Search News

Sunday, July 5, 2020

• GUC Monthly Sales Report - June 2020
• Creonic joins partnership with the University of Bremen to expand the development of Artificial Intelligence
• Dolphin Design unveils the final piece of their platform offer with BAT, an audio solution for high quality AIoT applications
• Ingenic Semiconductor integrates Allegro DVT Encoding IP into Next-Generation Smart-Video System-On-Chip Solutions
• Phison appoints T2M-IP for global marketing, representation, and business development
• Global Semiconductor Sales Increase 5.8 Percent Year-to-Year in May; Annual Sales Projected to Increase 3.3 Percent in 2020, 6.2 Percent in 2021

Saturday, July 4, 2020

• China chipmaker SMIC to raise $6.55 billion in Shanghai share sale
• TSMC rebuffs Samsung challenge to chip foundry dominance

Thursday, July 2, 2020

• New GAA Nanosheet Architecture to Drive Silicon Performance

Wednesday, July 1, 2020

• Sigasi Introduces Software Development Kit for Electronic Design Automation Tools
• MediaTek Introduces Helio G35 & G25 Gaming Series Chipsets
• Green Hills Software Extends Multicore Interference Mitigation to Arm Cortex-A72 for DO-178C Level A Applications
• TSMC secures US govt subsidies and picks site for US$12b Arizona plant
• Aldec Adds Customizable Tool Qualification Data Package to ALINT-PRO for DO-254 Projects
• Appear TV introduces Zero-latency intoPIX JPEG XS technology in the X Platform
• Innosilicon multiple high-speed interface IPs, based on the SMIC 14nm process, R&D and mass production proven
• Innosilicon IP helps Ingenic T20 win "China Chip" Excellent Market Performance Product Award

Tuesday, June 30, 2020

• How your automotive display can meet ASIL-B, cold-crank specifications
• GloFo qualifies 12LP+ finfet process
• HiSilicon & Nowi Introduce Energy Autonomous NB-IoT Platform: a Power-free Solution in the Smallest Size Possible
• Hardent and PLC2 Announce New IP Partnership to Support German Semiconductor Companies
• Basemark and DMP Partner to Develop Smart Mirrors for commercial vehicles
• OPENEDGES Network-on-Chip Interconnect IP and DDR Controller Licensed for GCT Semiconductor LTE Category 19 Chip

Monday, June 29, 2020

• FPGAs to Replace GPUs in AI Accelerators
• Optimized for AI Accelerator Applications, GLOBALFOUNDRIES 12LP+ FinFET Solution Ready for Production

Sunday, June 28, 2020

• US approved 99% of TSMC's patents
• Huawei makes new chip supply deals with SMIC and Shanghai Microelectronics
• Dolphin unveils two break-through DSP and AI digital platforms dedicated to edge computing applications
• Synopsys and Arm Extend Strategic Partnership to Deliver Superior Full-Flow Quality-of-Results and Time-to-Results
• Palma Ceia SemiDesign Announces Sampling for PCS11ax28, New 802.11ax Transceiver
• Dialog Semiconductor Announces Completion of its Acquisition of Adesto Technologies

Thursday, June 25, 2020

• Elephant in Automated Vehicle Room
• Solving a Problem like Reuse - an FD-SOI Analog IP Perspective from Thalia
• Rockchip selects Ensigma iEW200 low-power Wi-Fi
• Intilop Delivers a Ready to Deploy, Four Thousand TCP/UDP Session 2U-Hardware Accelerator Box with Linux Kernel Bypass Drivers for Extreme-Performance Networking
• Synopsys Broadens Collaboration with EPFL

Wednesday, June 24, 2020

• Analysts believe that SMIC will not develop a process below 7/5nm
• VeriSilicon: FD-SOI & Design-Lite - A Beautiful Combination (CEO Interview)
• Macnica adopts intoPIX TICO-XS for its 4K ProAV OEM solutions
• Bamboo Systems Launches Next Generation Server
• Synopsys Awarded DARPA Contract for Automatic Implementation of Secure Silicon Program
• Percepio Closes Series A Funding Round with Fairpoint Capital
• Apple Moving Macs from Intel to Arm
• Taiwan Edges South Korea as Largest Base for IC Wafer Capacity
• Lattice Reinvents the Low Power, General-Purpose FPGA with New Certus-NX
• SMIC to come out stronger after pandemic–Sy-Coson

Tuesday, June 23, 2020

• IAR Systems delivers advanced trace for RISC-V based applications
• Xilinx Selects Mipsology Zebra Software to Accelerate Alveo U50 FPGA
• AI-based cybersecurity: Hype or reality?
• TSMC invested 300 R&D teams to assist Apple in developing Mac chips
• UMC Recognized for Excellence by Texas Instruments
• TSMC has reportedly begun production of the Snapdragon 875 SoC using the 5nm process
• T2M announces Industry's first Ultra Low-Power Bluetooth Dual Mode RF IP on TSMC 22nm.