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Thursday, July 16, 2020
Nestwave wins Must Award in the category Most Innovative Startup
Innovative Advantage upgrades streams from HD to 4K in business jets with the intoPIX TICO RDD35 Technology
USB-IF Publishes USB Device Class Specification for MIDI Devices v2.0
CHIPS Alliance Announces AIB 2.0 Draft Specification to Accelerate Design of Open Source Chiplets
TSMC Raises Capital Expenditure Plan on Improved Outlook
Spin Memory Announces Extension of Series B Funding
Wednesday, July 15, 2020
Kandou Appoints Jeff Winzeler CFO
Menta Announces New Software Version and New Adaptive DSP at DAC 2020
Buying Avatar, Siemens Revives Legendary Place & Route Tool
EasyIC Design celebrates its 10th anniversary
Siemens acquires Avatar, expands EDA footprint with innovative Place and Route technology
1Q/4Q "Direction Indicator" Signals Rebound in the 2020 IC Market
Faraday Launches Ariel SoC Platform with Infineon's SONOS eFlash to Drive IoT Development
Customisable wireless medical sensor chip with machine learning accelerator enables mass market advanced medical and vital-sign monitors
Axiomise Announces the Release of the Next-Generation RISC-V App
TSMC Reports Second Quarter EPS of NT$4.66
Tuesday, July 14, 2020
Maxim Integrated Deal Cements Analog Devices at No 2 in Analog
Tenstorrent Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using Synopsys' Broad DesignWare IP Portfolio
British chip designer Graphcore unveils new AI processor more complex than Nvidia's
SATA-IO Increases Interoperability Features with Revision 3.5 Specification
How SMIC Can Keep Up With Advanced Process Technologies
Softbank Said to Have a Buyout Offer for Arm
Efinix Announces Trion Titanium Family
SMIC: Advanced Process Technologies and Gov't Funding
JEDEC Publishes New DDR5 Standard for Advancing Next-Generation High Performance Computing Systems
Dr. Walden Rhines Joins Cornami as President and CEO
Synopsys Announces Industry's First JEDEC DDR5 Verification IP for Next-Generation DRAM/DIMM Designs
Monday, July 13, 2020
Axiomise Announces the Release of the Next-Generation RISC-V® App
TSMC pushing to produce advanced chips using experimental design by 2023, 2024
Mixel MIPI D-PHY IP Integrated into the Perceive Ergo Edge Inference Processor
VITEC Licenses Codasip Bk5 Core for Multi-Purpose Use in Video Products
Sunday, July 12, 2020
TSMC's market cap continues record upswing after June sales report
Arm Research Selected for DARPA Secure Silicon Program
TSMC June 2020 Revenue Report
DMP releases AI Processor IP Core "ZIA DV740"
Analog Devices Announces Combination with Maxim Integrated, Strengthening Analog Semiconductor Leadership
DMP releases IP Core "ZIA ISP"
Flex Logix Announces EFLX eFPGA Emulation Models For The Cadence Palladium Z1 Platform
Mentor collaborates with Samsung Foundry to boost product yield and streamline in-fab memory testing
ESD Alliance Reports Electronic Design Automation Industry Revenue Growth for Q1 2020
Wednesday, July 8, 2020
Mirabilis Design announces the first Application-Specific University Program
UMC Reports Sales for June 2020
Tuesday, July 7, 2020
Low-Power FD-SOI FPGA Melds AI and Bridging
Wi-Fi 6 is Set to Change the Future of IoT–Here's Why
Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices
SiFive looks to foster worldwide network of RISC-V startups
Imagination announces XS, the automotive industry's most advanced GPU IP
SmartDV Broadens Support for Arm AMBA Protocol with Verification IP Solutions for AMBA CHI, CXS, LPI
Soitec announces POI substrates business agreement with Qualcomm Technologies for 5G RF filters
High Performance Channel Coding Solutions on Xilinx Zynq UltraScale+ RFSoC Devices
Synaptics to Acquire Rights to Broadcom's Wireless IoT Connectivity Business
Monday, July 6, 2020
The Value of Intellectual Capital
Arm intends to strengthen focus on core semiconductor IP business growth
Arm intends to strengthen focus on core semiconductor IP business growth
JLQ Technology Selects Synopsys DesignWare IP to Accelerate Development of Next-Generation SoCs
videantis processor platform adopted for TEMPO neuromorphic edge AI chip
Apple to Start Mass Producing Self-Designed Mac SoC, Projected to Cost under US$100, in 1H21, Says TrendForce
Imagination announces latest licensing deal with NXP
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