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Monday, May 10, 2021

• Achronix Goes Head-to-Head
• UMC to Expand 300mm Fab Capacity in Tainan
• Semiconductor Market Forecast to Reach $522B in 2021
• South Korea Losing Competitiveness in Semiconductor Industry
• Shaping the Scene for Vision Standardization
• BrainChip Demonstrates Akida Neuromorphic Processor as Part of Data Science Week
• Mythic Raises $70 Million in Series C Funding Led by BlackRock and Hewlett Packard Enterprise
• Silex Insight extends their AES-GCM Crypto Engine offering by introducing an ultra-low latency version for PCI Express 5.0 and Compute Express Link 2.0
• Dialog Semiconductor Selected as SiFive Preferred Power Management Partner for RISC-V Development Platforms

Sunday, May 9, 2021

• SensiML Launches Open Source Initiative to Drive TinyML Implementations for Smart IoT Applications
• TSMC April sales down over 13% from March
• MIPI Alliance releases automotive specifications
• Lattice and Rambus to Partner on Next-gen Security Solutions
• OpenPOWER Foundation announces LibreBMC, a POWER-based, fully open-source BMC
• NeuReality unveils novel AI-centric platform to empower the growth of real-life AI applications
• Synopsys ZeBu Server 4 Adopted by Xsight Labs for Intelligent Networking Switch Processor
• AEDVICES Consulting set up a new organization to boost its growth
• TSMC April 2021 Revenue Report
• CEVA, Inc. Announces First Quarter 2021 Financial Results
• CEVA to Acquire Intrinsix Corp, Expanding its Offering to Include Full Turnkey IP Platforms
• Sondrel's latest reference IP platform enables ultra-powerful signal and data processing SoCs to be created faster for lower costs
• IBM Unveils World's First 2 nm Chip

Thursday, May 6, 2021

• GlobalFoundries Sharpens Photonics Edge for Quantum Manufacturing

Wednesday, May 5, 2021

• CCSDS 231.0-B-3 LDPC Encoder and Decoder IP Core from Creonic Now Available
• UMC Reports Sales for April 2021
• CEVA's Bluetooth Dual Mode 5.2 Platform Achieves SIG Qualification, Expedites IC Design for TWS Earbuds and More

Tuesday, May 4, 2021

• TSMC prioritizes automotive chip supply to ease shortage
• PsiQuantum and GLOBALFOUNDRIES to Build the World's First Full-scale Quantum Computer
• Synopsys Delivers Enhanced Memory Design Productivity to Nanya Technology
• Cadence Wins Four 2020 Samsung Foundry SAFE EDA Awards
• Achronix Announces First Quarter 2021 Financial Results and Business Highlights
• Synopsys Completes Acquisition of MorethanIP
• Karen Rogge Joins Rambus Board of Directors
• Lattice Semiconductor Reports First Quarter 2021 Results
• Xilinx Reports Fiscal Fourth Quarter and Fiscal Year 2021 Results
• OmniVision Reduces Automotive Camera Design Complexity with the New, High-Performance OAX4000 ASIC Image Signal Processor
• GUC Monthly Sales Report - Apr 2021

Monday, May 3, 2021

• Intel to put $3.5bn into packaging
• NovaceneAI and CMC Microsystems deliver quantum computing to biz users
• Arm v9, the Next 10 Years
• MIPI Alliance Releases Specifications to Streamline Integration of In-Vehicle Displays, Add Functional Safety to Display Data Streams
• Synopsys to Showcase New Application Security Orchestration Solution at RSA Conference
• Esperanto Technologies Adopts Movellus Maestro AI, Intelligent Clock Networks for Its ET-SoC-1 Chip
• Rambus Reports First Quarter 2021 Financial Results
• Samsung Expected to Recapture #1 Semi Supplier Ranking in 2Q21
• SmartDV Unveils Automation Tool Suite for Use with Its Extensive Verification IP Portfolio

Sunday, May 2, 2021

• Scaleable RISC-V module for distributed AI processing
• UMC taps customers for $3.5bn fab expansion
• The Future of FPGAs
• Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports
• Faraday Reports First Quarter 2021 Revenues at NT$1,535 Million
• PathPartner Joins BlackBerry QNX Channel Partner Program to Deliver Safety-Critical and Secure Software Solutions for Automotive Industry
• BLE/15.4 2.4GHz+Sub-GHz Multi-Protocol RF Transceiver Phy KGD & IP for adding wireless Connectivity to "any MCU/SoC"
• Q1 Global Semiconductor Sales Increase 3.6% Over Previous Quarter
• Flex Logix And The Air Force Research Laboratory Sign A Broad License To Use EFLX Embedded FPGA IP In GLOBALFOUNDRIES' 12LP And 12LP+ Processes
• FPGAs in the Storm

Thursday, April 29, 2021

• Intel CEO Pat Gelsinger Seeks Support for EU Foundries
• China on way to self reliance in 28-nm chips; to attain maturity in 14-mm category as well
• Thalia Design Automation successfully delivers voltage regulator in a 22nm process node with 45% reduction in design time using its AMALIA software

Wednesday, April 28, 2021

• EnSilica Mixed Signal ASIC is PPAP Approved for Luxury Hybrid Car
• RISC-V International Welcomes Chengwei Capital as a Premier Member
• SiFive and Samsung Foundry Extend Partnership to Accelerate AI SoC Development
• CEVA Lauded by Frost & Sullivan for Addressing the Challenges of Connected Devices with Its Smart Sensing MotionEngine Software
• Fabless Suppliers Held a Record 33% of the 2020 IC Market
• Global Unichip Corporation Deploys Cadence Clarity 3D Solver to Achieve 5X Speedup of Systems Analysis for 112G Long-Reach Network Switch