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Sunday, May 24, 2020
Do more with less energy! What's behind Dolphin Design's Energy Efficient Platforms?
China to Fall Far Short of its "Made-in-China 2025" Goal for IC Devices
Senators Seek Suspension of TSMC US Fab Project
Lattice sensAI 3.0 Solutions Stack Doubles Performance, Cuts Power Consumption in Half for Edge AI Applications
The TSMC and Huawei Announcements Are Not as Linked as You May Think
Thursday, May 21, 2020
China chipmaker SMIC receives $2bn state help amid Huawei ban
Gyrfalcon is Named as a Top 10 Processor for AI Acceleration at the Endpoint in 2020 by EE Times
Panasonic Adopts Synopsys Custom Design Platform to Accelerate Next-Generation Automotive and Industrial Products
North American Semiconductor Equipment Industry Posts April 2020 Billings
Wednesday, May 20, 2020
Faraday Succeeds in Next-Gen Display ASIC with Display IP Solutions
Fuji Xerox Adopts Synopsys ZeBu Server for Multi-Function Printer SoC
SimpleMachines selects UltraSoC embedded analytics to support next-generation compute platform
eMemory Provides Intellectual Property for Secure NB-IoT Products
CEO interview: The importance of being agile
Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization
S2C Announces New Prodigy Cloud System for Next Generation SoC Prototyping
Cobham Advanced Electronic Solutions Radiation Hardened Microelectronics Support New Xilinx XQRKU060 FPGA
Tuesday, May 19, 2020
Synopsys Posts Financial Results for Second Quarter Fiscal Year 2020
CEA-Leti Demos D-band RF Architecture for 6G Roadmap
Design For Narrowband IoT
Global IoT market to grow to $1.5trn annual revenue by 2030
Arrow Electronics, Panasonic Industry, and STMicroelectronics Join Forces to Deliver IoT Modules for Smart Applications
SMIC Caught Between Huawei And A Hard Place
TSMC US plant raises national security and competition questions, say senators
GLOBALFOUNDRIES to Implement ITAR and Strict Security Assurances at its Advanced U.S. Semiconductor Manufacturing Facility
Imagination receives ISO 26262 statement of process conformance from HORIBA MIRA
Politics Haunts TSMC's US Fab Plan
Mirabilis Design creates the first RISC-V system-level architecture exploration solution
Mirabilis Design creates the first RISC-V system-level architecture exploration solution
Tuesday, May 19, 2020
Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput
Monday, May 18, 2020
Huawei responds
Microsoft announces definitive agreement to acquire Metaswitch Networks, expanding approach to empower operators and partner with network equipment providers to deliver on promise of 5G
Cadence Delivers 10 New Verification IP Targeting Automotive, Hyperscale Data Center and Mobile Applications
SiFive Partners With Coherent Logix for Mission-Critical Processor Solutions
CXL Protocol Adds Capabilities over PCIe
Arteris IP FlexNoC Interconnect and AI Package Licensed by Blue Ocean Smart System for AI Chips
Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Vision Solutions
Xilinx "Lifts Off" with Launch of Industry's First 20nm Space-Grade FPGA for Satellite and Space Applications
Sunday, May 17, 2020
Who Needs Autonomous Vehicles?
TSMC Ariz Fab a Tangled Web
UltraSoC appoints Jonathan Lucas as VP of Software
LeapMind Unveils "Efficiera", the New Ultra Low Power AI Inference Accelerator IP
Cadence Expands Design IP Portfolio with 56G Long-Reach PAM4 SerDes on TSMC N7 and N6 Processes
Synopsys and TSMC Collaborate to Enable Designs of HPC, Mobile, 5G, and AI SoCs with Certified Solutions on TSMC N5 and N6 Processes
Mentor's Calibre and Analog FastSPICE platforms achieve certification for TSMC's newest processes
Thursday, May 14, 2020
TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States
EVS Media Infrastructure adopts intoPIX JPEG-XS solution for Neuron
Aspinity and Infineon partner to accelerate development of intelligent sensing products with longer lasting batteries
Wednesday, May 13, 2020
Veriest supports the development of Arbe's innovative automotive Radar device
CAST Releases 100Gbps UDP/IP Core
Prophesee, DMP partner to accelerate development of embedded machine vision and artificial intelligence (AI) applications using Event-Based Vision approach
CHIP Alliance's Newly Enhanced SweRV Cores Available to All for Free
Louis Tannyeres, Former Senior Fellow at Texas Instruments, Appointed Executive Vice-President of Engineering at Kalray
Tuesday, May 12, 2020
SMIC Reports 2020 First Quarter Results.
Associations collaborate on open standards in IoT security
Design Of An Ultra-Low-Power Current Steering DAC In A Modern SOI technology
TSMC Says it Still Won't Build a Fab in the US
Foxconn Partners with Socionext and Hailo to Launch Next-Generation AI Processing Solution for Video Analytics at the "Edge"
Arm hardware and software ecosystems will converge at virtual Arm DevSummit, formerly known as Arm TechCon
GigaDevice Announces a Patent Licensing Agreement with Rambus
OpenFabrics Alliance (OFA) and Gen-Z Consortium Announce MoU Agreement
Eta Compute Partners with Edge Impulse to Accelerate the Development and Deployment of Machine Learning at the Edge
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