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Friday, October 23, 2020

• Movellus Delivers Clock Generation Module on TSMC 3nm Process

Wednesday, October 21, 2020

• 6 Considerations for Integrating Sensors in Vehicles
• Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
• GlobalFoundries Offers Ambitious Tech Plans, While Eying an IPO
• TSMC Sees HPC As Next Inflection Point
• PLDA demonstrates successful PCIe 5.0 Link Training at 32 GT/s with its PCIe 5.0 controller and Broadcom PHY
• Arm partners with Mentor to offer complete verification service
• M31 Technology Receives 2020 TSMC OIP Partner of the Year Award for Specialty Process IP
• SmartDV to Exhibit at Virtual Samsung SAFE Forum 2020 with Portfolio of Design and Verification IP
• SmartDV Appoints Karthik Gopal as Asia General Manager
• eMemory Receives 2020 TSMC OIP Partner of the Year Award for Embedded Memory IP
• Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade
• TSMC Bets on HPC for Future Growth

Tuesday, October 20, 2020

• Soitec reports FY'21 second quarter revenues
• Tenstorrent achieves best-in-class PPA and First-Pass Silicon Success for Datacenter AI Processor SoC with INVECAS advanced ASIC engineering capabilities
• Alphawave IP Receives Prestigious 2020 TSMC OIP Partner of the Year Award for High-Speed SerDes IP
• Arm Awarded TSMC OIP Partner of the Year Award for Processor IP for Six Years in a Row
• TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
• IAR Systems brings functional safety tools to RISC-V with certification for IEC 61508 and ISO 26262
• Faraday Brings Advanced Audio ASIC Solutions to the Music Entertainment Industry
• Microchip Acquires High-Level Synthesis Tool Provider LegUp to Simplify Development of PolarFire FPGA-based Edge Compute Solutions
• Silicon Creations Named 2020 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP

Monday, October 19, 2020

• Sequitur Labs Joins NVIDIA Partner Network to Protect Critical IP at the Edge
• Chips&Media showcase at Samsung Foundry SAFE FORUM 2020 as an IP partner
• Veridify Security Welcomes Happiest Minds as Systems Integrator Partner
• Taiwan Semiconductor's Technology Dominance And Its Impact On Customers And Suppliers
• Codasip Announces a New Design Center in France
• Cadence Reports Third Quarter 2020 Financial Results
• TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC
• Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip
• Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence
• TSMC Announces 2020 OIP Partner of the Year Awards for Excellence in Accelerating Silicon Innovation
• SK hynix to Acquire Intel NAND Memory Business

Sunday, October 18, 2020

• TSMC revenue for 2020 to rise by 30% despite losing Huawei
• Hardware Is Back, Says CEA-Leti's CEO
• riscvOVPsim gets Risc-V vector instructions
• 'Samsung set to win over TSMC in the end'
• GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution
• Perforce Software Accelerates SoC Development With Methodics IPLM 3.0 Launch
• Dolphin Design's SPEED platforms receive the "Solar Impulse Efficient Solution" Label, rewarding profitable solutions that protect the environment.
• Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
• Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution
• Wipro to acquire Eximius Design, strengthens leadership in VLSI and systems design services
• Latest NPU adds to Arm's AI Platform performance, applicability, and efficiency

Thursday, October 15, 2020

• China is catching up: SMIC foundry is now able to produce 7 nm chips

Wednesday, October 14, 2020

• Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports
• TSMC Reports Third Quarter EPS of NT$5.30
• GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX Platform
• GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution
• Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS
• CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio
• JEDEC Announces Publication of JEDEC Module Sideband Bus
• Industry's first security microcontrollers for a complete IoT lifecycle management solution

Tuesday, October 13, 2020

• Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications
• Synopsys and SiMa.ai Collaborate to Bring Machine Learning Inference at Scale to the Embedded Edge
• How will artificial intelligence impact automotive IP protection strategies?
• Lattice Semiconductor Wins Two Medals at 2020 LEAP Awards
• Chinese chipmaker SMIC makes breakthrough in '7nm-like process'
• China Forecast to Represent 22% of the Foundry Market in 2020
• TriEye Shortens Time to Market for Next-Generation CMOS-Based SWIR Image Sensors with the Cadence Spectre X Simulator

Monday, October 12, 2020

• South Korea pushes for AI semiconductors as global demand grows
• Imagination extends mobile GPUs to automotive and data centres with 6Tflop B-Series
• NVIDIA Reportedly Moving Ampere to 7 nm TSMC in 2021
• Arteris IP FlexNoC Interconnect Again Licensed by KYOCERA for Enterprise Printing and Imaging Solutions
• Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon Scalable Processor
• Innosilicon Achieves World-First Tapeout Success on SMIC N+1 Process
• Innosilicon selects Imagination's new BXT Multi-Core GPU IP for cloud computing
• Imagination launches IMG B-Series: Doing more with multi-core
• Cadence Brings Verification IP to the Chip Level with New System VIP Solution
• New Cadence Clarity 3D Transient Solver Delivers Up to 10X Faster System-Level EMI Simulation
• Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon Lifecycle Management Platform
• MIPI Alliance and IEEE Sign Agreement to Bring Automotive SerDes Standard to Broader Ecosystem
• OPENEDGES AI Accelerator (NPU) & Memory Subsystem IP licensed for Eyenix AI-powered surveillance camera chipset
• Synopsys Names Shankar Krishnamoorthy General Manager of the Digital Design Group

Sunday, October 11, 2020

• Arm co-founder: Nvidia takeover would create another US tech monopoly
• Menta Appoints ETSI as United States East Coast Representative
• AMD and Xilinx: A Match Made in Silicon Valley?
• Attend Andes Technology's Presentation "A RISC-V Out-of-Order Processor" at the Linley Processor Conference
• Visit Vidatronic at the Virtual GLOBALFOUNDRIES Technology Conference (GTC) - EMEA on October 16th
• Numem Selected by NASA for 'DNN Radiation Hardened Co-Processor Companion Chip to NASA's Upcoming High-Performance Spaceflight Computing Processor'
• Cadence Pegasus Verification System Certified for TSMC N16, N12 and N7 Process Technologies
• AMD-Xilinx Deal: Bringing The Fight To The Data Center
• Synopsys IC Compiler II Delivers First-Pass Silicon Success for Graphcore's Multi-Billion Gate AI Processor
• AMD Reported to Be Negotiating Purchase of Xilinx
• intoPIX Ships v2.0 of FastTICO-XS SDK for x86-64 CPU platforms to speed up JPEG-XS workflows