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Saturday, August 29, 2020

• ProteanTecs, which provides an AI platform to monitor chip reliability, raises $45 million

Thursday, August 27, 2020

• Alibaba's new 16-core CPU will challenge Intel Xeon in datacenters
• TSMC's Super-gap Approach Puts Samsung Electronics on Alert

Wednesday, August 26, 2020

• Chips&Media Publicizes the Collaboration on SiFive's OpenFive, a Custom Silicon Business Unit
• MIPS lands up in China
• proteanTecs Closes $45M Growth Equity Round Led by Koch Disruptive Technologies (KDT)
• Chelsio Adopts Synopsys DesignWare 56G Ethernet PHY IP to Accelerate Development of High-Performance Computing SoC
• China chip imports still at $300bn
• Chips&Media Publicize the Collaboration on SiFive's OpenFive, a Custom Silicon Business Unit.
• Mentor's Questa and Veloce platforms help SimpleMachines dramatically speed development of its first AI processor
• SiliconArts Joins the Khronos Group to Support Standardization of Vulkan Ray Tracing
• Bluespec, Inc. Releases RISC-V Explorer: A Fast, Free, Accurate Way to Evaluate RISC-V

Tuesday, August 25, 2020

• White House announces $1B investment for AI and quantum computing hubs
• Optical Processor Targets to Accelerate Compute for Next-Gen AI
• WISeKey to Establish WISeAI, a Joint Venture with German Artificial Intelligence Leader arago, Blending AI, IoT and Cybersecurity into a Trusted European Platform
• Samsung Display Demonstrates Most Advanced Display Hole for Smartphone Cameras
• Nvidia Data Center Growth: Could Buying Arm Be an Ideal Match?
• Cadence IC Packaging Reference Flow Certified for the Latest TSMC Advanced Packaging Solutions

Monday, August 24, 2020

• CXLâ„¢ Consortium and JEDEC® Sign MOU Agreement to Advance DRAM and Persistent Memory Technology
• Automotive Software Platforms: Current Status
• Huawei is hurrying to build a wafer fab
• GigaDevice launches the New GD32E5 Series of MCU's, marking a new milestone for high-performance computing based on the Arm Cortex-M33 core.
• Cadence Announces Availability of UltraLink D2D PHY IP on TSMC N7, N6 and N5 Processes
• Marvell and TSMC Collaborate to Deliver Industry's Most Advanced Data Infrastructure Portfolio on 5nm Technology
• Synopsys Collaborates with TSMC to Accelerate 3nm Innovation, Enabling Next-Generation SoC Design
• Analog Bits to Present Papers on Wafer-Scale Sensors and PCIe Clock Systems at TSMC 2020 Open Innovation Platform Ecosystem Forums
• TSMC Plots the Process Course to Its Next "Generational Node"
• TSMC Showcases Leading Technologies at Online Technology Symposium and OIP Ecosystem Forum
• Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows

Sunday, August 23, 2020

• Arm Flexible Access one year later: Accelerating innovation for more than 60 partners and counting
• Foundry Revenue Projected to Grow by 14% YoY in 3Q20
• Visit Moortec at the Virtual TSMC Technology Symposium & Open Innovation Platform Ecosystem Forum
• TrendForce Analyzes Impacts of Expanded U.S. Sanctions Against Huawei on Five Major Tech Industries
• Socionext and Osaka University Develop New Deep Learning Method for Object Detection in Low-Light Conditions
• Silicon Creations' Achieves ISO 9001 Certification for World-Class Silicon IP Development Process
• North American Semiconductor Equipment Industry Posts July 2020 Billings
• Sofics releases Analog I/O's and ESD clamps for TSMC N5 process
• Dolphin Design Releases its First Development Platform on TSMC 22ULL Process for Smart Home Applications
• Foundry Revenue Projected to Grow by 14% YoY in 3Q20 as Downstream Clients Exhibit Strong Demand, Says TrendForce

Wednesday, August 19, 2020

• Arm and DARPA Sign Partnership Agreement to Accelerate Technological Innovation
• Synopsys IC Validator, Running on AMD EPYC Processor Powered Azure Virtual Machines, Verifies AMD Radeon Pro VII GPU Design in Under Nine Hours
• OpenFive Enhances Differentiated IP Portfolio with Die-to-Die Interface Controllers for HPC and Chiplet Markets
• Subaru Selects Xilinx to Power New-Generation EyeSight System
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2020
• Electronics Supply Chains Splitting Between China and U.S.
• Clue Technologies adopts OneSpin's verification solution for avionic computing systems
• DRAM Capex Spending Expected to Decline 20% in 2020
• Synopsys Appoints Sassine Ghazi as Chief Operating Officer
• prpl Foundation Releases prplWRT Open-Source CPE Software

Tuesday, August 18, 2020

• Proof of concept security platform protects IoT and 5G private networks
• Alibaba XT910 RISC-V Core Faster Than Kirin 970 SoC; Threat To ARM?
• NSITEXE Adopts Synopsys HAPS Prototyping to Validate Data Flow Processor IP
• Moortec Provides In-Chip Sensing Fabrics on TSMC N6 Process Technology
• RIOS Laboratory and Imagination announce partnership to grow the RISC-V ecosystem
• US Tightens Chip Export Screws on Huawei
• CEVA's Wi-Fi 6 Solution Becomes World's First IP to Achieve Wi-Fi CERTIFIED 6 Status from the Wi-Fi Alliance
• Intel Looks to Regain Innovation Lead

Monday, August 17, 2020

• Samsung ramps up foundry business as manufacturer of IBM's 7nm CPU
• Mixel's Patented D-PHY RX+ IP Extends Market Share with Automotive Microcontrollers
• SiFive and Innovium Announce Collaboration to Accelerate Innovation in Data Center Networking
• Rianta Releases 800G MACsec ASIC/SoC IP Core for Next-Gen Data Center and 5G Backhaul Applications
• Semiconductor Industry Luminary Fred Weber Joins Movellus as Corporate Advisor
• S2C and Mirabilis Design Teamup to Deliver a Heterogeneous Solution for SoC Architecture Exploration and Verification
• The Landmark IPO of VeriSilicon (688521.SH) on Shanghai STAR Market
• Nuvoton Accelerates the Development of its MCU Designs with the Cadence Palladium Z1 Enterprise Emulation Platform