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Thursday, October 8, 2020

• Imec presents alternative metals in advanced interconnect and contact schemes as a path to 2nm technology nodes

Wednesday, October 7, 2020

• proteanTecs Announces Market and Regional Expansions
• Synopsys DesignWare CXL IP Supports AMBA CXS Protocol Targeting High-Performance Computing SoCs
• Instrumentation Technology Systems adds intoPIX TICO-XS to their upcoming NetVIDxs
• Huang "Confident" Nvidia-Arm Deal Will Get Past Regulators
• Attopsemi's I-fuse Memory Solution Now Qualified and Available on X-FAB's 130nm RF-SOI Technology
• TSMC September 2020 Revenue Report
• UMC Reports Sales for September 2020
• Intento Design Expands Analog Automation with IDX-PVT, Eliminating the Need for Design-by-Verification
• Pushing the boundaries of performance and security to unleash the power of 64-bit computing
• Think Silicon to introduce a new Inference Micro GPU Architecture based on RISC-V at Linley Fall Virtual Processor Conference
• Cadence Announces Complete DDR5/LPDDR5 IP Solution for TSMC N5 Process Technology

Tuesday, October 6, 2020

• Arm CEO Simon Segars discusses AI, data centers, getting acquired by Nvidia and more
• SmartDV Unveils SmartConf Testbench Generator
• CAST Introduces Ultra-Low Latency TSN Ethernet Switch IP Core
• VSORA Introduces Small Footprint, Low-Power PetaFLOPS Platform Enabling L4/L5 Autonomous Driving
• Everactive Adopts Movellus Sub-Microwatt Clocking Solution for its Batteryless IIoT System

Monday, October 5, 2020

• AI Requires Tailored DRAM Solutions: Part 3
• European Semiconductor Sales Drop, Global Sales Rise
• Top 10 Tech Industry Trends for 2021
• 'Samsung AI Forum 2020' Explores the Future of Artificial Intelligence
• Efinix® Announces Availability of Reconfigurable Acceleration Platform
• Eximius Design Joins TSMC Design Center Alliance Program
• Renesas Launches Arm Cortex-M33-based RA6M4 MCU Group with Superior Performance and Advanced Security for IoT Applications

Sunday, October 4, 2020

• Nvidia Presents the DPU, a New Type of Data Center Processor
• China's Chip Sector Faces Possible Impact as SMIC Assesses Export Restrictions Placed by U.S.
• ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q2 2020
• TurboConcepts successfully completes research project FlexDEC-5G for designing FEC decoders for 5G
• Imagination Technologies Group Ltd. Announces new CEO Simon Beresford-Wylie
• Intel's Roadmap: A Closer Look at Process Technologies and Production Plans
• Arm Spins-out Cerfe Labs to Advance Development of CeRAM Memory Technology
• Toshiba Information Systems Adopts Blue Pearl Software Visual Verification Suite by to Improve Quality and Accelerate FPGA and ASIC Development
• China's Semiconductor Industry to Brace for Impact as SMIC Assesses Export Restrictions Placed by U.S., Says TrendForce
• Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in August
• GUC Monthly Sales Report - September 2020
• OpenFive and AnalogX to Provide Optimized Chip-to-Chip Interface IP Solutions

Saturday, October 3, 2020

• EU chip plan would cost €500bn, says NXP CEO

Wednesday, September 30, 2020

• Talking Sense with Moortec... 5G, Hyperscaling and the Resurgence of Consumer Silicon
• Arm Mali-C71AE: High performance Image Signal Processing with Advanced Safety
• Arteris IP to Acquire Assets of Magillem Design Services, Creating World's Premier System-on-Chip Assembly Company
• Efabless Extends Partnerships for Rapid Development Solution of Custom ICs
• Efinix Announces Availability of Reconfigurable Acceleration Platform
• New MIPI Debug and Trace Solution Available for Mobile, IoT and Automotive
• Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs

Tuesday, September 29, 2020

• 2020 is second highest year for semi M&A
• Is RISC-V Processor Hardware or Software?
• Synopsys Delivers Industry's First Processor IP Certified for Full ISO 26262 ASIL D Compliance
• Nordic Semiconductor to ship its billionth Arm Cortex-M based wireless SoC in October
• Arteris IP FlexNoC Interconnect Products Again Licensed by Samsung Foundry for Worldwide Use
• Fraunhofer IPMS develops TSN Switch IP Core
• Two Acquisitions Make 2020 Second-Highest Year for Semi M&As
• Tetrivis tapes out prototype Transmit and Receive Phased-Array Silicon Chipsets for Low-Cost Terminals for Emerging Low-Earth Orbit Satellite (LEOSAT) Market
• Moortec's In-Chip Sensing Fabric Enables Deeply Embedded Monitoring of Dynamic Conditions for Picocom's Baseband SoC for 5G Small Cells
• Wi-Fi CERTIFIED Vantage adds support for latest Wi-Fi advancements

Monday, September 28, 2020

• New Arm technologies enable safety-capable computing solutions for an autonomous future
• New Neoverse Platforms Take on the Cloud, HPC, and the Edge
• US trade restrictions on SMIC may set back China's efforts to develop a domestic alternative to Samsung and TSMC
• Globalfoundries Global Technology Conference 2020 Sets The Stage For Growth
• New Arm technologies enable safety-capable computing solutions for an autonomous future
• Megh Computing Selected by 5G Open Innovation Lab to Help Drive Early Adoption and Innovation of 5G Technology

Monday, September 28, 2020

• Patriot Scientific Highlights Successful Calendar Year as Schneider Electric Joins Stellar Roster of Moore Microprocessor Patent Portfolio Licensees

Sunday, September 27, 2020

• China's Geely to Feature Mobileye SuperVision for Scalable ADAS
• Semiconductor/equipment: Structural Growth of Foundries
• SMIC: Clarification Announcement
• Creating Domain Specific Processors Using Custom RISC-V ISA Instructions
• Globalfoundries extends 22nm FDSOI, holds 12nm
• Washington clamps down on SMIC
• Newly Released Versions of DMTF Redfish and SNIA Swordfish Specifications Include NVMe and NVMe-oF Specification Enhancements
• Efabless Expands support for Cloud-based Design Platform
• GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for IoT and 5G Mobility
• GLOBALFOUNDRIES and Movano Inc. Partner to Advance Needle-Free Continuous Glucose Monitoring Technology
• GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities
• GLOBALFOUNDRIES Collaborates with Cadence on Availability of Mixed-Signal OpenAccess PDK for 22FDX Platform to Enable Advanced Mixed-Signal and mmWave Design
• NUVIA Raises $240M Series B Funding as it Accelerates Plans to Deliver Industry Leading CPU Performance to the Data Center
• Cadence Announces Broad IP Collaboration with GLOBALFOUNDRIES on 12LP/12LP+ Solutions
• Bluetooth Dual Mode v5.2 Protocol Stack SW, Profiles & LC3 codec licensed to leading Tier 1 Company for ultra-low power TWS Hearable Audio SoC
• 28HV Solution Accelerates GLOBALFOUNDRIES Leadership in OLED Display Drivers for Mobile Devices
• GLOBALFOUNDRIES Announces Industry-Leading GF SHIELD Program to Further Safeguard Customer Data and IP