductor Sales Increase 11 Percent Compared to Q2
Sondrel announces tape-out of its largest chip design
Wednesday, October 28, 2020
QuickLogic Joins Samsung SAFE IP Partner Program
Marvell to Acquire Inphi - Accelerating Growth and Leadership in Cloud and 5G Infrastructure
Mentor's High Density Advanced Packaging solution certified for Samsung Foundry's most advanced packaging process
intoPIX releases a new range of 8K TICO-XS IP-cores supporting the JPEG XS standard
Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early Design Starts
Realtek Semiconductor Selects Allegro DVT's H.266/VVC Compliance Streams
SDR RF IP, 100MHz-2.6GHz, for ultra-low power applications from IoT, M2M to 5G available from T2MIP
Tuesday, October 27, 2020
What Can Taiwan's Semiconductor Industry Learn From Japan?
Samsung and VeriSilicon Enable Blaize to Meet Aggressive Time-to-Market Goals for New AI Edge Processor
World's fastest 64bit RISC-V core claims 5GHz speed
Samsung Foundry Adopts Real Intent Meridian CDC for Clock Domain Crossing Sign-off
Rambus IPsec Packet Engine Secures 5G Networking at 10 Gbps
Floadia Raises 1.2 Billion Yen to Develop New Memory Technology That Can Be Disruptor in AI Edge Computing
Analog Bits Announces Analog IP Availability on Samsung Technologies
QuickLogic Announces the ArcticPro 3 eFPGA IP for Samsung 28FDS Process
Truechip Adds New Customer Shipments of Verification IPs For RISC-V Family Including TileLink
DRAM Price Erosion Expected Through the End of 2020
Synopsys and Samsung Release Certified 3nm Gate-All-Around AMS Design Reference Flow for Early Design Starts
Flex Logix Announces Availability and Roadmap of InferX X1 Boards and Software Tools
Synopsys and Samsung Foundry Collaboration Delivers Optimized Reference Methodology for High-Performance Compute Designs
Xilinx Introduces Breakthrough Zynq RFSoC DFE for Mass 5G Radio Deployments
Monday, October 26, 2020
TSMC top patent applicant in Taiwan for sixth straight quarter
Synopsys Expands Portfolio of Automotive VDKs with Support for Infineon's AURIX TC4xx 32-bit Microcontroller Family
Mixel MIPI D-PHY IP Integrated Into Hercules Microelectronics Award-Winning FPGA/Processor
Cortus Announces the Opening of another New Design Centre in Meyreuil (France)
AMD to Acquire Xilinx, Creating the Industry's High Performance Computing Leader
Sunday, October 25, 2020
EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups
Nvidia-Arm Deal a Boon for RISC-V?
China Forecast to Represent 22% of the Foundry Market in 2020
GlobalFoundries Details Ambitious Technology Roadmap
North American Semiconductor Equipment Industry Posts September 2020 Billings
Synopsys and Samsung Foundry Collaboration Delivers Portfolio of Optimized iPDKs and Methodologies for Advanced Custom Design
Orthogone Technologies Reveals New Brand Identity, Sets 25% Growth Target for 2021
EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups
Aldec's TySOM Family of Embedded System Development Solutions Now Supports Xilinx PYNQ (Python Productivity for Zynq)
Visit Vidatronic at the Virtual Samsung SAFE Forum on October 28th
Mentor receives 2020 TSMC OIP Partner of the Year awards for EDA solutions
Micro Magic, Inc. Unleashes World's Fastest RISC-V Core
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