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Monday, June 21, 2021

• Arm Strengthens Framework For IoT Microcontroller Applications
• TSMC to prioritize Apple and automaker silicon orders as global semiconductor shortage continues
• Diakopto Unleashes Breakthrough ParagonX EDA Tool, Platform and Methodology to Dramatically Accelerate IC Design Debugging and Optimization
• Alphawave IP Adopts Diakopto's ParagonX EDA Platform and Methodology
• Codasip Announces A71X RISC-V Application Core with Dual-Issue Capability
• SiFive Performance P550 Core Sets New Standard as Highest Performance RISC-V Processor IP
• GLOBALFOUNDRIES Breaks Ground on New Fab in Singapore
• Intrinsic ID QuiddiKey Hardware IP is Now CAVP Certified by NIST

Sunday, June 20, 2021

• GlobalFoundries Is A Leading-Edge Foundry Despite Claims Otherwise
• Socionext Licenses Flex Logix's Embedded FPGA (eFPGA) for 5G Wireless Base Station Platform
• Rebooting Imagination: A Heterogeneous Compute Strategy
• Synopsys to Acquire Semiconductor and Flat Panel Display Solutions from BISTel

Thursday, June 17, 2021

• Inverse-designed ultra-compact high efficiency and low crosstalk optical interconnect based on waveguide crossing and wavelength demultiplexer
• €8m project for Europe's first RISC-V supercomputer chip
• Quantum Processors: Pasqal Raises €25m, C12 Quantum Electronics €8.2m
• First Full-fledged Side Channel Attack on HMAC-SHA-2
• New Cadence Tensilica FloatingPoint DSP Family Delivers Scalable Performance for a Broad Range of Compute-Intensive Applications

Wednesday, June 16, 2021

• TSMC FINFLEXâ„¢, N2 Process Innovations Debut at 2022 North American Technology Symposium
• ST's Technological Innovations will Shape the Sustainable Future
• Spain Outlines Vision for Industrial AI
• Silex Insight's TRNG selected for MiG-V from HENSOLDT Cyber
• eFabless Joins the Open Source FPGA Foundation as Corporate Member
• Qualcomm, MediaTek Fill Vacuum HiSilicon Left in Smartphones
• Synopsys Replenishes Repurchase Authorization up to $500 Million
• SmartDV Joins the Xilinx Partner Program
• What Are the Quantum Computing Threats to Security?
• Advantest Developing Innovative Methodologies for High-Speed Scan and Software-Based Functional Testing
• Silicon IP Provider Chips&Media Launches AV1 Video Encoder Hardware IP for 4K/UHD Video Resolutions and Beyond
• Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets
• Rambus to Acquire AnalogX, Accelerating Next-Generation Data Center Interface Solutions
• CEA-Leti Collaborates with Siemens to Launch Process Design Kit that Supports Multiple Technologies, Simplifies Creation of Optical Circuits
• Market-Optimized 3nm Physical IP for Armv9-based CPUs
• Imec demoes integrated forksheet FETs for 2nm processes

Wednesday, June 16, 2021

• Rambus Initiates Accelerated Share Repurchase Program

Tuesday, June 15, 2021

• Linearization Technique of Low Power Opamps in CMOS FD-SOI Technologies
• Nonvolatile programmable silicon photonics using an ultralow-loss Sb2Se3 phase change material
• Pre- to Post-AI Transition to Be "Bigger Than the Internet"
• STMicroelectronics Delivers First Stellar Advanced Automotive Microcontrollers for New Road-Car Projects
• Rambus to Acquire PLDA, Extending Leadership with Cutting -Edge CXL and PCI Express Digital IP
• Rambus Advances New Era of Data Center Architecture with CXL Memory Interconnect Initiative
• Semiconductor R&D scorecard shows Europe, China up, Japan down
• Thalia Design Automation partners with Sofics to enhance offering for analog circuit and IP reuse
• Kalray Unveils its K200-LP Latest Acceleration Card for Data Centers
• IC Insights Raises Its 2021 Worldwide IC Market Forecast to +24%

Monday, June 14, 2021

• Updated: Toshiba Claims Breakthrough in Quantum Communication
• Germany Leads the Autonomous Vehicle Regulation Race
• TSMC plans to build new semiconductor plant in Japan, creates headaches for its rival Samsung Electronics
• Precise-ITC 800G_AX Ethernet IP Core Optimized for AI Application
• Graphcore and SiPearl: strategic partnership to combine artificial intelligence and high performance computing

Sunday, June 13, 2021

• LiDAR solution looks to address transportation infrastructure monitoring
• Semiconductor Industry: Interest Strengthening in RISC-V
• Cortus hopes to stake early RISC-V HPC claim
• IBM Versus GlobalFoundries: A Lawsuit Instead Of The Power Chips Planned
• IPO Arm, says Qualcomm boss, and we'll buy in
• Cortus Develops Next Generation High-End RISC-V CPU Core for HPC
• DisplayPort (DP, eDP) v1.4 Transmitter & Receiver PHY & Controller IP Cores for advanced SOC supporting 8K resolutions!
• SambaNova CEO: Pre- to Post-AI Transition Will Be "Bigger Than the Internet"
• GPU Market Headed for a Fall?

Friday, June 11, 2021

• Why Video Stabilization Needs to be More Flexible

Thursday, June 10, 2021

• Sequans Communications Adopts Cadence RF Solution to Develop Next-Generation 5G IoT Platform
• Truechip Announces Customer Shipment of PCIe Gen 6 Verification IP
• Intel said to have offered $2bn for SiFive
• Lattice and Infineon Technologies Collaborate to Deliver New Pictor Reference Design Kit
• sureCore & Intrinsic Announce Collaboration to Bring Novel RRAM Technology to Market

Wednesday, June 9, 2021

• SOI-Based Multi-Channel AWG with Fiber Bragg Grating Sensing Interrogation System
• Soitec unveils its strategy for 2026 and its target to triple its revenue
• Xilinx Extends Edge Compute Leadership with World's Highest AI Performance-per-Watt
• TSMC May 2021 Revenue Report
• Xilinx Acquires Silexica to Broaden its Developer Base
• Bosch opens wafer fab of the future in Dresden
• Hardent VESA DSC and FEC IP Cores Licensed by Kinetic Technologies
• Samsung Successfully Completes 8nm RF Solution Development to Strengthen 5G Communications Chip Solutions
• Global Semiconductor Sales Increase 1.9% Month-to-Month in April; Annual Sales Projected to Increase 19.7% in 2021, 8.8% in 2022
• Creonic to Offer End-to-end IP-over-Satellite Solutions
• Silex Insight launches the all-new VIPER (4K60 4:4:4 AV over IP transmitter/receiver board), ideal for collaboration featuring seamless switching between multiple inputs (2xHDMI/1xUSB-C)
• TSMC approves expansion budget of more than US$9 billion
• Siemens Enhances Nucleus ReadyStart for Arm Platforms