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Wednesday, February 4, 2026

• Arasan's ultra low power MIPI D-PHY IP achieves ISO26262 Certification
• UK-Bulgaria partnership set to boost semiconductor innovation
• Dassault Systèmes and NVIDIA Partner to Build Industrial AI Platform Powering Virtual Twins
• IntoPIX And Cobalt Digital Enable Scalable, Low-Latency IPMX Video With JPEG XS TDC At ISE 2026
• Attopsemi Scales I-fuse® Technology to 7nm FinFET following 12nm Silicon Success

Tuesday, February 3, 2026

• Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems
• Andes Technology Launches RISC-V Now! — A Global Conference Series Focused on Commercial, Production-Scale RISC-V

Monday, February 2, 2026

• UMC expects revenue to outpace market growth
• Two Semiconductor Fab Projects Abruptly Halted?
• A new era for European semiconductors begins in Grenoble
• Semiconductor industry starting to show signs of recovery
• Microservice Store Launches EU CRA and UK PSTI Autonomous Compliance Solution for IoT
• De-risking the Start of Production for Automotive SoCs
• Synopsys and AMD Honored by World Economic Forum for Generative and Agentic AI Vision, Leadership, and Impact
• Arasan announces the immediate availability of the industries first xSPI NOR + eMMC NAND Combo PHY IP
• MIPS accelerates the development timeline of the RISC-V NPU S8200, integrating Synopsys ARC IP to transform into a "physical AI" computing platform.
• Indian Chip Design Services Provider Mirafra Tapes Out 22-nm SoC
• Keysight’s Machine Learning Toolkit to Speed Device Modeling and PDK Dev
• How Chiplets will Accelerate Storage
• Samsung Foundry Reportedly Expects 30%+ 2nm Order Growth in 2026; 1.4nm Set for 2029
• TGE302 RISC-V IP Core: M0+, Comparable Performance Low-Power General-Purpose Processor

Friday, January 30, 2026

• Qualitas Semiconductor Secures Strategic IP Licensing Agreement for MIPI Solutions

Thursday, January 29, 2026

• Chips for Defence; an EU initiative
• Europe’s leadership in photonic chips under threat
• Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure
• Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics
• NanoXplore and STMicroelectronics deliver European FPGA for space missions
• MosChip Completes 28-nm SoC for India’s Space Center
• Tenstorrent Announces Participation in CHASSIS Program, Joint Initiative for Automotive Chiplet Technology
• The OpenHW Foundation unveils the first industry-ready RISC-V ecosystem to advance European digital sovereignty
• MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs
• Keysight Launches Wireless Coexistence Test Solution to Accelerate Compliance and Innovation
• Chiplet Summit Announces Pre-Conference Day Schedule
• NVIDIA Looks to Intel’s 18A/14A Process and EMIB Packaging for Next-Gen Feynman AI Chips, Signaling a Major Foundry Shift Beyond TSMC

Wednesday, January 28, 2026

• Nuclei Announces Strategic Global Expansion to Accelerate RISC-V Adoption in 2026
• TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.

Tuesday, January 27, 2026

• Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers

Monday, January 26, 2026

• Microservice Store Announces Security Manager (iSM) for Embedded Systems
• Rapidus sets sights on 2nm chip production as investment interest grows
• DCD-SEMI to Exhibit at SEMICON Korea 2026 with EU Mission Hub
• 2026 Outlook With Mahesh Tirupattur of Analog Bits
• Korea, Italy agree to deepen ties in AI, chips, space and beyond
• Warning signs for semiconductor market in AI boom
• Keysight Powers the Future of e-Mobility with Test Solutions for High-Power and Megawatt Charging
• Software-Defined Systems: Reshaping the Future of Modern Cars
• Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio
• Frontgrade Gaisler is proud to be a part of the ePERFECT project
• LPDDR6 Has Arrived ! Innosilicon Technology Delivers LPDDR6 Subsystem IP to Leading Clients
• QuickLogic Announces Orders for Strategic Radiation Hardened FPGA Development Kit
• TSMC to Cut Fab14 Mature-Node Capacity by 15%-20% to Reflect Changing Demand Mix
• Microservice Store Launches Embedded Microservices: The Foundational Technology for the Digital Marketplace in Embedded Systems

Friday, January 23, 2026

• PlexusAV And IntoPIX Strengthen IPMX Ecosystem With New P-AVN-4 Featuring JPEG XS TDC
• YorChip and Sofics Expand UCIe PHY Across TSMC Nodes