Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC Days 2020
IP-SoC Days 2019
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Login
Catalog of SIP Cores
System on Chip design resources
Catalog of SIP Cores
System on Chip design resources
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Design Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC Days 2020
IP-SoC Days 2019
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
Design Platform and Service
Processor
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
eFPGA / FPGA
Business
Monday, July 19, 2021
Where Will TSMC Be in 5 Years?
Agile Analog joins RISC-V International as a strategic member
A surprising new job for RERAM technology
European Commission forms processor, semiconductor alliance
CrossBar Announces ReRAM Based PUF Keys
GOWIN Semiconductor Announces their ISP (Image Signal Processor) IP Core and Solution
CAES Receives Contract from Vinnova to Advance High Performance RISC-V Space Computing
GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing
Sunday, July 18, 2021
$10m for French quantum carbon nanotube startup
TSMC in 'Due Diligence' on Possible Japan Fab
Chip Shortages May Persist Until 2023, Analysts Say
CXL Product Pipeline Gets Flowing
Precise-ITC 1.6T/800G/400G IP Product Series for Datacentre Application
Secure-IC establishes new references to secure the Internet of Things
Imperas updates Free reference model riscvOVPsimPlus with new RISC-V P (SIMD/DSP) extension and Architectural Validation Test Suites
Samsung Foundry and Synopsys Collaborate to Accelerate Time to ISO 26262 Compliance for Automotive SoCs
TSMC in "Due Diligence" on Possible Japan Fab
Intel in talks to buy Globalfoundries
Dolphin Design and CEA-List join forces for a new embedded AI computing platform
Wednesday, July 14, 2021
Electronic System Design Industry Logs Record First-Quarter Revenue Growth, ESD Alliance Reports
TSMC Reports Second Quarter EPS of NT$5.18
Is analog IC fab renaissance in the works?
Accellera Board Approves Security Annotation for Electronic Design Integration Standard 1.0 for Release
Xenergic Raises 40 MSEK In New Share Issue
Taiwan Maintains Edge as Largest Base for IC Wafer Capacity
Quantware Launches the World's First Commercially Available Superconducting Quantum Processors, Accelerating the Advent of the Quantum Computer.
Xilinx Versal HBM Series with Integrated High Bandwidth Memory Tackles Big Data Compute Challenges in the Network and Cloud
Weebit completes design and tape-out of embedded ReRAM module
Realtek selects Imagination GPU for use in DTV
Tuesday, July 13, 2021
Neuromorphic processor leader Innatera appoints Prof. Alberto Sangiovanni-Vincentelli Chairman of Board
Taiwan Maintains Lead in IC Wafer Capacity
Rethinking Automotive Electronics Networks
Innatera Unveils Neuromorphic AI Chip to Accelerate Spiking Networks
Russia To Build RISC-V Processors for Laptops: 8-core, 2 GHz, 12nm, 2025
Samsung Electronics May Apply 3-nm Process to Its Own Chips First
Monday, July 12, 2021
IEEE Adopts MIPI A-PHY, First Industry-Standard, Long-Reach SerDes Physical Layer Interface for Automotive Applications
RISC-V based XiangShan processor poses another threat to Intel
European startup ships first commercial quantum processor
China set to achieve 14 nm breakthrough in 2022
TSMC looks to 12nm Dresden fab
TTTech Aerospace releases the world's first 1 Gbit/s A664 End System IP certified to the highest civil aviation standards
IQ-Analog Adopts Diakopto's ParagonX Platform for Next-Generation 5G Wireless Communications ICs
Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs
Achronix and ACE Convergence Acquisition Corp Mutually Agree to Terminate Merger Agreement
Sunday, July 11, 2021
"Insolvent" Tsinghua Unigroup Aims to Restructure
Algolux Closes $18.4 Million Series B Round for Robust Computer Vision
Andes certifies Imperas RISC-V Reference Models for the new RISC-V P (SIMD/DSP) extension
Flexible fab could slash chip shortage
Thursday, July 8, 2021
TSMC to benefit from change in chip industry
TSMC June 2021 Revenue Report
Pim Tuyls: IoT Security, Technology Scaling, and Quantum Threats
Fraunhofer IPMS RISC-V processor core for functional safety supported by development tools from IAR Systems
Wednesday, July 7, 2021
Secure-IC receives the Cybersecurity Made in Europe label
Liverpool 5G Create and Blu Wireless develop industry-boosting IP
Another Industry first: Extreme Networking- 1K TCP & UDP Session on intel/Xilinx FPGAs, high availability application performance - 2U Accelerator box with Linux iWARP/RoCE
Faraday Succeeds in 5G NR mmWave ASIC
PUFsecurity Provides Free Access to its Root of Trust and Security Co-Processor Solutions
Previous
|
Next
Did you miss last D&R News Alerts ?